Printed circuit boards; chip scale packaging, namely, semiconductor packaging for manufacturers of semiconductors and electronic components, systems and devices utilizing semiconductors comprising dies, substrates, interposers, wire bond and solder bumps, circuitized lead frames and circuit boards used to protect integrated circuits from contaminants, moisture, and mechanical damage and to provide for electrical connections to and from the integrated circuits

Non-metal doors, namely, wood doors with a veneer or plastic covering

Lead lined wood door with lead located on both sides of the core under each door skin.

Printed circuit boards; and chip scale packaging, namely, semiconductor packaging for manufacturers of semiconductors and electronic components, systems and devices utilizing semiconductors, namely, dies, substrates, interposers, wire bond and solder bumps, circuitized lead frames and circuit boards used to protect integrated circuits from contaminants, moisture, and mechanical damage and to provide for electrical connections to and from the integrated circuits