HICERAM CARRIER Trademark
Trademark Overview
On Thursday, August 14, 2025, a trademark application was filed for HICERAM CARRIER with the United States Patent and Trademark Office. The USPTO has given the HICERAM CARRIER trademark a serial number of 79434587. The federal status of this trademark filing is RESPONSE AFTER NON-FINAL ACTION - ENTERED as of Wednesday, March 25, 2026. This trademark is owned by NGK INSULATORS, LTD.. The HICERAM CARRIER trademark is filed in the Machinery Products category with the following description:
Semiconductor manufacturing machines; parts of semiconductor manufacturing machines; laminated semiconductor chip manufacturing machines; parts of laminated semiconductor chip manufacturing machines; semiconductor manufacturing machine parts, namely, ceramic substrates for arranging and temporarily bonding semiconductor chips and forming a redistribution layer on a semiconductor substrate in the semiconductor substrate fabrication process; semiconductor manufacturing machine parts, namely, ceramic substrates for processing and transporting semiconductor substrates in the semiconductor substrate fabrication process; semiconductor manufacturing machine parts, namely, ceramic substrates used in the process of semiconductor packaging, including fan-out wafer-level packaging (fowlp)
General Information
| Serial Number | 79434587 |
| Word Mark | HICERAM CARRIER |
| Filing Date | Thursday, August 14, 2025 |
| Status | 661 - RESPONSE AFTER NON-FINAL ACTION - ENTERED |
| Status Date | Wednesday, March 25, 2026 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | NOT AVAILABLE |
Trademark Statements
| NOT AVAILABLE | "CARRIER" |
| Goods and Services | Semiconductor manufacturing machines; parts of semiconductor manufacturing machines; laminated semiconductor chip manufacturing machines; parts of laminated semiconductor chip manufacturing machines; semiconductor manufacturing machine parts, namely, ceramic substrates for arranging and temporarily bonding semiconductor chips and forming a redistribution layer on a semiconductor substrate in the semiconductor substrate fabrication process; semiconductor manufacturing machine parts, namely, ceramic substrates for processing and transporting semiconductor substrates in the semiconductor substrate fabrication process; semiconductor manufacturing machine parts, namely, ceramic substrates used in the process of semiconductor packaging, including fan-out wafer-level packaging (fowlp) |
Classification Information
| International Class | 007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs. |
| US Class Codes | 013, 019, 021, 023, 024, 031, 034, 035 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, October 9, 2025 |
| Primary Code | 007 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
Trademark Owner History
| Party Name | NGK INSULATORS, LTD. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | JP |
Trademark Events
| Event Date | Event Description |
| Thursday, October 9, 2025 | SN ASSIGNED FOR SECT 66A APPL FROM IB |
| Monday, October 13, 2025 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Monday, October 13, 2025 | APPLICATION FILING RECEIPT MAILED |
| Friday, December 5, 2025 | CORRECTION TRANSACTION RECEIVED FROM IB |
| Monday, December 29, 2025 | ASSIGNED TO EXAMINER |
| Tuesday, January 6, 2026 | NON-FINAL ACTION WRITTEN |
| Wednesday, January 7, 2026 | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW |
| Tuesday, February 3, 2026 | REFUSAL PROCESSED BY MPU |
| Wednesday, February 4, 2026 | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB |
| Thursday, February 19, 2026 | REFUSAL PROCESSED BY IB |
| Wednesday, March 25, 2026 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Wednesday, March 25, 2026 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Wednesday, March 25, 2026 | TEAS/EMAIL CORRESPONDENCE ENTERED |
