| Serial Number | 79045546 |
| Word Mark | EVG |
| Filing Date | Monday, August 13, 2007 |
| Status | 706 - SECTION 71 ACCEPTED |
| Status Date | Thursday, April 18, 2019 |
| Registration Number | 3612566 |
| Registration Date | Tuesday, April 28, 2009 |
| Mark Drawing | 3000 - Illustration: Drawing or design which also includes word(s) / letter(s) / number(s) |
| Published for Opposition Date | Tuesday, February 10, 2009 |
| Indication of Colors claimed | The color(s) dark grey and yellow is/are claimed as a feature of the mark. |
| Description of Mark | The mark consists of the color dark grey appearing in the wording "EVG" and in the design in the middle of the ellipse. The color yellow fills in the ellipse around the design element. |
| Goods and Services | Machines and structural parts therefore, for the production, treatment, transport and processing of electronic components, namely, semiconductors, in the field of microelectronic, medical technology, biotechnology, semiconductor technology and microsystems technology; machines and structural parts therefor, for the production, treatment and processing of semiconductors; machines and structural parts therefore for treatment of surfaces of electronic components, especially wafers |
| Goods and Services | Scientific apparatus and instruments for microelectronics, biotechnology, microsystem techniques, semiconductor and nanotechnology, namely, exposure systems for 1X lithography applications, namely, mask aligners and contact and proximity printers and devices for joining one or multiple substrates temporarily or permanently, namely, substrate bonding systems comprised of UV-radiation/UV-light source devices, heaters, and pneumatic and hydraulic piston setups and spindles; systems for the application of coatings to work pieces, namely, resist coaters, developer systems for developing lithographically structured layers, namely, resist developers, imprinting systems used to imprint pattern onto surfaces on work pieces, namely, imprint lithography systems comprised of one or more of the following components, alignment stages for substrate to stamp alignment suitable for a single step or step and repeat alignment, means to apply imprinting force, means to cure the imprint resist such as a UV- light source and heaters, measurement apparatus that can detect the relative position of the stamp versus the substrate and provide the input for the alignment procedure; lamination equipment used to coat surfaces with tape like materials; surveying instruments; electric, photographic, optical, measuring, signal, and monitoring devices, namely, precision systems in the semiconductor technology, in microelectronics, in medical equipment techniques, biotechnology, microsystem techniques, and nanotechnology, namely, front to backside alignment accuracy measurement systems comprised of one or more of the following: measurement apparatus that detects a reference pattern on both the front and on the backside of a substrate and stages that allow for moving the substrate so that the measurement apparatus can detect the pattern at the desired location of the substrate, as well as computer hardware that can analyze the data and calculate misalignment values between the pattern on the front and on the backside; infrared microscopes, metrology systems comprised of one or more of the following, infrared light source devices for infrared inspection of the bonding interface, infrared detectors to detect the infrared light passing through the bond interface, ultrasonic transducers and detectors, x-ray transducers and detectors, visible light light-sources and cameras, microscope setups, computer hardware and operating software for data analysis for the inspection of wafer bonding interfaces; overlay accuracy measurement systems comprised of optical detection devices, namely, microscopes and lasers to detect the positions of two patterns in reference to each other, computer hardware for data analysis and collection, as well as mapping; critical dimension metrology systems comprised of optical detection devices, namely, microscopes and lasers to detect the two or more features of a specific pattern on the wafer and allow for calculation of the distance between them, as well as a computer hardware for data analysis, collection and mapping; pressure uniformity metrology apparatus; apparatus for analysis, namely, front to backside alignment accuracy measurement system comprised of one or more of the following: measurement apparatus that detects a reference pattern on both the front and on the backside of a substrate and stages that allow for moving the substrate so that the measurement apparatus can detect the pattern at the desired location of the substrate, as well as computer hardware and software that can analyze the data and calculate misalignment values between the pattern on