| Serial Number | 75452397 |
| Word Mark | HITACHI |
| Filing Date | Wednesday, March 18, 1998 |
| Status | 800 - REGISTERED AND RENEWED |
| Status Date | Wednesday, May 4, 2022 |
| Registration Number | 2542034 |
| Registration Date | Tuesday, February 26, 2002 |
| Mark Drawing | 1000 - Typeset: Word(s) / letter(s) / number(s) |
| Published for Opposition Date | Tuesday, December 4, 2001 |
| Goods and Services | Unprocessed synthetic resins, namely [alkyd resins for use in the manufacture of lacquer and paint, oil-free alkyd resins for use in the manufacture of paint, coating for cans and metal pre-coating, saturated polyester resins for use in the manufacture of paint, coating for cans and metal pre-coating, unsaturated polyester resins for use in the manufacture of flame retardant products, electrical insulation and coating,] acrylic resins for use in the manufacture of paint, [urea resins for use in the manufacture of paint, melamine resins for use in the manufacture of paint, alkyd phenolic resins for use in the manufacture of paint and varnish, epoxy-soluble phenolic resins for use in the manufacture of epoxy resin paint, water-soluble resins for use in the manufacture of paint, dispersible resins for use in the manufacture of paint, coating for metal, and rust-proofing, ketone resins for use in the manufacture of lacquer and printing ink, acrylic resins for optical use, thermoplastic resins for use in the manufacture of paint, heat resistant resins for use in the manufacture of paint, flame retardant thermoplastic resins for use in the manufacture of cabinets and housings for consumer appliances; synthetic resin compounds for use in the manufacture of hardeners for casting or impregnation of capacitors, magnetic coils, transformers, bushings, epoxy resin insulators and motor armatures and stators; photoresist solutions for semiconductor micro lithography;] chemicals for use in the manufacture of semiconductors, namely, polymers,[ photosensitive polymides, silica solutions, die-bonding pastes and liquid epoxy compounds;] epoxy resin hardener for use in the manufacture of capacitors, magnetic coils, transformers, bushings, epoxy resin insulators and motor armatures and stators; acid anhydride for use in the manufacture of polyester resin and alkyd resin, heat resistant acrylates for use in the manufacture of paint, ink, electrical insulating material and acrylic casting material; [dicyclopentadiene for use in the manufacture of synthetic resins, plasticizers, accelerators, stabilizers and flame retardants; flame retardant compound for use in the manufacture of electrical parts and office machinery;] photosensitive paper and film; [anti-allergic agents for use in the manufacture of pharmaceuticals; fibrinolytic agents for use in the manufacture of pharmaceuticals; blood analyzing reagents for scientific or research use;] epoxy molding compounds for use in the manufacture of electrical parts;[and phenolin resin molding compounds for use in the manufacture of electrical parts] |
| International Class | 001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry. |
| US Class Codes | 001, 005, 006, 010, 026, 046 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, April 30, 1998 |
| Primary Code | 001 |
| First Use Anywhere Date | Friday, February 28, 1913 |
| First Use In Commerce Date | Wednesday, December 31, 1958 |
| Party Name | Kabushiki Kaisha Hitachi Seisakusho |
| Party Type | 30 - Original Registrant |
| Legal Entity Type | 03 - Corporation |
| Address | Tokyo 100-8280 JP |
| Party Name | Kabushiki Kaisha Hitachi Seisakusho |
| Party Type | 20 - Owner at Publication |
| Legal Entity Type | 03 - Corporation |
| Address | Chiyoda-ku, Tokyo JP |
| Party Name | Kabushiki Kaisha Hitachi Seisakusho |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | Chiyoda-ku, Tokyo JP |
| Event Date | Event Description |
| Wednesday, May 4, 2022 | NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED |
| Wednesday, May 4, 2022 | REGISTERED AND RENEWED (SECOND RENEWAL - 10 YRS) |
| Wednesday, May 4, 2022 | REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED |
| Wednesday, May 4, 2022 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
| Thursday, January 6, 2022 | TEAS SECTION 8 & 9 RECEIVED |
| Monday, December 12, 2011 | REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS) |
| Monday, December 12, 2011 | REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED |
| Friday, December 9, 2011 | TEAS SECTION 8 & 9 RECEIVED |
| Friday, January 11, 2008 | REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK. |
| Thursday, January 10, 2008 | ASSIGNED TO PARALEGAL |
| Tuesday, January 8, 2008 | TEAS SECTION 8 & 15 RECEIVED |
| Friday, December 7, 2007 | APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED |
| Friday, December 7, 2007 | TEAS CHANGE OF OWNER ADDRESS RECEIVED |
| Thursday, April 12, 2007 | CASE FILE IN TICRS |
| Tuesday, February 26, 2002 | REGISTERED-PRINCIPAL REGISTER |
| Tuesday, December 4, 2001 | PUBLISHED FOR OPPOSITION |
| Wednesday, November 14, 2001 | NOTICE OF PUBLICATION |
| Monday, May 7, 2001 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Thursday, April 26, 2001 | EXAMINER'S AMENDMENT MAILED |
| Thursday, October 12, 2000 | FINAL REFUSAL MAILED |
| Wednesday, June 30, 1999 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Thursday, January 7, 1999 | NON-FINAL ACTION MAILED |
| Tuesday, November 10, 1998 | ASSIGNED TO EXAMINER |