FUTURE-READY MODULAR SOLUTIONS Trademark

Trademark Overview


On Thursday, July 18, 2024, a trademark application was filed for FUTURE-READY MODULAR SOLUTIONS with the United States Patent and Trademark Office. The USPTO has given the FUTURE-READY MODULAR SOLUTIONS trademark a serial number of 98655979. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Thursday, July 18, 2024. This trademark is owned by Sean Khan Consulting Company, Inc.. The FUTURE-READY MODULAR SOLUTIONS trademark is filed in the Metal Products category with the following description:

Portable modular buildings of metal; Portable modular classroom buildings of metal
future-ready modular solutions

General Information


Serial Number98655979
Word MarkFUTURE-READY MODULAR SOLUTIONS
Filing DateThursday, July 18, 2024
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateThursday, July 18, 2024
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and ServicesPortable modular buildings of metal; Portable modular classroom buildings of metal

Classification Information


International Class006 - Common metals and their alloys; metal building materials; transportable buildings of metal; materials of metal for railway tracks; nonelectric cables and wires of common metal; ironmongery, small items of metal hardware; pipes and tubes of metal; safes; goods of common metal not included in other classes; ores.
US Class Codes002, 012, 013, 014, 023, 025, 050
Class Status Code6 - Active
Class Status DateThursday, July 18, 2024
Primary Code006
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameSean Khan Consulting Company, Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressChino Hills, CA 91709

Trademark Events


Event DateEvent Description
Thursday, July 18, 2024NEW APPLICATION ENTERED