FAST CURING Trademark

Trademark Overview


On Thursday, July 20, 2023, a trademark application was filed for FAST CURING with the United States Patent and Trademark Office. The USPTO has given the FAST CURING trademark a serial number of 98094737. The federal status of this trademark filing is ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE as of Saturday, July 13, 2024. This trademark is owned by HONG KONG MERIDA CO., LIMITED. The FAST CURING trademark is filed in the Chemical Products category with the following description:

Acrylic resins, unprocessed; Artificial conductive resins, unprocessed; Artificial resins, unprocessed; Chemical preparations in the nature of ion-exchange resins; Curing agent for synthetic resin; Diatomaceous earth for use as a plastic filler, chemical carrier, resin admixture; Encapsulated epoxy sealant for use on threaded fasteners; Epoxy glue for general bonding and repair purposes; Epoxy resins, unprocessed; Polymer resins, unprocessed; Synthetic polymer modified resin compound for use in cementitious repairs; Synthetic resin adhesives for industrial purposes; Synthetic resin adhesives for laminating purposes; Synthetic resins that are used to repair and fill holes and cracks, adhere to surrounding materials and seal surfaces for use in harsh environments; Unprocessed artificial resins for industrial purposes; Unprocessed artificial resins, unprocessed plastics; Unprocessed composite carbon epoxy resins; Unprocessed epoxy resin; Unprocessed polystyrene resins; Unprocessed silicon...
fast curing

General Information


Serial Number98094737
Word MarkFAST CURING
Filing DateThursday, July 20, 2023
Status602 - ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE
Status DateSaturday, July 13, 2024
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and ServicesAcrylic resins, unprocessed; Artificial conductive resins, unprocessed; Artificial resins, unprocessed; Chemical preparations in the nature of ion-exchange resins; Curing agent for synthetic resin; Diatomaceous earth for use as a plastic filler, chemical carrier, resin admixture; Encapsulated epoxy sealant for use on threaded fasteners; Epoxy glue for general bonding and repair purposes; Epoxy resins, unprocessed; Polymer resins, unprocessed; Synthetic polymer modified resin compound for use in cementitious repairs; Synthetic resin adhesives for industrial purposes; Synthetic resin adhesives for laminating purposes; Synthetic resins that are used to repair and fill holes and cracks, adhere to surrounding materials and seal surfaces for use in harsh environments; Unprocessed artificial resins for industrial purposes; Unprocessed artificial resins, unprocessed plastics; Unprocessed composite carbon epoxy resins; Unprocessed epoxy resin; Unprocessed polystyrene resins; Unprocessed silicone resins

Classification Information


International Class001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
US Class Codes001, 005, 006, 010, 026, 046
Class Status Code6 - Active
Class Status DateSunday, August 20, 2023
Primary Code001
First Use Anywhere DateSunday, May 28, 2023
First Use In Commerce DateSunday, May 28, 2023

Trademark Owner History


Party NameHONG KONG MERIDA CO., LIMITED
Party Type10 - Original Applicant
Legal Entity Type99 - Other
AddressSheung Wan 999077
HK

Trademark Events


Event DateEvent Description
Monday, July 24, 2023NEW APPLICATION ENTERED
Sunday, August 20, 2023NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Monday, March 25, 2024ASSIGNED TO EXAMINER
Saturday, July 13, 2024ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE
Saturday, July 13, 2024ABANDONMENT NOTICE E-MAILED - FAILURE TO RESPOND
Thursday, March 28, 2024NOTIFICATION OF NON-FINAL ACTION E-MAILED
Thursday, March 28, 2024NON-FINAL ACTION WRITTEN
Thursday, March 28, 2024NON-FINAL ACTION E-MAILED