FPPTH
Substrates incorporating semiconductors; glazed substrates incorporating into thermal printer heads; polyimide thin film multilayer substrates incorporating semiconductors; integrated circuit packages for semiconductors; semiconductor chip packages; electronic device packages used for crystal resonator or SAW, or Surface Acoustic Wave, filter as parts of telecommunication apparatus; leadless chip carriers; interposers for semiconductors; printed circuit boards; flexible printed circuit boards...
Cancelled · September 22, 2004 · 78487837 ·