| Serial Number | 79200200 |
| Word Mark | HALOGEN FREE HF |
| Filing Date | Thursday, July 14, 2016 |
| Status | 602 - ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE |
| Status Date | Monday, January 22, 2018 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 3000 - Illustration: Drawing or design which also includes word(s) / letter(s) / number(s) |
| Published for Opposition Date | NOT AVAILABLE |
| Indication of Colors claimed | Color is not claimed as a feature of the mark. |
| Goods and Services | Chemicals which do not contain halogen compounds, for use in industry and science other than for medical or veterinary use; metal tempering preparations which do not contain halogen compounds; chemicals which do not contain halogen compounds, for cleaning printed circuit boards, namely, solvent type processing compositions for use in the electronics industry; chemicals which do not contain halogen compounds, used for anti-tarnishing, plating, soldering, etching, stripping, and deterging metal surfaces for use in the manufacture of electronic circuit boards, namely, solder mask, etchants for use in the manufacture of printed circuit boards, masking compounds for use in the manufacture of printed circuit boards, doping compounds for use in the manufacture of printed circuit boards, chemical oxidants for use in the manufacture of printed circuits, chemical coatings used in the manufacture of printed circuit boards; surface active chemical agents for use in the manufacture of detergents which do not contain halogen compounds; soldering paste which do not contain halogen compounds; soldering cream which do not contain halogen compounds; soldering fluxes which do not contain halogen compounds; chemicals for welding and soldering purposes which do not contain halogen compounds; chemical preparations for welding which do not contain halogen compounds; chemical preparations for soldering which do not contain halogen compounds; soldering chemicals which do not contain halogen compounds |
| Goods and Services | Hard or soft solder bars which do not contain halogen compounds; solder wire which do not contain halogen compounds; hard or soft solders containing resin which do not contain halogen compounds; resin core wire which do not contain halogen compounds, namely, filamentous solder in which resin flux is filled for use in industrial welding; non-ferrous metals and their alloys which do not contain halogen compounds |
| International Class | 001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry. |
| US Class Codes | 001, 005, 006, 010, 026, 046 |
| Class Status Code | 6 - Active |
| Class Status Date | Friday, January 13, 2017 |
| Primary Code | 001 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 006 - Common metals and their alloys; metal building materials; transportable buildings of metal; materials of metal for railway tracks; nonelectric cables and wires of common metal; ironmongery, small items of metal hardware; pipes and tubes of metal; safes; goods of common metal not included in other classes; ores. |
| US Class Codes | 002, 012, 013, 014, 023, 025, 050 |
| Class Status Code | 6 - Active |
| Class Status Date | Friday, January 13, 2017 |
| Primary Code | 006 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | KOKI COMPANY LIMITED |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | JP |
| Event Date | Event Description |
| Friday, February 8, 2019 | FINAL DECISION TRANSACTION PROCESSED BY IB |
| Tuesday, January 22, 2019 | FINAL DISPOSITION NOTICE SENT TO IB |
| Tuesday, January 22, 2019 | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB |
| Friday, June 29, 2018 | NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB |
| Thursday, June 14, 2018 | NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB |
| Thursday, June 14, 2018 | NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB |
| Monday, January 22, 2018 | ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND |
| Monday, January 22, 2018 | ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE |
| Monday, June 26, 2017 | NOTIFICATION OF FINAL REFUSAL EMAILED |
| Monday, June 26, 2017 | FINAL REFUSAL E-MAILED |
| Monday, June 26, 2017 | FINAL REFUSAL WRITTEN |
| Tuesday, June 13, 2017 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Tuesday, June 13, 2017 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Tuesday, June 13, 2017 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Monday, March 20, 2017 | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED |
| Monday, March 20, 2017 | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED |
| Friday, February 3, 2017 | REFUSAL PROCESSED BY IB |
| Thursday, January 19, 2017 | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB |
| Thursday, January 19, 2017 | REFUSAL PROCESSED BY MPU |
| Tuesday, January 17, 2017 | APPLICATION FILING RECEIPT MAILED |
| Saturday, January 14, 2017 | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW |
| Friday, January 13, 2017 | NON-FINAL ACTION WRITTEN |
| Friday, January 13, 2017 | ASSIGNED TO EXAMINER |
| Friday, January 13, 2017 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM |
| Thursday, January 12, 2017 | SN ASSIGNED FOR SECT 66A APPL FROM IB |