ELEP MOUNT Trademark

Trademark Overview


On Wednesday, March 11, 2015, a trademark application was filed for ELEP MOUNT with the United States Patent and Trademark Office. The USPTO has given the ELEP MOUNT trademark a serial number of 79169596. The federal status of this trademark filing is Section 71 & 15 - ACCEPTED AND ACKNOWLEDGED as of Thursday, June 2, 2022. This trademark is owned by NITTO DENKO CORPORATION. The ELEP MOUNT trademark is filed in the Chemical Products and Rubber Products categories with the following description:

[Plastic in sheet form for use in the manufacture of circuit boards; plastic films for use in the manufacture of circuit boards; bonding sheets made out of plastic for use in the manufacture of circuit boards; glue * plastic * films for use in the manufacture of circuit boards; electrically conductive bonding sheets made out of plastic for use in the manufacture of circuit boards; electrically conductive glue film made out of plastic for use in the manufacture of circuit boards; thermoconductive bonding * plastic * sheets for use in the manufacture of circuit boards; thermoconductive glue * plastic * films for use in the manufacture of circuit boards; sealing agents for use in the manufacture of semi-conductor chips;] sealing agents in film form for use in the manufacture of semi-conductor chips; adhesive films made out of plastic, namely, die attach films with dicing tape; plastic film with pressure-sensitive adhesive for use in the manufacture of semiconductor wafers

[Adhesives for industrial purposes; adhesives in sheet form for use in further manufacture; industrial adhesives, namely, sealing agents and sealing agents in sheet form; industrial adhesives, namely, electrically conductive adhesives and electrically conductive adhesives in sheet form; industrial adhesives, namely, thermoconductive adhesives and thermoconductive adhesives in sheet form;] adhesives for use in the manufacture of semiconductor wafers; adhesives in sheet form for use in the manufacture of semiconductor wafers
elep mount

General Information


Serial Number79169596
Word MarkELEP MOUNT
Filing DateWednesday, March 11, 2015
Status739 - Section 71 & 15 - ACCEPTED AND ACKNOWLEDGED
Status DateThursday, June 2, 2022
Registration Number4891047
Registration DateTuesday, January 26, 2016
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, November 10, 2015

Trademark Statements


Certificate of Correction for RegistrationIn the statement, in both line 17 and line 22, after "GLUE", "PLASTIC" should be inserted. In the statement, line 21, after "BONDING", "PLASTIC" should be inserted.
Goods and Services[Plastic in sheet form for use in the manufacture of circuit boards; plastic films for use in the manufacture of circuit boards; bonding sheets made out of plastic for use in the manufacture of circuit boards; glue * plastic * films for use in the manufacture of circuit boards; electrically conductive bonding sheets made out of plastic for use in the manufacture of circuit boards; electrically conductive glue film made out of plastic for use in the manufacture of circuit boards; thermoconductive bonding * plastic * sheets for use in the manufacture of circuit boards; thermoconductive glue * plastic * films for use in the manufacture of circuit boards; sealing agents for use in the manufacture of semi-conductor chips;] sealing agents in film form for use in the manufacture of semi-conductor chips; adhesive films made out of plastic, namely, die attach films with dicing tape; plastic film with pressure-sensitive adhesive for use in the manufacture of semiconductor wafers
Translation of Words in MarkThe wording "ELEP" has no meaning in a foreign language.
Goods and Services[Adhesives for industrial purposes; adhesives in sheet form for use in further manufacture; industrial adhesives, namely, sealing agents and sealing agents in sheet form; industrial adhesives, namely, electrically conductive adhesives and electrically conductive adhesives in sheet form; industrial adhesives, namely, thermoconductive adhesives and thermoconductive adhesives in sheet form;] adhesives for use in the manufacture of semiconductor wafers; adhesives in sheet form for use in the manufacture of semiconductor wafers
NOT AVAILABLE"MOUNT"

