| Serial Number | 98605923 |
| Word Mark | HYPERGAUGE |
| Filing Date | Tuesday, June 18, 2024 |
| Status | 630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER |
| Status Date | Tuesday, June 18, 2024 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | NOT AVAILABLE |
| Goods and Services | Optical thickness measuring instrument and their parts and fittings; in-plane thin film thickness measuring instrument and their parts and fittings; optical thickness gauges; precision measuring apparatus for measuring film thickness; semiconductor testing apparatus; in-plane thin film thickness measuring instrument for inspection of semiconductor and electronic devices; downloadable and recorded data processing software for in-plane thin film thickness measuring; data processing apparatus for in-plane thin film thickness measuring |
| International Class | 009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus. |
| US Class Codes | 021, 023, 026, 036, 038 |
| Class Status Code | 6 - Active |
| Class Status Date | Tuesday, June 18, 2024 |
| Primary Code | 009 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | HAMAMATSU PHOTONICS K.K. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 99 - Other |
| Address | Hamamatsu-shi,Shizuoka 435-8558 JP |
| Event Date | Event Description |
| Tuesday, June 18, 2024 | NEW APPLICATION ENTERED |