[ PLASTICS ADDITIVES, IN PARTICULAR POLYMER BONDED NANOFIBER MASTER BATCHES AND COMPOUNDS FOR REINFORCEMENT IN COMPOSITE MATERIALS FOR MECHANICAL, ELECTRICAL AND THERMAL USE; THERMALLY CONDUCTING ADHESIVES ALSO IN THE FORM OF PASTES; THE FOREGOING ALL FOR USE IN MANUFACTURING IN THE AUTOMOTIVE, AEROSPACE, MEDICAL, AND ELECTRONICS INDUSTRY, FOR USE IN ENVIRONMENTAL TECHNOLOGY AND FOR USE IN MAJOR APPLIANCES ]

[ PLASTICS ADDITIVES, IN PARTICULAR POLYMER BONDED NANOFIBER MASTER BATCHES AND COMPOUNDS FOR REINFORCEMENT IN COMPOSITE MATERIALS FOR MECHANICAL, ELECTRICAL AND THERMAL USE; THERMALLY CONDUCTING ADHESIVES ALSO IN THE FORM OF PASTES; THE FOREGOING ALL FOR USE IN MANUFACTURING IN THE AUTOMOTIVE, AEROSPACE, MEDICAL, AND ELECTRONICS INDUSTRY, FOR USE IN ENVIRONMENTAL TECHNOLOGY AND FOR USE IN MAJOR APPLIANCES ]

THERMOSTATS AND HERMETIC GLASS-TO-METAL SEALS

THERMAL DEVICES AND COMPONENTS EMPLOYED TO DISSIPATE OR MEASURE HEAT, NAMELY, HERMETIC GLASS-TO-METAL PACKAGES TO ENCAPSULATE ELECTRONIC COMPONENTS, DIRECT BONDED COPPER SUBSTRATES AND HEAT SINKS TO SUPPORT ELECTRONIC COMPUTER COMPONENTS, AND THERMOSTATS TO CONTROL OVER-HEATING IN SMALL AND MAJOR APPLIANCES, AND OXYGEN AND HUMIDITY ELECTRONIC SENSORS FOR COMBUSTION CONTROL

THERMAL DEVICES AND COMPONENTS EMPLOYED TO DISSIPATE OR MEASURE HEAT, NAMELY, HERMETIC GLASS-TO-METAL PACKAGES TO ENCAPSULATE ELECTRONIC COMPONENTS, DIRECT BONDED COPPER SUBSTRATES AND HEAT SINKS TO SUPPORT ELECTRONIC COMPUTER COMPONENTS, AND THERMOSTATS TO CONTROL OVER-HEATING IN SMALL AND MAJOR APPLIANCES, AND OXYGEN AND HUMIDITY ELECTRONIC SENSORS FOR COMBUSTION CONTROL

Hermetic glass-to-metal packages to encapsulate electronic components Direct bonded copper substrates and heat sinks to support electronic components Thermostats to control over-heating of small and major appliances Oxygen and humidity sensors for medical applications and combustion control