the front and on the backside; [ semiconductor chips, integrated circuits; ] computer operation programs; [ peripheral equipment for computers; ] data processing units, data processors and computer hardware; computer software related to the analysis of lithography results, software for the analysis of wafer bonding results, aligning software; scientific diagnosis devices in bio-chip format, namely, oligonucleotide-arrays, miniaturized immunologic test-arrays, substance libraries, combinatorial substance libraries on chip surfaces for scientific purposes; [ remote controls for electric systems for remote controlled industrial operational processes, namely, laboratory robots; ] electric control panels for manufacturing facilities for microelectronics, medical equipment techniques, biotechnology, microsystem techniques, and nanotechnology; [ filters and masks for photographic and photolithographic equipment; telescopes; telephones; semiconductors; ] monitoring devices, namely, oscillographs, indicators, surveying instruments; [ data processing coupler; special furniture for laboratories; ] laser for non-medical purposes; [ reading devices for processing electronic data; ] measuring instruments and measuring devices, namely, laser measuring devices; material testing instruments and machines, namely, machines for testing bonding strength in bonded substrates, front to backside alignment accuracy measurement systems comprised of one or more of the following: measurement apparatus that detect a reference pattern on both the front and on the backside of a substrate and stages that allow for moving the substrate so that the measurement apparatus can detect the pattern at the desired location of the substrate, as well as computer hardware and related software that can analyze the data and calculate misalignment values between the pattern on the front and on the backside; infrared microscopes, metrology systems comprised of one or more of the following; infrared light source devices for infrared inspection of the bonding interface, infrared detectors to detect the infrared light passing through the bond interface, ultrasonic transducers and detectors, x-ray transducers and detectors, visible light light-sources and cameras, microscope setups, computer hardware and related software for data analysis for the inspection of wafer bonding interfaces; optical apparatus and instruments, namely, microscopes; photographic apparatus and instruments, namely, cameras; [ video projectors; controlled volume pumps; protective clothing, in particular for clean-rooms; silicon wafers; probes for scientific purposes; spectroscopes; photographic range finders ] |
| Goods and Services | Medical diagnosis devices in bio-chip format, namely, oligonucleotide-arrays, miniaturized immunologic test-arrays, substance libraries for medical purposes, combinatorial substance libraries on chip surfaces for medical purposes [ ; medical diagnostic devices, namely, micro-titer plates and nano-titer plates; analyzers for medical purposes, namely, machines used to carry out automatic testing of biological samples; bio-array chips for being used as diagnosis means for bio-chemical applications, namely, for tissue and secretory tests, as well as for indication of physiologic parameters or of genetic information, for screening in the pharmaceutical industry for developing drugs, for process monitoring with biotechnological processes; miniaturized sensors for use in gene analysis and diagnosis; medical devices, namely, accessories for bio-chips for filling and manipulating the same by machine as well as manually, namely, chip-holders, chip reader devices, as well as electronic, fluidal, and mechanic control therefor ] |
| Goods and Services | Engineering services; development of precision systems and devices for the semiconductor technology; development of devices for microsystem techniques, microelectronics, medical techniques, biotechnology and telecommunication for others; consulting in the fields of medical and scientific equipment; research services in the field of microsystem technology and nanotechnology; research services in the field of bio-sensorics and chemical sensorics; technical consulting for third parties concerning handling production plants and process equipment; providing temporary use of non-downloadable software for data processing; designing of computer software for others |
| Pseudo Mark | EV GROUP |
| International Class | 007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs. |
| US Class Codes | 013, 019, 021, 023, 031, 034, 035 |
| Class Status Code | 6 - Active |
| Class Status Date | Monday, November 26, 2007 |
| Primary Code | 007 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus. |
| US Class Codes | 021, 023, 026, 036, 038 |
| Class Status Code | 6 - Active |
| Class Status Date | Monday, November 26, 2007 |
