HITECH Trademark

Trademark Overview


On Wednesday, December 19, 2018, a trademark application was filed for HITECH with the United States Patent and Trademark Office. The USPTO has given the HITECH trademark a serial number of 88235684. The federal status of this trademark filing is ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE as of Wednesday, June 10, 2020. This trademark is owned by Alpha Assembly Solutions Inc.. The HITECH trademark is filed in the Chemical Products category with the following description:

adhesives for use in electronics industry; non-conductive adhesives for use in electronics industry; unprocessed epoxy resins for use in electronics industry; industrial adhesives used in the assembly, maintenance and repair of electronics for use in electronics industry; fillers for use with electronic components, namely, unprocessed epoxy resins for use as underfill; unprocessed epoxy resins; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, and unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industry; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, and unprocessed epoxy resins for use in the electronics industry
hitech

General Information


Serial Number88235684
Word MarkHITECH
Filing DateWednesday, December 19, 2018
Status602 - ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE
Status DateWednesday, June 10, 2020
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and Servicesadhesives for use in electronics industry; non-conductive adhesives for use in electronics industry; unprocessed epoxy resins for use in electronics industry; industrial adhesives used in the assembly, maintenance and repair of electronics for use in electronics industry; fillers for use with electronic components, namely, unprocessed epoxy resins for use as underfill; unprocessed epoxy resins; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, and unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industry; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, and unprocessed epoxy resins for use in the electronics industry
Pseudo MarkHI TECH

Classification Information


International Class001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
US Class Codes001, 005, 006, 010, 026, 046
Class Status Code6 - Active
Class Status DateSunday, January 13, 2019
Primary Code001
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameAlpha Assembly Solutions Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressSomerset, NJ 08873

Trademark Events


Event DateEvent Description
Wednesday, June 10, 2020ABANDONMENT NOTICE E-MAILED - FAILURE TO RESPOND
Wednesday, June 10, 2020ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE
Thursday, October 17, 2019NOTIFICATION OF FINAL REFUSAL EMAILED
Thursday, October 17, 2019FINAL REFUSAL E-MAILED
Thursday, October 17, 2019FINAL REFUSAL WRITTEN
Wednesday, September 25, 2019TEAS/EMAIL CORRESPONDENCE ENTERED
Wednesday, September 25, 2019CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, September 25, 2019TEAS RESPONSE TO OFFICE ACTION RECEIVED
Monday, March 25, 2019NOTIFICATION OF NON-FINAL ACTION E-MAILED
Monday, March 25, 2019NON-FINAL ACTION E-MAILED
Monday, March 25, 2019NON-FINAL ACTION WRITTEN
Thursday, March 14, 2019ASSIGNED TO EXAMINER
Sunday, January 13, 2019NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM
Saturday, December 22, 2018NEW APPLICATION ENTERED IN TRAM