HBMFLEX Trademark

Trademark Overview

On Wednesday, June 4, 2025, a trademark application was filed for HBMFLEX with the United States Patent and Trademark Office. The USPTO has given the HBMFLEX trademark a serial number of 99218575. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Wednesday, June 4, 2025. This trademark is owned by Samsung Electronics Co., Ltd.. The HBMFLEX trademark is filed in the Treatment & Processing of Materials Services, Computer & Software Products & Electrical & Scientific Products, and Computer & Software Services & Scientific Services categories with the following description:

DESIGN AND CUSTOMIZATION OF MEMORY AND COMPUTER ARCHITECTURES, COMPUTER MEMORY HARDWARE, FLASH MEMORY, DIGITAL STORAGE MEDIA, SEMICONDUCTOR MEMORY DEVICES, MEMORY DEVICES; DYNAMIC RANDOM ACCESS MEMORY, COMPUTER CIRCUITRY; SEMICONDUCTORS, WAFERS, SEMICONDUCTOR DIES, CHIPLETS, BASE-DIES, SEMICONDUCTOR MEMORIES, SEMICONDUCTOR MEMORY UNITS, COMPUTER MEMORY DEVICES, APPLICATION-SPECIFIC INTEGRATED CIRCUITS, COMPUTER HARDWARE, ELECTRONIC COMPONENTS FOR COMPUTERS, AND COMPUTER DEVICES; AND CUSTOM DESIGN AND MANUFACTURE OF SEMICONDUCTORS, MEMORY CHIPS, WAFERS and INTEGRATED CIRCUITS

MEMORY AND COMPUTER ARCHITECTURES; COMPUTER MEMORY HARDWARE; FLASH MEMORY; DIGITAL STORAGE MEDIA; SEMICONDUCTOR MEMORY DEVICES; MEMORY DEVICES; DYNAMIC RANDOM ACCESS MEMORY; COMPUTER CIRCUITRY; SEMICONDUCTORS; SEMICONDUCTOR WAFERS; SEMICONDUCTOR DIES; CHIPLETS; BASE-DIES; SEMICONDUCTOR MEMORIES; SEMICONDUCTOR MEMORY UNITS; COMPUTER MEMORY DEVICES; APPLICATION-SPECIFIC INTEGRATED CIRCUITS; COMPUTER HARDWARE; ELECTRONIC COMPONENTS FOR COMPUTERS; AND COMPUTER DEVICES

DESIGN AND CUSTOMIZATION OF MEMORY AND COMPUTER ARCHITECTURES, COMPUTER MEMORY HARDWARE, FLASH MEMORY, DIGITAL STORAGE MEDIA, SEMICONDUCTOR MEMORY DEVICES, MEMORY DEVICES; DYNAMIC RANDOM ACCESS MEMORY, COMPUTER CIRCUITRY; SEMICONDUCTORS, WAFERS, SEMICONDUCTOR DIES, CHIPLETS, BASE-DIES, SEMICONDUCTOR MEMORIES, SEMICONDUCTOR MEMORY UNITS, COMPUTER MEMORY DEVICES, APPLICATION-SPECIFIC INTEGRATED CIRCUITS, COMPUTER HARDWARE, ELECTRONIC COMPONENTS FOR COMPUTERS, AND COMPUTER DEVICES; AND CUSTOM DESIGN AND MANUFACTURE OF SEMICONDUCTORS, MEMORY CHIPS, WAFERS and INTEGRATED CIRCUITS
hbmflex

General Information

Serial Number99218575
Word MarkHBMFLEX
Filing DateWednesday, June 4, 2025
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateWednesday, June 4, 2025
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements

Goods and ServicesDESIGN AND CUSTOMIZATION OF MEMORY AND COMPUTER ARCHITECTURES, COMPUTER MEMORY HARDWARE, FLASH MEMORY, DIGITAL STORAGE MEDIA, SEMICONDUCTOR MEMORY DEVICES, MEMORY DEVICES; DYNAMIC RANDOM ACCESS MEMORY, COMPUTER CIRCUITRY; SEMICONDUCTORS, WAFERS, SEMICONDUCTOR DIES, CHIPLETS, BASE-DIES, SEMICONDUCTOR MEMORIES, SEMICONDUCTOR MEMORY UNITS, COMPUTER MEMORY DEVICES, APPLICATION-SPECIFIC INTEGRATED CIRCUITS, COMPUTER HARDWARE, ELECTRONIC COMPONENTS FOR COMPUTERS, AND COMPUTER DEVICES; AND CUSTOM DESIGN AND MANUFACTURE OF SEMICONDUCTORS, MEMORY CHIPS, WAFERS and INTEGRATED CIRCUITS
Goods and ServicesMEMORY AND COMPUTER ARCHITECTURES; COMPUTER MEMORY HARDWARE; FLASH MEMORY; DIGITAL STORAGE MEDIA; SEMICONDUCTOR MEMORY DEVICES; MEMORY DEVICES; DYNAMIC RANDOM ACCESS MEMORY; COMPUTER CIRCUITRY; SEMICONDUCTORS; SEMICONDUCTOR WAFERS; SEMICONDUCTOR DIES; CHIPLETS; BASE-DIES; SEMICONDUCTOR MEMORIES; SEMICONDUCTOR MEMORY UNITS; COMPUTER MEMORY DEVICES; APPLICATION-SPECIFIC INTEGRATED CIRCUITS; COMPUTER HARDWARE; ELECTRONIC COMPONENTS FOR COMPUTERS; AND COMPUTER DEVICES
Goods and ServicesDESIGN AND CUSTOMIZATION OF MEMORY AND COMPUTER ARCHITECTURES, COMPUTER MEMORY HARDWARE, FLASH MEMORY, DIGITAL STORAGE MEDIA, SEMICONDUCTOR MEMORY DEVICES, MEMORY DEVICES; DYNAMIC RANDOM ACCESS MEMORY, COMPUTER CIRCUITRY; SEMICONDUCTORS, WAFERS, SEMICONDUCTOR DIES, CHIPLETS, BASE-DIES, SEMICONDUCTOR MEMORIES, SEMICONDUCTOR MEMORY UNITS, COMPUTER MEMORY DEVICES, APPLICATION-SPECIFIC INTEGRATED CIRCUITS, COMPUTER HARDWARE, ELECTRONIC COMPONENTS FOR COMPUTERS, AND COMPUTER DEVICES; AND CUSTOM DESIGN AND MANUFACTURE OF SEMICONDUCTORS, MEMORY CHIPS, WAFERS and INTEGRATED CIRCUITS

Classification Information

International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status Code6 - Active
Class Status DateWednesday, June 4, 2025
Primary Code040
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE
International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateWednesday, June 4, 2025
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE
International Class042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
US Class Codes100, 101
Class Status Code6 - Active
Class Status DateWednesday, June 4, 2025
Primary Code042
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History

Party NameSamsung Electronics Co., Ltd.
Party Type10 - Original Applicant
Legal Entity Type99 - Other
AddressGyeonggi-do 16677
KR

Trademark Events

Event DateEvent Description
Wednesday, June 4, 2025NEW APPLICATION ENTERED
Wednesday, June 4, 2025APPLICATION FILING RECEIPT MAILED
Wednesday, June 4, 2025NEW APPLICATION OFFICE SUPPLIED DATA ENTERED

Related Keywords

hbmflex memory computer semiconductor devices dies hardware wafers integrated circuits semiconductors