| Serial Number | 99908423 |
| Word Mark | HUELAB |
| Filing Date | Friday, June 26, 2026 |
| Status | 630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER |
| Status Date | Friday, June 26, 2026 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 3 - Illustration: Drawing or design which also includes word(s) / letter(s) / number(s) |
| Published for Opposition Date | NOT AVAILABLE |
| Indication of Colors claimed | Color is not claimed as a feature of the mark. |
| Pseudo Mark | HUE LAB |
| Description of Mark | The mark consists of a stylized design resembling the letter 'h' composed of four parallel vertical lines forming the stem and four concentric curved lines forming the arch. Below this design is the stylized wording 'HUELAB'. |
| Pseudo Mark | HUE LABORATORY |
| Goods and Services | Semi-worked thermoplastic filaments used for 3D printing; Semi-worked PLA (polylactic acid) filaments for use in 3D printing; Semi-worked ABS (acrylonitrile butadiene styrene) filaments for use in 3D printing; Plastic substances, semi-processed; Semi-processed acrylic resins; Semi-processed resins; Semi-processed plastics; Semi-worked ABS filaments for use in 3D printing; Plastic filaments for 3D printing; Semi-worked PLA filaments for use in 3D printing |
| International Class | 017 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal. |
| US Class Codes | 001, 005, 012, 013, 035, 050 |
| Class Status Code | 6 - Active |
| Class Status Date | Friday, June 26, 2026 |
| Primary Code | 017 |
| First Use Anywhere Date | Saturday, May 9, 2026 |
| First Use In Commerce Date | Saturday, May 9, 2026 |
| Party Name | Zhongshan Huili Zengcai Technology Co., Ltd. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 99 - Other |
| Address | Nantou Town, Zhongshan 528000 CN |
| Event Date | Event Description |
| Friday, June 26, 2026 | NEW APPLICATION ENTERED |
| Friday, June 26, 2026 | APPLICATION FILING RECEIPT MAILED |