COOLSEM
Material processing on wafers, semiconductors and optical components, including the application of thin-film layers; semiconductor wafer processing; semiconductor encapsulation; applying a thin film layer to optical components; machining of electronic components to optimize heat dissipation and performance; applying thermally conductive or heat-dissipating layers to electronic components; material processing, namely substrate separation and removal of electronic or optoelectronic components; ...
Pending · December 18, 2025 · 79443945 ·