Classification Information


International Class001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
US Class Codes001, 005, 006, 010, 026, 046
Class Status Code6 - Active
Class Status DateWednesday, August 5, 2015
Primary Code001
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class017 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal.
US Class Codes001, 005, 012, 013, 035, 050
Class Status Code6 - Active
Class Status DateWednesday, August 5, 2015
Primary Code017
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameNITTO DENKO CORPORATION
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressOsaka 5678680
JP

Party NameNITTO DENKO CORPORATION
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressOsaka 5678680
JP

Party NameNITTO DENKO CORPORATION
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressOsaka 5678680
JP

Trademark Events


Event DateEvent Description
Thursday, July 30, 2015SN ASSIGNED FOR SECT 66A APPL FROM IB
Wednesday, August 5, 2015NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Wednesday, August 5, 2015ASSIGNED TO EXAMINER
Tuesday, August 11, 2015APPLICATION FILING RECEIPT MAILED
Tuesday, August 18, 2015NON-FINAL ACTION WRITTEN
Wednesday, August 19, 2015NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
Thursday, August 20, 2015NON-FINAL ACTION (IB REFUSAL) WITHDRAWN FOR REVIEW
Monday, August 24, 2015NON-FINAL ACTION WRITTEN
Tuesday, August 25, 2015NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
Tuesday, August 25, 2015REFUSAL PROCESSED BY MPU
Tuesday, August 25, 2015NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
Tuesday, September 8, 2015TEAS RESPONSE TO OFFICE ACTION RECEIVED
Saturday, September 12, 2015REFUSAL PROCESSED BY IB
Tuesday, September 22, 2015ASSIGNED TO LIE
Tuesday, September 29, 2015CORRESPONDENCE RECEIVED IN LAW OFFICE
Tuesday, September 29, 2015TEAS/EMAIL CORRESPONDENCE ENTERED
Monday, October 5, 2015APPROVED FOR PUB - PRINCIPAL REGISTER
Monday, October 5, 2015LAW OFFICE PUBLICATION REVIEW COMPLETED
Wednesday, October 21, 2015NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Wednesday, November 4, 2015NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB
Wednesday, November 4, 2015NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
Tuesday, November 10, 2015PUBLISHED FOR OPPOSITION
Tuesday, November 10, 2015OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Friday, November 20, 2015NOTIFICATION PROCESSED BY IB
Tuesday, January 26, 2016REGISTERED-PRINCIPAL REGISTER
Tuesday, April 26, 2016FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB
Wednesday, April 27, 2016FINAL DISPOSITION PROCESSED
Wednesday, April 27, 2016FINAL DISPOSITION NOTICE SENT TO IB
Thursday, May 5, 2016LIMITATION OF GOODS RECEIVED FROM IB
Monday, May 9, 2016CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Monday, May 9, 2016CORRECTION UNDER SECTION 7 - PROCESSED
Monday, May 9, 2016LIMITATION FROM THE IB EXAMINED AND ENTERED
Friday, July 15, 2016FINAL DECISION TRANSACTION PROCESSED BY IB
Monday, January 9, 2017PARTIAL INVALIDATION OF REG EXT PROTECTION CREATED
Thursday, April 6, 2017INVALIDATION REVIEWED - NO ACTION REQUIRED BY OFFICE
Tuesday, January 26, 2021COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED
Friday, November 26, 2021TEAS SECTION 71 & 15 RECEIVED
Tuesday, May 24, 2022CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Thursday, June 2, 2022REGISTERED - SEC. 71 ACCEPTED & SEC. 15 ACK.
Thursday, June 2, 2022NOTICE OF ACCEPTANCE OF SEC. 71 & 15 - E-MAILED
Friday, October 11, 2024NEW REPRESENTATIVE AT IB RECEIVED
Thursday, November 21, 2024INTERNATIONAL REGISTRATION RENEWED
Sunday, January 26, 2025COURTESY REMINDER - SEC. 71 (10-YR) E-MAILED