HPLMAX Trademark

Trademark Overview

On Wednesday, December 1, 2021, a trademark application was filed for HPLMAX with the United States Patent and Trademark Office. The USPTO has given the HPLMAX trademark a serial number of 97150372. The federal status of this trademark filing is THIRD EXTENSION - GRANTED as of Monday, June 3, 2024. This trademark is owned by Kulicke and Soffa Industries, Inc.. The HPLMAX trademark is filed in the Machinery Products category with the following description:

Machine parts, namely, dicing blades for dicing or singulation of semiconductor wafers and substrates
hplmax

General Information

Serial Number97150372
Word MarkHPLMAX
Filing DateWednesday, December 1, 2021
Status732 - THIRD EXTENSION - GRANTED
Status DateMonday, June 3, 2024
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, October 18, 2022

Trademark Statements

Goods and ServicesMachine parts, namely, dicing blades for dicing or singulation of semiconductor wafers and substrates

Classification Information

International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 024, 031, 034, 035
Class Status Code6 - Active
Class Status DateMonday, December 6, 2021
Primary Code007
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History

Party NameKulicke and Soffa Industries, Inc.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressFort Washington, PA 19034
Party NameKulicke and Soffa Industries, Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressFort Washington, PA 19034

Trademark Events

Event DateEvent Description
Saturday, December 4, 2021NEW APPLICATION ENTERED
Monday, December 6, 2021NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Sunday, September 11, 2022ASSIGNED TO EXAMINER
Tuesday, September 13, 2022EXAMINERS AMENDMENT -WRITTEN
Tuesday, September 13, 2022EXAMINERS AMENDMENT E-MAILED
Tuesday, September 13, 2022NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
Tuesday, September 13, 2022EXAMINER'S AMENDMENT ENTERED
Tuesday, September 13, 2022APPROVED FOR PUB - PRINCIPAL REGISTER
Wednesday, September 28, 2022NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Tuesday, October 18, 2022PUBLISHED FOR OPPOSITION
Tuesday, October 18, 2022OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Tuesday, December 13, 2022NOA E-MAILED - SOU REQUIRED FROM APPLICANT
Friday, June 2, 2023SOU TEAS EXTENSION RECEIVED
Friday, June 2, 2023SOU EXTENSION 1 FILED
Friday, June 2, 2023SOU EXTENSION 1 GRANTED
Tuesday, June 6, 2023NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Tuesday, December 12, 2023SOU TEAS EXTENSION RECEIVED
Tuesday, December 12, 2023SOU EXTENSION 2 FILED
Tuesday, December 12, 2023SOU EXTENSION 2 GRANTED
Thursday, December 14, 2023NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Monday, June 3, 2024SOU TEAS EXTENSION RECEIVED
Monday, June 3, 2024SOU EXTENSION 3 GRANTED
Monday, June 3, 2024SOU EXTENSION 3 FILED
Thursday, June 13, 2024NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED

Related Keywords

hplmax dicing semiconductor wafers substrates singulation blades parts namely machine