ENCAP Trademark

Trademark Overview

On Thursday, June 28, 2007, a trademark application was filed for ENCAP with the United States Patent and Trademark Office. The USPTO has given the ENCAP trademark a serial number of 77217850. The federal status of this trademark filing is ABANDONED - NO STATEMENT OF USE FILED as of Monday, April 4, 2011. This trademark is owned by Enthone Inc.. The ENCAP trademark is filed in the Chemical Products category with the following description:

electroless plating chemicals used for semiconductor manufacturing
encap

General Information

Serial Number77217850
Word MarkENCAP
Filing DateThursday, June 28, 2007
Status606 - ABANDONED - NO STATEMENT OF USE FILED
Status DateMonday, April 4, 2011
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, December 11, 2007

Trademark Statements

Goods and Serviceselectroless plating chemicals used for semiconductor manufacturing

Classification Information

International Class001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
US Class Codes001, 005, 006, 010, 026, 046
Class Status Code6 - Active
Class Status DateMonday, July 2, 2007
Primary Code001
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History

Party NameEnthone Inc.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressWest Haven, CT 06516
Party NameEnthone Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressWest Haven, CT 06516

Trademark Events

Event DateEvent Description
Monday, April 4, 2011ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED
Monday, April 4, 2011ABANDONMENT - NO USE STATEMENT FILED
Tuesday, June 1, 2010NOTICE OF APPROVAL OF EXTENSION REQUEST MAILED
Sunday, May 30, 2010EXTENSION 5 GRANTED
Thursday, May 27, 2010EXTENSION 5 FILED
Thursday, May 27, 2010TEAS EXTENSION RECEIVED
Monday, January 4, 2010EXTENSION 4 GRANTED
Tuesday, December 8, 2009EXTENSION 4 FILED
Tuesday, December 8, 2009TEAS EXTENSION RECEIVED
Tuesday, September 22, 2009EXTENSION 3 GRANTED
Wednesday, September 2, 2009EXTENSION 3 FILED
Tuesday, September 22, 2009CASE ASSIGNED TO INTENT TO USE PARALEGAL
Wednesday, September 2, 2009TEAS EXTENSION RECEIVED
Thursday, February 5, 2009EXTENSION 2 GRANTED
Thursday, February 5, 2009EXTENSION 2 FILED
Thursday, February 5, 2009TEAS EXTENSION RECEIVED
Tuesday, March 25, 2008EXTENSION 1 GRANTED
Tuesday, March 25, 2008EXTENSION 1 FILED
Tuesday, March 25, 2008TEAS EXTENSION RECEIVED
Tuesday, March 4, 2008NOA MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, December 11, 2007PUBLISHED FOR OPPOSITION
Wednesday, November 21, 2007NOTICE OF PUBLICATION
Tuesday, November 6, 2007LAW OFFICE PUBLICATION REVIEW COMPLETED
Tuesday, November 6, 2007ASSIGNED TO LIE
Wednesday, October 3, 2007APPROVED FOR PUB - PRINCIPAL REGISTER
Wednesday, October 3, 2007EXAMINER'S AMENDMENT MAILED
Wednesday, October 3, 2007EXAMINER'S AMENDMENT ENTERED
Wednesday, October 3, 2007EXAMINERS AMENDMENT -WRITTEN
Friday, September 28, 2007ASSIGNED TO EXAMINER
Monday, July 2, 2007NEW APPLICATION ENTERED IN TRAM

Related Keywords

encap semiconductor manufacturing used chemicals plating electroless