Telecommunication wiring; Installation of computer networking hardware; Installation of security systems; Installation of audiovisual equipment; Installation, maintenance and repair of computer network and information technology equipment; Installation, maintenance and repair of telecommunications equipment; Installation of cables for Internet access

SUBSTRATES FOR SEMI-CONDUCTORS; GLAZED SUBSTRATES FOR THERMAL PRINTER HEADS; POLYIMIDE THIN FILM MULTILAYER SUBSTRATES FOR SEMI-CONDUCTORS; INTEGRATED CIRCUIT PACKAGES FOR SEMI-CONDUCTORS; CHIP PACKAGES; CRYSTAL RESONATOR SAW (SURFACE ACOUSTIC WAVE) FILTER PACKAGE; LEADLESS CHIP CARRIERS; INTERPOSERS FOR SEMI-CONDUCTORS; PRINTED CIRCUIT BOARDS; FLEXIBLE PRINTED CIRCUIT BOARDS; PRINTED WIRING BOARDS; PIN GRID ARRAY CHIP PACKAGES; BALL GRID ARRAY CHIP PACKAGES; ALUMINUM NITRIDE PRODUCTS, NAMELY...