Conductive substrate for flexible printed circuit board; flexible copper clad laminate composed of insulation layers and copper foils used for flex circuits, flex wiring, chips on film substrate, chips scale packaging, ball grid array, tape automatic burning, Thin Film Transistor (TFT) LCD IC packaging, and Plasma Display Panels (PDP) IC packaging; semiconductor; computer interface card; micro-integrated circuits; integrated circuits; printer for use with computer; computer disc drive; micro-...