ELEP MOUNT Trademark

Trademark Overview

On Friday, August 4, 2006, a trademark application was filed for ELEP MOUNT with the United States Patent and Trademark Office. The USPTO has given the ELEP MOUNT trademark a serial number of 78944925. The federal status of this trademark filing is CANCELLED - SECTION 8 as of Friday, August 25, 2017. This trademark is owned by NITTO DENKO CORPORATION. The ELEP MOUNT trademark is filed in the Rubber Products category with the following description:

Die attach film with dicing tape, namely, polymer film used for manufacturing electronic circuits, conductive polymer film used for manufacturing semiconductor wafers; dicing tape
elep mount

General Information

Serial Number78944925
Word MarkELEP MOUNT
Filing DateFriday, August 4, 2006
Status710 - CANCELLED - SECTION 8
Status DateFriday, August 25, 2017
Registration Number3909391
Registration DateTuesday, January 18, 2011
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, August 28, 2007

Trademark Statements

Goods and ServicesDie attach film with dicing tape, namely, polymer film used for manufacturing electronic circuits, conductive polymer film used for manufacturing semiconductor wafers; dicing tape

Classification Information

International Class017 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal.
US Class Codes001, 005, 012, 013, 035, 050
Class Status Code2 - Sec. 8 - Entire Registration
Class Status DateFriday, August 25, 2017
Primary Code017
First Use Anywhere DateMonday, November 8, 2010
First Use In Commerce DateMonday, November 8, 2010

Trademark Owner History

Party NameNITTO DENKO CORPORATION
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressOsaka
JP
Party NameNITTO DENKO CORPORATION
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressOsaka
JP
Party NameNITTO DENKO CORPORATION
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressOsaka
JP

Trademark Events

Event DateEvent Description
Friday, August 25, 2017CANCELLED SEC. 8 (6-YR)
Tuesday, January 18, 2011REGISTERED-PRINCIPAL REGISTER
Friday, December 17, 2010NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED
Thursday, December 16, 2010LAW OFFICE REGISTRATION REVIEW COMPLETED
Thursday, December 16, 2010ASSIGNED TO LIE
Wednesday, November 24, 2010ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
Tuesday, November 16, 2010STATEMENT OF USE PROCESSING COMPLETE
Friday, November 12, 2010USE AMENDMENT FILED
Friday, November 12, 2010TEAS STATEMENT OF USE RECEIVED
Wednesday, June 16, 2010NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Tuesday, June 15, 2010EXTENSION 5 GRANTED
Thursday, May 20, 2010EXTENSION 5 FILED
Friday, June 11, 2010CASE ASSIGNED TO INTENT TO USE PARALEGAL
Thursday, May 20, 2010TEAS EXTENSION RECEIVED
Monday, November 16, 2009EXTENSION 4 GRANTED
Monday, November 16, 2009EXTENSION 4 FILED
Monday, November 16, 2009TEAS EXTENSION RECEIVED
Thursday, April 23, 2009EXTENSION 3 GRANTED
Thursday, April 23, 2009EXTENSION 3 FILED
Thursday, April 23, 2009TEAS EXTENSION RECEIVED
Tuesday, November 11, 2008EXTENSION 2 GRANTED
Tuesday, November 11, 2008EXTENSION 2 FILED
Tuesday, November 11, 2008TEAS EXTENSION RECEIVED
Friday, May 16, 2008EXTENSION 1 GRANTED
Friday, May 16, 2008EXTENSION 1 FILED
Friday, May 16, 2008TEAS EXTENSION RECEIVED
Tuesday, November 20, 2007NOA MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, August 28, 2007PUBLISHED FOR OPPOSITION
Wednesday, August 8, 2007NOTICE OF PUBLICATION
Monday, July 23, 2007LAW OFFICE PUBLICATION REVIEW COMPLETED
Monday, July 23, 2007ASSIGNED TO LIE
Thursday, June 14, 2007APPROVED FOR PUB - PRINCIPAL REGISTER
Wednesday, June 13, 2007TEAS/EMAIL CORRESPONDENCE ENTERED
Wednesday, June 13, 2007CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, June 13, 2007TEAS RESPONSE TO OFFICE ACTION RECEIVED
Saturday, December 30, 2006NON-FINAL ACTION E-MAILED
Saturday, December 30, 2006NON-FINAL ACTION WRITTEN
Friday, December 29, 2006ASSIGNED TO EXAMINER
Tuesday, August 8, 2006NEW APPLICATION ENTERED IN TRAM

Related Keywords

mount elep film manufacturing polymer used dicing tape semiconductor wafers conductive electronic