HIGH DENSITY VIA PATTERN (HDVP) Trademark

Trademark Overview


On Thursday, January 23, 2020, a trademark application was filed for HIGH DENSITY VIA PATTERN (HDVP) with the United States Patent and Trademark Office. The USPTO has given the HIGH DENSITY VIA PATTERN (HDVP) trademark a serial number of 88771443. The federal status of this trademark filing is ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE as of Monday, November 1, 2021. This trademark is owned by TTM Technologies, Inc.. The HIGH DENSITY VIA PATTERN (HDVP) trademark is filed in the Computer & Software Products & Electrical & Scientific Products and Treatment & Processing of Materials Services categories with the following description:

Printed circuit boards; electronic back panel assemblies, namely, graphics cards, video display cards, electronic circuit cards, all for use with personal computers and personal cellular telephones; electronic wire harnesses and custom electronic cable assemblies comprised of electric connectors, electrical adapters, connection cables, cable connectors and electrical connectors; and custom electronic enclosures, namely, cases for panel mounted, electronic instruments in the nature of logic analyzers

Manufacture of printed circuit boards, electronic backpanel assemblies, electronic wire harnesses, custom electronic cable assemblies, and custom electronic enclosures to order and/or specifications of others
high density via pattern (hdvp)

General Information


Serial Number88771443
Word MarkHIGH DENSITY VIA PATTERN (HDVP)
Filing DateThursday, January 23, 2020
Status602 - ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE
Status DateMonday, November 1, 2021
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and ServicesPrinted circuit boards; electronic back panel assemblies, namely, graphics cards, video display cards, electronic circuit cards, all for use with personal computers and personal cellular telephones; electronic wire harnesses and custom electronic cable assemblies comprised of electric connectors, electrical adapters, connection cables, cable connectors and electrical connectors; and custom electronic enclosures, namely, cases for panel mounted, electronic instruments in the nature of logic analyzers
Goods and ServicesManufacture of printed circuit boards, electronic backpanel assemblies, electronic wire harnesses, custom electronic cable assemblies, and custom electronic enclosures to order and/or specifications of others
Pseudo MarkHIGH DENSITY VIA PATTERN (HIGH DENSITY VIA PATTERN)

Classification Information


International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateTuesday, January 28, 2020
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status Code6 - Active
Class Status DateTuesday, January 28, 2020
Primary Code040
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameTTM Technologies, Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressCosta Mesa, CA 92626

Trademark Events


Event DateEvent Description
Monday, November 1, 2021ABANDONMENT NOTICE E-MAILED - FAILURE TO RESPOND
Monday, November 1, 2021ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND
Monday, November 1, 2021ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE
Tuesday, September 14, 2021ASSIGNED TO EXAMINER
Monday, April 19, 2021NOTIFICATION OF NON-FINAL ACTION E-MAILED
Monday, April 19, 2021NON-FINAL ACTION E-MAILED
Monday, April 19, 2021NON-FINAL ACTION WRITTEN
Friday, February 5, 2021TEAS/EMAIL CORRESPONDENCE ENTERED
Friday, February 5, 2021CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, February 3, 2021ASSIGNED TO LIE
Wednesday, October 28, 2020TEAS RESPONSE TO OFFICE ACTION RECEIVED
Tuesday, April 28, 2020NOTIFICATION OF NON-FINAL ACTION E-MAILED
Tuesday, April 28, 2020NON-FINAL ACTION E-MAILED
Tuesday, April 28, 2020NON-FINAL ACTION WRITTEN
Saturday, April 11, 2020ASSIGNED TO EXAMINER
Tuesday, January 28, 2020NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM
Monday, January 27, 2020NEW APPLICATION ENTERED IN TRAM