ELITECSP Trademark

Trademark Overview

On Wednesday, March 22, 2006, a trademark application was filed for ELITECSP with the United States Patent and Trademark Office. The USPTO has given the ELITECSP trademark a serial number of 78843235. The federal status of this trademark filing is CANCELLED - SECTION 8 as of Friday, June 8, 2018. This trademark is owned by FlipChip International, LLC. The ELITECSP trademark is filed in the Treatment & Processing of Materials Services category with the following description:

Custom manufacture of semiconductor wafers and chips, namely, solder bumps on electroless metal under bump metallurgy incorporating the adherence of solder spheres to electroless metal on semiconductor wafers and chips
elitecsp

General Information

Serial Number78843235
Word MarkELITECSP
Filing DateWednesday, March 22, 2006
Status710 - CANCELLED - SECTION 8
Status DateFriday, June 8, 2018
Registration Number3332305
Registration DateTuesday, November 6, 2007
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, November 14, 2006

Trademark Statements

Certificate of Correction for RegistrationIn the statement, Column 1, line 2, "CORPORATION" should be deleted, and COMPANY should be inserted.
Goods and ServicesCustom manufacture of semiconductor wafers and chips, namely, solder bumps on electroless metal under bump metallurgy incorporating the adherence of solder spheres to electroless metal on semiconductor wafers and chips
Pseudo MarkELITE CSP

Classification Information

International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status Code2 - Sec. 8 - Entire Registration
Class Status DateFriday, June 8, 2018
Primary Code040
First Use Anywhere DateMonday, April 25, 2005
First Use In Commerce DateMonday, April 25, 2005

Trademark Owner History

Party NameFlipChip International, LLC
Party Type30 - Original Registrant
Legal Entity Type11 - Company
AddressPhoenix, AZ 85034
Party NameFlipChip International, LLC
Party Type20 - Owner at Publication
Legal Entity Type11 - Company
AddressPhoenix, AZ 85034
Party NameFlipChip International, LLC
Party Type10 - Original Applicant
Legal Entity Type11 - Company
AddressPhoenix, AZ 85034

Trademark Events

Event DateEvent Description
Friday, June 8, 2018CANCELLED SEC. 8 (10-YR)/EXPIRED SECTION 9
Sunday, November 6, 2016COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
Wednesday, July 30, 2014NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED
Wednesday, July 30, 2014REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
Wednesday, July 30, 2014CORRECTION UNDER SECTION 7 ¿ PROCESSED
Thursday, March 20, 2014TEAS RESPONSE TO OFFICE ACTION-POST REG RECEIVED
Thursday, November 7, 2013POST REGISTRATION ACTION MAILED - SEC. 8 & 15
Thursday, November 7, 2013CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Tuesday, October 22, 2013TEAS SECTION 8 & 15 RECEIVED
Tuesday, November 6, 2007REGISTERED-PRINCIPAL REGISTER
Wednesday, October 3, 2007LAW OFFICE REGISTRATION REVIEW COMPLETED
Tuesday, October 2, 2007ASSIGNED TO LIE
Monday, September 3, 2007ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
Thursday, August 30, 2007STATEMENT OF USE PROCESSING COMPLETE
Thursday, August 30, 2007EXTENSION 1 GRANTED
Thursday, July 5, 2007USE AMENDMENT FILED
Thursday, July 5, 2007EXTENSION 1 FILED
Thursday, July 5, 2007TEAS EXTENSION RECEIVED
Thursday, July 5, 2007TEAS STATEMENT OF USE RECEIVED
Tuesday, February 6, 2007NOA MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, November 14, 2006PUBLISHED FOR OPPOSITION
Wednesday, October 25, 2006NOTICE OF PUBLICATION
Monday, September 25, 2006LAW OFFICE PUBLICATION REVIEW COMPLETED
Friday, September 8, 2006ASSIGNED TO LIE
Thursday, September 7, 2006APPROVED FOR PUB - PRINCIPAL REGISTER
Thursday, September 7, 2006EXAMINER'S AMENDMENT ENTERED
Thursday, September 7, 2006EXAMINERS AMENDMENT E-MAILED
Thursday, September 7, 2006EXAMINERS AMENDMENT -WRITTEN
Wednesday, September 6, 2006ASSIGNED TO EXAMINER
Tuesday, April 11, 2006NOTICE OF PSEUDO MARK MAILED
Wednesday, March 29, 2006NEW APPLICATION ENTERED IN TRAM

Related Keywords

elitecsp metal solder chips wafers electroless semiconductor metallurgy adherence spheres bump