HSP Trademark

Trademark Overview


On Wednesday, August 11, 2021, a trademark application was filed for HSP with the United States Patent and Trademark Office. The USPTO has given the HSP trademark a serial number of 90877083. The federal status of this trademark filing is FOURTH EXTENSION - GRANTED as of Monday, July 29, 2024. This trademark is owned by TAIYO HOLDINGS CO., LTD.. The HSP trademark is filed in the Chemical Products, Paint Products, and Rubber Products categories with the following description:

Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing electronic components; insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for sealing electronic components; insulating resin materials for interlayer dielectric materials in the form of dry film for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the f...

Dyes for general industrial use; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks for use in the process of producing electronic components; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink

Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; etching resist; photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; dry films for electronic components; photosensitive resists in the form of film for sealing electronic components; insulation dry films for electronic components; thermal curing type dry films for electronic components; che...
hsp

General Information


Serial Number90877083
Word MarkHSP
Filing DateWednesday, August 11, 2021
Status733 - FOURTH EXTENSION - GRANTED
Status DateMonday, July 29, 2024
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, July 26, 2022

Trademark Statements


Goods and ServicesElectrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing electronic components; insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for sealing electronic components; insulating resin materials for interlayer dielectric materials in the form of dry film for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the form of dry film for sealing electronic components; insulating coating materials for use in the process of producing printed circuit boards; insulating coating materials for use in the process of producing display panels; insulating coating materials for protecting copper foil on the surface of printed circuit boards; insulating coating materials for use in the process of producing package application boards; insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, insulating materials for protecting copper foil used with holes of printed circuit boards; insulating materials for sealing electronic components; insulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics; thermally conductive insulating resin materials for electronic components; insulating materials; electrical insulating materials
Goods and ServicesDyes for general industrial use; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks for use in the process of producing electronic components; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink
Goods and ServicesChemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; etching resist; photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; dry films for electronic components; photosensitive resists in the form of film for sealing electronic components; insulation dry films for electronic components; thermal curing type dry films for electronic components; chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; heat resisting materials, namely, heat resisting unprocessed artificial resin for electronic components; chemical preparations for industrial purposes; industrial chemicals; glue and adhesives for industrial purposes; chemical preparations, namely, thermal interface materials for electronic components for use as a filler to enhance the thermal conductivity between components

Classification Information


International Class001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
US Class Codes001, 005, 006, 010, 026, 046
Class Status Code6 - Active
Class Status DateSaturday, October 2, 2021
Primary Code001
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class002 - Paints, varnishes, lacquers; preservatives against rust and against deterioration of wood; colorants; mordants; raw natural resins; metals in foil and powder form for painters, decorators, printers and artists.
US Class Codes006, 011, 016
Class Status Code6 - Active
Class Status DateSaturday, October 2, 2021
Primary Code002
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class017 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal.
US Class Codes001, 005, 012, 013, 035, 050
Class Status Code6 - Active
Class Status DateSaturday, October 2, 2021
Primary Code017
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameTAIYO HOLDINGS CO., LTD.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressSaitama 355-0222
JP

Party NameTAIYO HOLDINGS CO., LTD.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressSaitama 355-0222
JP

Trademark Events


Event DateEvent Description
Saturday, August 14, 2021NEW APPLICATION ENTERED
Friday, September 3, 2021TEAS VOLUNTARY AMENDMENT RECEIVED
Tuesday, November 9, 2021TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Tuesday, November 9, 2021TEAS CHANGE OF CORRESPONDENCE RECEIVED
Saturday, October 2, 2021NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Thursday, October 7, 2021ASSIGNED TO LIE
Friday, October 8, 2021PRELIMINARY/VOLUNTARY AMENDMENT - ENTERED
Tuesday, November 9, 2021ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Tuesday, November 9, 2021TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS
Wednesday, May 11, 2022ASSIGNED TO EXAMINER
Thursday, May 19, 2022NON-FINAL ACTION E-MAILED
Thursday, May 19, 2022NOTIFICATION OF NON-FINAL ACTION E-MAILED
Thursday, June 9, 2022TEAS/EMAIL CORRESPONDENCE ENTERED
Thursday, May 19, 2022NON-FINAL ACTION WRITTEN
Thursday, June 9, 2022TEAS RESPONSE TO OFFICE ACTION RECEIVED
Thursday, June 9, 2022CORRESPONDENCE RECEIVED IN LAW OFFICE
Friday, June 17, 2022APPROVED FOR PUB - PRINCIPAL REGISTER
Tuesday, July 26, 2022PUBLISHED FOR OPPOSITION
Wednesday, July 6, 2022NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Tuesday, July 26, 2022OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Tuesday, September 20, 2022NOA E-MAILED - SOU REQUIRED FROM APPLICANT
Friday, October 7, 2022SOU TEAS EXTENSION RECEIVED
Friday, October 7, 2022SOU EXTENSION 1 FILED
Friday, October 7, 2022SOU EXTENSION 1 GRANTED
Tuesday, October 11, 2022NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Wednesday, July 26, 2023SOU TEAS EXTENSION RECEIVED
Wednesday, July 26, 2023SOU EXTENSION 2 FILED
Wednesday, July 26, 2023SOU EXTENSION 2 GRANTED
Thursday, February 1, 2024SOU EXTENSION 3 FILED
Monday, July 29, 2024SOU TEAS EXTENSION RECEIVED
Monday, July 29, 2024NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Monday, July 29, 2024SOU EXTENSION 4 FILED
Monday, July 29, 2024SOU EXTENSION 4 GRANTED
Friday, July 28, 2023NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Tuesday, January 2, 2024ASSIGNED TO EXAMINER
Thursday, February 1, 2024SOU TEAS EXTENSION RECEIVED
Thursday, February 1, 2024SOU EXTENSION 3 GRANTED
Saturday, February 3, 2024NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Tuesday, January 7, 2025SOU TEAS EXTENSION RECEIVED