"HANMI" Trademark

Trademark Overview

On Monday, November 11, 2024, a trademark application was filed for "HANMI" with the United States Patent and Trademark Office. The USPTO has given the "HANMI" trademark a serial number of 98846302. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Monday, November 11, 2024. This trademark is owned by HANMI SEMICONDUCTOR CO., LTD.. The "HANMI" trademark is filed in the Machinery Products category with the following description:

Die attachment equipment for manufacturing semiconductor; semiconductor flip chip bonding machine; thermocompression bonding apparatus for manufacturing semiconductor; PICK PLACE equipment for manufacturing semiconductor; die bonding equipment for manufacturing semiconductor; electronic components placement machines and apparatus for manufacturing semiconductor; semiconductor chip mounting equipment; semiconductor package electromagnetic shielding equipment; semiconductor wafer processing equipment; hybrid bonding equipment for manufacturing semiconductor
"hanmi"

General Information

Serial Number98846302
Word Mark"HANMI"
Filing DateMonday, November 11, 2024
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateMonday, November 11, 2024
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing0 - NOT AVAILABLE
Published for Opposition DateNOT AVAILABLE

Trademark Statements

Description of MarkThe mark consists of the word "HANMI" in blue surrounded by a red frame with straight and curved features, the white in the mark representing a transparent area..
Goods and ServicesDie attachment equipment for manufacturing semiconductor; semiconductor flip chip bonding machine; thermocompression bonding apparatus for manufacturing semiconductor; PICK PLACE equipment for manufacturing semiconductor; die bonding equipment for manufacturing semiconductor; electronic components placement machines and apparatus for manufacturing semiconductor; semiconductor chip mounting equipment; semiconductor package electromagnetic shielding equipment; semiconductor wafer processing equipment; hybrid bonding equipment for manufacturing semiconductor
Indication of Colors claimedThe color(s) blue and red is/are claimed as a feature of the mark.

Classification Information

International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 024, 031, 034, 035
Class Status Code6 - Active
Class Status DateMonday, November 11, 2024
Primary Code007
First Use Anywhere DateFriday, December 1, 2000
First Use In Commerce DateFriday, December 1, 2000

Trademark Owner History

Party NameHANMI SEMICONDUCTOR CO., LTD.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressIncheon 22830
KR

Trademark Events

Event DateEvent Description
Monday, November 11, 2024NEW APPLICATION ENTERED

Related Keywords

hanmi semiconductor equipment manufacturing bonding apparatus chip electromagnetic mounting shielding package