HANMI Trademark
Trademark Overview
On Monday, November 11, 2024, a trademark application was filed for HANMI with the United States Patent and Trademark Office. The USPTO has given the HANMI trademark a serial number of 98846302. The federal status of this trademark filing is PUBLICATION/ISSUE REVIEW COMPLETE as of Monday, May 26, 2025. This trademark is owned by HANMI SEMICONDUCTOR CO., LTD.. The HANMI trademark is filed in the Machinery Products category with the following description:
Die attachment equipment for manufacturing semiconductor, namely, dies for use with machine tools; semiconductor flip chip bonding machine; thermocompression bonding apparatus for manufacturing semiconductor in the nature of semiconductor manufacturing machines; equipment for manufacturing semiconductor in the nature of semiconductor manufacturing machines; die bonding equipment for manufacturing semiconductor in the nature of semiconductor manufacturing machines; electronic components placement machines and apparatus for manufacturing semiconductor in the nature of semiconductor manufacturing machines; semiconductor chip mounting equipment in the nature of semiconductor manufacturing machines; semiconductor package electromagnetic shielding equipment in the nature of semiconductor manufacturing machines; semiconductor wafer processing equipment; hybrid bonding equipment for manufacturing semiconductor in the nature of semiconductor manufacturing machines
General Information
| Serial Number | 98846302 |
| Word Mark | HANMI |
| Filing Date | Monday, November 11, 2024 |
| Status | 681 - PUBLICATION/ISSUE REVIEW COMPLETE |
| Status Date | Monday, May 26, 2025 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 3 - Illustration: Drawing or design which also includes word(s) / letter(s) / number(s) |
| Published for Opposition Date | Tuesday, June 17, 2025 |
Trademark Statements
| Description of Mark | The mark consists of the word "HANMI" in blue surrounded by a red frame with straight and curved features, the white in the mark representing a transparent area. |
| Goods and Services | Die attachment equipment for manufacturing semiconductor, namely, dies for use with machine tools; semiconductor flip chip bonding machine; thermocompression bonding apparatus for manufacturing semiconductor in the nature of semiconductor manufacturing machines; equipment for manufacturing semiconductor in the nature of semiconductor manufacturing machines; die bonding equipment for manufacturing semiconductor in the nature of semiconductor manufacturing machines; electronic components placement machines and apparatus for manufacturing semiconductor in the nature of semiconductor manufacturing machines; semiconductor chip mounting equipment in the nature of semiconductor manufacturing machines; semiconductor package electromagnetic shielding equipment in the nature of semiconductor manufacturing machines; semiconductor wafer processing equipment; hybrid bonding equipment for manufacturing semiconductor in the nature of semiconductor manufacturing machines |
| Indication of Colors claimed | The color(s) blue and red is/are claimed as a feature of the mark. |
Classification Information
| International Class | 007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs. |
| US Class Codes | 013, 019, 021, 023, 024, 031, 034, 035 |
| Class Status Code | 6 - Active |
| Class Status Date | Monday, November 11, 2024 |
| Primary Code | 007 |
| First Use Anywhere Date | Friday, December 1, 2000 |
| First Use In Commerce Date | Friday, December 1, 2000 |
Trademark Owner History
| Party Name | HANMI SEMICONDUCTOR CO., LTD. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | Incheon 22830
KR |
Trademark Events
| Event Date | Event Description |
| Monday, November 11, 2024 | NEW APPLICATION ENTERED |
| Monday, May 5, 2025 | NOTICE OF DESIGN SEARCH CODE E-MAILED |
| Monday, May 5, 2025 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Wednesday, May 7, 2025 | ASSIGNED TO EXAMINER |
| Tuesday, May 13, 2025 | EXAMINERS AMENDMENT -WRITTEN |
| Tuesday, May 13, 2025 | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED |
| Tuesday, May 13, 2025 | EXAMINER'S AMENDMENT ENTERED |
| Tuesday, May 13, 2025 | EXAMINERS AMENDMENT E-MAILED |
| Tuesday, May 13, 2025 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Wednesday, June 11, 2025 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
