| Serial Number | 97376157 |
| Word Mark | GAP-LLO |
| Filing Date | Friday, April 22, 2022 |
| Status | 653 - SUSPENSION LETTER - MAILED |
| Status Date | Tuesday, August 27, 2024 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | NOT AVAILABLE |
| Goods and Services | Semiconductor substrates manufacturing machines; semiconductor manufacturing machines; electronic component feeder machines for processing electronic components of electronic circuits used in electronic circuit board manufacturing machines; machines for manufacturing electronic parts; mounting machines specifically adapted for mounting electronic components of light-emitting diodes (LEDs) during the manufacturing of semiconductor devices; power operated automatic mounting machines that automatically mount electronic parts, namely, integrated circuit chips, to printed wiring circuit boards; manufacturing machines for memory chips; manufacturing machines for laminated semiconductor chips; power operated machines that mount integrated circuit chips to circuit boards; transfer machines for semiconductor chips, namely, machines specifically adapted for transferring electronic components of light-emitting diodes (LEDs) from one substrate to another via laser beam; processing equipment for semiconductor wafer; laser processing machines for processing glass pieces; laser processing machines for processing plastics; laser processing machines for processing ceramics; laser processing machines for processing printed circuit boards; machines for processing printed circuit boards; laser processing machines for processing circuits or chips as parts of semi-conductors; semiconductor and printed circuit board manufacturing machines using laser; machines for peeling electronic components from substrate boards by irradiating the electronic components laminated on the substrate with laser; substrate restraining jig for semiconductor manufacturing machines; laser lift-off machines used for stripping chip parts; manufacturing equipment and machines used for the production of micro-LED displays; replacement parts for all of the aforementioned goods |
| NOT AVAILABLE | "GAP" |
| International Class | 007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs. |
| US Class Codes | 013, 019, 021, 023, 024, 031, 034, 035 |
| Class Status Code | 6 - Active |
| Class Status Date | Wednesday, April 27, 2022 |
| Primary Code | 007 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | Shin-Etsu Engineering Co., Ltd. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | Tokyo 101-0054 JP |
| Event Date | Event Description |
| Tuesday, April 26, 2022 | NEW APPLICATION ENTERED |
| Wednesday, April 27, 2022 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Friday, August 19, 2022 | TEAS VOLUNTARY AMENDMENT RECEIVED |
| Friday, August 19, 2022 | TEAS AMENDMENT ENTERED BEFORE ATTORNEY ASSIGNED |
| Thursday, February 9, 2023 | ASSIGNED TO EXAMINER |
| Thursday, February 16, 2023 | NON-FINAL ACTION WRITTEN |
| Thursday, February 16, 2023 | NON-FINAL ACTION E-MAILED |
| Thursday, February 16, 2023 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| Monday, April 24, 2023 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Monday, April 24, 2023 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Monday, April 24, 2023 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Thursday, April 27, 2023 | SUSPENSION LETTER WRITTEN |
| Thursday, April 27, 2023 | LETTER OF SUSPENSION E-MAILED |
| Thursday, April 27, 2023 | NOTIFICATION OF LETTER OF SUSPENSION E-MAILED |
| Wednesday, January 3, 2024 | SUSPENSION CHECKED - TO ATTORNEY FOR ACTION |
| Wednesday, January 3, 2024 | SUSPENSION INQUIRY WRITTEN |
| Wednesday, January 3, 2024 | INQUIRY TO SUSPENSION E-MAILED |
| Wednesday, January 3, 2024 | NOTIFICATION OF INQUIRY AS TO SUSPENSION E-MAILED |
| Tuesday, August 27, 2024 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Tuesday, August 27, 2024 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Tuesday, August 27, 2024 | SUSPENSION LETTER WRITTEN |
| Tuesday, August 27, 2024 | NOTIFICATION OF LETTER OF SUSPENSION E-MAILED |
| Tuesday, August 27, 2024 | LETTER OF SUSPENSION E-MAILED |
| Tuesday, August 27, 2024 | ASSIGNED TO LIE |
| Thursday, March 21, 2024 | TEAS RESPONSE TO SUSPENSION INQUIRY RECEIVED |