| Primary Code | 009 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 010 - Surgical, medical, dental, and veterinary apparatus and instruments, artificial limbs, eyes, and teeth; orthopedic articles; suture materials. |
| US Class Codes | 026, 039, 044 |
| Class Status Code | 6 - Active |
| Class Status Date | Monday, November 26, 2007 |
| Primary Code | 010 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software. |
| US Class Codes | 100, 101 |
| Class Status Code | 6 - Active |
| Class Status Date | Monday, November 26, 2007 |
| Primary Code | 042 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | EV GROUP E. THALLNER GmbH |
| Party Type | 30 - Original Registrant |
| Legal Entity Type | 16 - Limited Liability Company |
| Address | St. Florian am Inn A4782 AT |
| Party Name | EV GROUP E. THALLNER GmbH |
| Party Type | 20 - Owner at Publication |
| Legal Entity Type | 99 - Other |
| Address | AT |
| Party Name | EV GROUP E. THALLNER GmbH |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 99 - Other |
| Address | AT |
| Event Date | Event Description |
| Thursday, June 11, 2020 | NEW REPRESENTATIVE AT IB RECEIVED |
| Friday, February 28, 2020 | PARTIAL INVALIDATION PROCESSED BY THE IB |
| Thursday, January 16, 2020 | PARTIAL INVALIDATION OF REG EXT PROTECTION SENT TO IB |
| Thursday, January 16, 2020 | INVALIDATION PROCESSED |
| Wednesday, December 18, 2019 | PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED |
| Thursday, April 18, 2019 | NOTICE OF ACCEPTANCE OF SEC. 71 - E-MAILED |
| Thursday, April 18, 2019 | REGISTERED-SEC.71 ACCEPTED |
| Thursday, March 28, 2019 | REGISTERED-SEC.71 FILED |
| Tuesday, April 16, 2019 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
| Saturday, April 28, 2018 | COURTESY REMINDER - SEC. 71 (10-YR) E-MAILED |
| Thursday, August 31, 2017 | INTERNATIONAL REGISTRATION RENEWED |
| Friday, May 16, 2014 | NOTICE OF ACCEPTANCE OF SEC. 71 & 15 - E-MAILED |
| Friday, May 16, 2014 | REGISTERED - SEC. 71 ACCEPTED & SEC. 15 ACK. |
| Tuesday, April 29, 2014 | REGISTERED - SEC. 71 & SEC. 15 FILED |
| Friday, May 16, 2014 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
| Tuesday, April 29, 2014 | TEAS SECTION 71 & 15 RECEIVED |
| Saturday, January 12, 2013 | FINAL DECISION TRANSACTION PROCESSED BY IB |
| Friday, August 7, 2009 | FINAL DISPOSITION NOTICE SENT TO IB |
| Friday, August 7, 2009 | FINAL DISPOSITION PROCESSED |
| Tuesday, July 28, 2009 | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB |
| Thursday, June 11, 2009 | CHANGE OF NAME/ADDRESS REC'D FROM IB |
| Thursday, May 7, 2009 | NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB |
| Tuesday, April 28, 2009 | REGISTERED-PRINCIPAL REGISTER |
| Thursday, April 23, 2009 | NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB |
| Thursday, April 23, 2009 | NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB |
| Tuesday, February 10, 2009 | PUBLISHED FOR OPPOSITION |
| Wednesday, January 21, 2009 | NOTICE OF PUBLICATION |
| Tuesday, January 6, 2009 | LAW OFFICE PUBLICATION REVIEW COMPLETED |
| Monday, January 5, 2009 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Tuesday, December 16, 2008 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Monday, December 15, 2008 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Monday, December 15, 2008 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Wednesday, July 30, 2008 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| Wednesday, July 30, 2008 | NON-FINAL ACTION E-MAILED |
| Wednesday, July 30, 2008 | NON-FINAL ACTION WRITTEN |
| Thursday, June 26, 2008 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Wednesday, June 25, 2008 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Thursday, June 26, 2008 | ASSIGNED TO LIE |
| Wednesday, June 25, 2008 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Tuesday, April 29, 2008 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| Tuesday, April 29, 2008 | NON-FINAL ACTION E-MAILED |
| Tuesday, April 29, 2008 | NON-FINAL ACTION WRITTEN |
| Friday, March 28, 2008 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
| Saturday, March 29, 2008 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Friday, March 28, 2008 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Friday, March 28, 2008 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Friday, December 21, 2007 | REFUSAL PROCESSED BY IB |
| Tuesday, December 4, 2007 | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB |
| Tuesday, December 4, 2007 | REFUSAL PROCESSED BY MPU |
| Tuesday, December 4, 2007 | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW |
| Monday, December 3, 2007 | NON-FINAL ACTION WRITTEN |
| Monday, November 26, 2007 | ASSIGNED TO EXAMINER |
| Monday, November 26, 2007 | NEW APPLICATION ENTERED IN TRAM |
| Thursday, November 22, 2007 | SN ASSIGNED FOR SECT 66A APPL FROM IB |