EZ DEBOND Trademark

Trademark Overview


On Wednesday, July 28, 2010, a trademark application was filed for EZ DEBOND with the United States Patent and Trademark Office. The USPTO has given the EZ DEBOND trademark a serial number of 79086635. The federal status of this trademark filing is IR CANCELLED - US REGISTRATION CANCELLED as of Tuesday, July 28, 2020. This trademark is owned by IBG Immobilien und Beteiligungs GmbH. The EZ DEBOND trademark is filed in the Machinery Products and Computer & Software Services & Scientific Services categories with the following description:

Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing and lithographic treatment, namely, nanostructure imprinting, hot stamping, micro-contact printing, testing and manufacturing of electronic circuits or semiconductors, transistors or wafers; structural parts and equipment for the aforesaid machines and apparatus, included in this class; semiconductor wafer processing machines for processing semiconductors under vacuum; conveyors for conveying semiconductors; machines for the surface treatment of semiconductors; machines for etching semiconductor surfaces, machines for vaporising semiconductor surfaces in particular under vacuum (CVD processes); installations for conveying and providing and processing semiconductors, namely, conveyors and semiconductor wafer processing machines; installations for conveying and processing and providing flat screens, namely, machines for manufacturing LCD- or LED-screens; machines and turnke...

Contract research and contract development, for others, in particular in the fields of micro-systems engineering, micro-mechanics, sensor technology, dosing technology, automation engineering, function and reliability testing, wafer technology, medical technology, time measuring technology and software; scientific research and custom design for others in the field of semiconductors, semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices
ez debond

General Information


Serial Number79086635
Word MarkEZ DEBOND
Filing DateWednesday, July 28, 2010
Status404 - IR CANCELLED - US REGISTRATION CANCELLED
Status DateTuesday, July 28, 2020
Registration Number4040292
Registration DateTuesday, October 18, 2011
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, August 2, 2011

Trademark Statements


Disclaimer with Predetermined Text"DEBOND"
Goods and ServicesMachines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing and lithographic treatment, namely, nanostructure imprinting, hot stamping, micro-contact printing, testing and manufacturing of electronic circuits or semiconductors, transistors or wafers; structural parts and equipment for the aforesaid machines and apparatus, included in this class; semiconductor wafer processing machines for processing semiconductors under vacuum; conveyors for conveying semiconductors; machines for the surface treatment of semiconductors; machines for etching semiconductor surfaces, machines for vaporising semiconductor surfaces in particular under vacuum (CVD processes); installations for conveying and providing and processing semiconductors, namely, conveyors and semiconductor wafer processing machines; installations for conveying and processing and providing flat screens, namely, machines for manufacturing LCD- or LED-screens; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector including light diodes, namely, machines for manufacturing semiconductors; machines for semiconductor manufacturing, machines for chip manufacturing and chip assembly
Goods and ServicesContract research and contract development, for others, in particular in the fields of micro-systems engineering, micro-mechanics, sensor technology, dosing technology, automation engineering, function and reliability testing, wafer technology, medical technology, time measuring technology and software; scientific research and custom design for others in the field of semiconductors, semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices
Pseudo MarkEASY DE BOND

Classification Information


International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 031, 034, 035
Class Status CodeF - NOT AVAILABLE
Class Status DateFriday, May 25, 2018
Primary Code007
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
US Class Codes100, 101
Class Status CodeF - NOT AVAILABLE
Class Status DateFriday, May 25, 2018
Primary Code042
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameIBG Immobilien und Beteiligungs GmbH
Party Type30 - Original Registrant
Legal Entity Type99 - Other
AddressAT

Party NameIBG Immobilien und Beteiligungs GmbH
Party Type20 - Owner at Publication
Legal Entity Type99 - Other
AddressAT

Party NameIBG Immobilien und Beteiligungs GmbH
Party Type10 - Original Applicant
Legal Entity Type99 - Other
AddressAT

Trademark Events


Event DateEvent Description
Friday, August 13, 2021NOTIFICATION OF EFFECT OF CANCELLATION OF INTL REG E-MAILED
Friday, August 13, 2021DEATH OF INTERNATIONAL REGISTRATION
Thursday, June 11, 2020NEW REPRESENTATIVE AT IB RECEIVED
Friday, March 15, 2019TOTAL INVALIDATION PROCESSED BY THE IB
Tuesday, February 5, 2019TOTAL INVALIDATION OF REG EXT PROTECTION SENT TO IB
Tuesday, February 5, 2019INVALIDATION PROCESSED
Friday, January 25, 2019TOTAL INVALIDATION OF REG EXT PROTECTION CREATED
Friday, May 25, 2018CANCELLED SECTION 71
Tuesday, October 18, 2016COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED
Friday, June 15, 2012FINAL DECISION TRANSACTION PROCESSED BY IB
Wednesday, May 30, 2012FINAL DISPOSITION NOTICE SENT TO IB
Wednesday, May 30, 2012FINAL DISPOSITION PROCESSED
Wednesday, January 18, 2012FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
Tuesday, October 18, 2011REGISTERED-PRINCIPAL REGISTER
Tuesday, August 2, 2011OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Tuesday, August 2, 2011PUBLISHED FOR OPPOSITION
Monday, June 27, 2011LAW OFFICE PUBLICATION REVIEW COMPLETED
Friday, June 24, 2011ASSIGNED TO LIE
Tuesday, June 21, 2011APPROVED FOR PUB - PRINCIPAL REGISTER
Thursday, June 16, 2011TEAS/EMAIL CORRESPONDENCE ENTERED
Thursday, June 16, 2011CORRESPONDENCE RECEIVED IN LAW OFFICE
Thursday, June 16, 2011TEAS RESPONSE TO OFFICE ACTION RECEIVED
Friday, April 29, 2011NOTIFICATION OF NON-FINAL ACTION E-MAILED
Friday, April 29, 2011NON-FINAL ACTION E-MAILED
Friday, April 29, 2011NON-FINAL ACTION WRITTEN
Wednesday, April 13, 2011TEAS/EMAIL CORRESPONDENCE ENTERED
Wednesday, April 13, 2011CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, April 13, 2011TEAS RESPONSE TO OFFICE ACTION RECEIVED
Saturday, December 4, 2010REFUSAL PROCESSED BY IB
Thursday, November 18, 2010NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
Thursday, November 18, 2010REFUSAL PROCESSED BY MPU
Thursday, November 18, 2010NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
Wednesday, November 17, 2010NON-FINAL ACTION WRITTEN
Friday, November 12, 2010ASSIGNED TO EXAMINER
Tuesday, October 5, 2010APPLICATION FILING RECEIPT MAILED
Friday, October 1, 2010NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM
Thursday, September 30, 2010SN ASSIGNED FOR SECT 66A APPL FROM IB