IMAP Trademark

Trademark Overview

On Monday, June 21, 2004, a trademark application was filed for IMAP with the United States Patent and Trademark Office. The USPTO has given the IMAP trademark a serial number of 78438825. The federal status of this trademark filing is REGISTERED AND RENEWED as of Thursday, April 30, 2020. This trademark is owned by Applied Materials, Inc.. The IMAP trademark is filed in the Machinery Products category with the following description:

Machines for the processing and production of semiconductor substrates, thin films, silicon discs and wafers, namely, semiconductor wafer processing machines for semiconductor substrates, thin films, silicon discs, and semiconductor wafer polishing and cleaning machines
imap

General Information

Serial Number78438825
Word MarkIMAP
Filing DateMonday, June 21, 2004
Status800 - REGISTERED AND RENEWED
Status DateThursday, April 30, 2020
Registration Number3677827
Registration DateTuesday, September 1, 2009
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, March 21, 2006

Trademark Statements

Goods and ServicesMachines for the processing and production of semiconductor substrates, thin films, silicon discs and wafers, namely, semiconductor wafer processing machines for semiconductor substrates, thin films, silicon discs, and semiconductor wafer polishing and cleaning machines
Pseudo MarkI MAP

Classification Information

International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 031, 034, 035
Class Status Code6 - Active
Class Status DateMonday, June 28, 2004
Primary Code007
First Use Anywhere DateSunday, May 31, 2009
First Use In Commerce DateSunday, May 31, 2009

Trademark Owner History

Party NameApplied Materials, Inc.
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressSanta Clara, CA 95052
Party NameApplied Materials, Inc.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressSanta Clara, CA 95052
Party NameApplied Materials, Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressSanta Clara, CA 95052

Trademark Events

Event DateEvent Description
Thursday, April 30, 2020NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
Thursday, April 30, 2020REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS)
Thursday, April 30, 2020REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
Thursday, April 30, 2020CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Thursday, February 27, 2020TEAS SECTION 8 & 9 RECEIVED
Saturday, September 1, 2018COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
Thursday, June 29, 2017ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Thursday, June 29, 2017TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Saturday, September 20, 2014NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED
Saturday, September 20, 2014REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
Saturday, September 20, 2014CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Thursday, September 11, 2014TEAS SECTION 8 & 15 RECEIVED
Tuesday, September 1, 2009REGISTERED-PRINCIPAL REGISTER
Friday, July 24, 2009LAW OFFICE REGISTRATION REVIEW COMPLETED
Friday, July 24, 2009ASSIGNED TO LIE
Thursday, July 16, 2009ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
Monday, June 15, 2009STATEMENT OF USE PROCESSING COMPLETE
Friday, June 12, 2009USE AMENDMENT FILED
Friday, June 12, 2009PAPER RECEIVED
Friday, December 19, 2008EXTENSION 5 GRANTED
Monday, December 8, 2008EXTENSION 5 FILED
Friday, December 19, 2008CASE ASSIGNED TO INTENT TO USE PARALEGAL
Monday, December 8, 2008TEAS EXTENSION RECEIVED
Friday, June 13, 2008EXTENSION 4 GRANTED
Tuesday, June 10, 2008EXTENSION 4 FILED
Tuesday, June 10, 2008TEAS EXTENSION RECEIVED
Thursday, January 3, 2008EXTENSION 3 GRANTED
Thursday, December 6, 2007EXTENSION 3 FILED
Thursday, December 6, 2007TEAS EXTENSION RECEIVED
Wednesday, August 29, 2007EXTENSION 2 GRANTED
Wednesday, June 6, 2007EXTENSION 2 FILED
Wednesday, June 6, 2007TEAS EXTENSION RECEIVED
Tuesday, January 30, 2007EXTENSION 1 GRANTED
Tuesday, December 5, 2006EXTENSION 1 FILED
Tuesday, December 5, 2006TEAS EXTENSION RECEIVED
Tuesday, June 13, 2006NOA MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, March 21, 2006PUBLISHED FOR OPPOSITION
Wednesday, March 1, 2006NOTICE OF PUBLICATION
Thursday, February 9, 2006ASSIGNED TO EXAMINER
Tuesday, February 7, 2006LAW OFFICE PUBLICATION REVIEW COMPLETED
Friday, February 3, 2006ASSIGNED TO LIE
Monday, January 23, 2006APPROVED FOR PUB - PRINCIPAL REGISTER
Wednesday, January 11, 2006AMENDMENT FROM APPLICANT ENTERED
Wednesday, December 21, 2005CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, December 21, 2005PAPER RECEIVED
Wednesday, July 13, 2005FINAL REFUSAL MAILED
Tuesday, July 12, 2005FINAL REFUSAL WRITTEN
Tuesday, July 12, 2005AMENDMENT FROM APPLICANT ENTERED
Wednesday, June 22, 2005CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, June 22, 2005PAPER RECEIVED
Tuesday, February 1, 2005NON-FINAL ACTION MAILED
Monday, January 31, 2005NON-FINAL ACTION WRITTEN
Tuesday, January 25, 2005ASSIGNED TO EXAMINER
Monday, June 28, 2004NEW APPLICATION ENTERED IN TRAM

Related Keywords

imap semiconductor machines silicon discs wafer films thin processing substrates polishing