HICERAM CARRIER Trademark

Trademark Overview


On Thursday, August 14, 2025, a trademark application was filed for HICERAM CARRIER with the United States Patent and Trademark Office. The USPTO has given the HICERAM CARRIER trademark a serial number of 79434587. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Thursday, October 9, 2025. This trademark is owned by NGK INSULATORS, LTD.. The HICERAM CARRIER trademark is filed in the Machinery Products category with the following description:

Semiconductor manufacturing machines; parts and accessories of semiconductor manufacturing machines; laminated semiconductor chip manufacturing machines; parts and accessories of laminated semiconductor chip manufacturing machines; semiconductor manufacturing equipment components, namely, ceramic substrates for arranging and temporarily bonding semiconductor chips and forming a redistribution layer on a semiconductor substrate in the semiconductor substrate manufacturing process; semiconductor manufacturing equipment components, namely, ceramic substrates for processing and transporting semiconductor substrates in the semiconductor substrate manufacturing process semiconductor manufacturing equipment components, namely, ceramic substrates used in the process of semiconductor packaging, including fan-out wafer-level packaging (FOWLP).
hiceram carrier

General Information


Serial Number79434587
Word MarkHICERAM CARRIER
Filing DateThursday, August 14, 2025
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateThursday, October 9, 2025
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and ServicesSemiconductor manufacturing machines; parts and accessories of semiconductor manufacturing machines; laminated semiconductor chip manufacturing machines; parts and accessories of laminated semiconductor chip manufacturing machines; semiconductor manufacturing equipment components, namely, ceramic substrates for arranging and temporarily bonding semiconductor chips and forming a redistribution layer on a semiconductor substrate in the semiconductor substrate manufacturing process; semiconductor manufacturing equipment components, namely, ceramic substrates for processing and transporting semiconductor substrates in the semiconductor substrate manufacturing process semiconductor manufacturing equipment components, namely, ceramic substrates used in the process of semiconductor packaging, including fan-out wafer-level packaging (FOWLP).

Classification Information


International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 024, 031, 034, 035
Class Status Code6 - Active
Class Status DateThursday, October 9, 2025
Primary Code007
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameNGK INSULATORS, LTD.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressJP

Trademark Events


Event DateEvent Description
Thursday, October 9, 2025SN ASSIGNED FOR SECT 66A APPL FROM IB
Monday, October 13, 2025NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Monday, October 13, 2025APPLICATION FILING RECEIPT MAILED