HI-PED Trademark

Trademark Overview


On Thursday, November 5, 2020, a trademark application was filed for HI-PED with the United States Patent and Trademark Office. The USPTO has given the HI-PED trademark a serial number of 90300090. The federal status of this trademark filing is ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE as of Tuesday, November 16, 2021. This trademark is owned by Nano Dimension Technologies LTD. The HI-PED trademark is filed in the Computer & Software Products & Electrical & Scientific Products category with the following description:

: integrated circuits, namely, system-in-package (SiP) electronics; micro electromechanical systems (MEMS); inertial MEMS; substrate-embedded systems; planar magnetic boards; mesh communication electronics; mmWave RF antennae PCB; antennae-in-chip (AiC); antennae-in-package (AiP); substrate-like PCB (SLP); Fan-in/Fan-out AiP (InFO-AiP); Package-in-package (PiP) electronics; integrated photonic devices; through Silicone via (TSV) devices; embedded multi-die interconnect bridge (EMIB) chips; monolithic microwave integrated circuits (MMIC); interposers; and technical manuals sold with the above goods
hi-ped

General Information


Serial Number90300090
Word MarkHI-PED
Filing DateThursday, November 5, 2020
Status602 - ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE
Status DateTuesday, November 16, 2021
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and Services: integrated circuits, namely, system-in-package (SiP) electronics; micro electromechanical systems (MEMS); inertial MEMS; substrate-embedded systems; planar magnetic boards; mesh communication electronics; mmWave RF antennae PCB; antennae-in-chip (AiC); antennae-in-package (AiP); substrate-like PCB (SLP); Fan-in/Fan-out AiP (InFO-AiP); Package-in-package (PiP) electronics; integrated photonic devices; through Silicone via (TSV) devices; embedded multi-die interconnect bridge (EMIB) chips; monolithic microwave integrated circuits (MMIC); interposers; and technical manuals sold with the above goods

Classification Information


International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateTuesday, January 5, 2021
Primary Code009
First Use Anywhere DateMonday, February 3, 2020
First Use In Commerce DateMonday, February 3, 2020

Trademark Owner History


Party NameNano Dimension Technologies LTD
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressWyckoff, NJ 07481

Trademark Events


Event DateEvent Description
Tuesday, November 16, 2021ABANDONMENT NOTICE E-MAILED - FAILURE TO RESPOND
Tuesday, November 16, 2021ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE
Wednesday, May 5, 2021NOTIFICATION OF NON-FINAL ACTION E-MAILED
Wednesday, May 5, 2021NON-FINAL ACTION E-MAILED
Wednesday, May 5, 2021NON-FINAL ACTION WRITTEN
Tuesday, April 13, 2021ASSIGNED TO EXAMINER
Tuesday, January 5, 2021NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM
Monday, November 9, 2020NEW APPLICATION ENTERED IN TRAM