ENZO Trademark

Trademark Overview

On Thursday, April 21, 2022, a trademark application was filed for ENZO with the United States Patent and Trademark Office. The USPTO has given the ENZO trademark a serial number of 97375065. The federal status of this trademark filing is SU - NON-FINAL ACTION - MAILED as of Monday, November 18, 2024. This trademark is owned by Applied Materials, Inc.. The ENZO trademark is filed in the Machinery Products category with the following description:

Semiconductor wafer processing equipment and semiconductor wafer processing equipment components, namely, atomic layer deposition chamber

General Information

Serial Number97375065
Word MarkENZO
Filing DateThursday, April 21, 2022
Status807 - SU - NON-FINAL ACTION - MAILED
Status DateMonday, November 18, 2024
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, January 10, 2023

Trademark Statements

Goods and ServicesSemiconductor wafer processing equipment and semiconductor wafer processing equipment components, namely, atomic layer deposition chamber

Classification Information

International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 024, 031, 034, 035
Class Status Code6 - Active
Class Status DateWednesday, April 27, 2022
Primary Code007
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History

Party NameApplied Materials, Inc.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressSanta Clara, CA 95054
Party NameApplied Materials, Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressSanta Clara, CA 95054

Trademark Events

Event DateEvent Description
Wednesday, December 7, 2022APPROVED FOR PUB - PRINCIPAL REGISTER
Monday, April 25, 2022NEW APPLICATION ENTERED
Wednesday, April 27, 2022NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Tuesday, December 6, 2022ASSIGNED TO EXAMINER
Wednesday, December 21, 2022NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Tuesday, January 10, 2023PUBLISHED FOR OPPOSITION
Tuesday, January 10, 2023OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Tuesday, March 7, 2023NOA E-MAILED - SOU REQUIRED FROM APPLICANT
Thursday, September 7, 2023SOU TEAS EXTENSION RECEIVED
Thursday, September 7, 2023SOU EXTENSION 1 FILED
Thursday, September 7, 2023SOU EXTENSION 1 GRANTED
Saturday, September 9, 2023NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Wednesday, February 7, 2024TEAS CHANGE OF OWNER ADDRESS RECEIVED
Wednesday, February 7, 2024APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED
Wednesday, February 7, 2024TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Wednesday, February 7, 2024ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Wednesday, February 7, 2024TEAS CHANGE OF CORRESPONDENCE RECEIVED
Tuesday, March 5, 2024SOU TEAS EXTENSION RECEIVED
Tuesday, March 5, 2024SOU EXTENSION 2 GRANTED
Tuesday, March 5, 2024SOU EXTENSION 2 FILED
Wednesday, March 6, 2024NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Tuesday, May 7, 2024TEAS CHANGE OF CORRESPONDENCE RECEIVED
Tuesday, May 7, 2024ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Tuesday, May 7, 2024TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Thursday, September 5, 2024TEAS STATEMENT OF USE RECEIVED
Wednesday, November 6, 2024STATEMENT OF USE PROCESSING COMPLETE
Thursday, September 5, 2024USE AMENDMENT FILED
Monday, November 18, 2024NON-FINAL ACTION E-MAILED
Monday, November 18, 2024NOTIFICATION OF NON-FINAL ACTION E-MAILED
Monday, November 18, 2024SU - NON-FINAL ACTION - WRITTEN
Wednesday, November 6, 2024CASE ASSIGNED TO INTENT TO USE PARALEGAL

Related Keywords

enzo semiconductor processing equipment wafer deposition chamber layer components namely atomic