ECO SOLDER Trademark

Trademark Overview

On Thursday, June 13, 2002, a trademark application was filed for ECO SOLDER with the United States Patent and Trademark Office. The USPTO has given the ECO SOLDER trademark a serial number of 76420753. The federal status of this trademark filing is REGISTERED AND RENEWED as of Thursday, May 23, 2024. This trademark is owned by Senju Metal Industry Co., Ltd.. The ECO SOLDER trademark is filed in the Metal Products category with the following description:

Solder, solder paste, solder wire, solder form, solder ball, ingot solder and lead-free solder
eco solder

General Information

Serial Number76420753
Word MarkECO SOLDER
Filing DateThursday, June 13, 2002
Status800 - REGISTERED AND RENEWED
Status DateThursday, May 23, 2024
Registration Number2828380
Registration DateTuesday, March 30, 2004
Mark Drawing1 - Typeset: Word(s) / letter(s) / number(s)
Published for Opposition DateTuesday, March 11, 2003

Trademark Statements

Goods and ServicesSolder, solder paste, solder wire, solder form, solder ball, ingot solder and lead-free solder
NOT AVAILABLE"SOLDER"

Classification Information

International Class006 - Common metals and their alloys; metal building materials; transportable buildings of metal; materials of metal for railway tracks; nonelectric cables and wires of common metal; ironmongery, small items of metal hardware; pipes and tubes of metal; safes; goods of common metal not included in other classes; ores.
US Class Codes002, 012, 013, 014, 023, 025, 050
Class Status Code6 - Active
Class Status DateFriday, August 2, 2002
Primary Code006
First Use Anywhere DateMonday, April 3, 2000
First Use In Commerce DateFriday, July 19, 2002

Trademark Owner History

Party NameSenju Metal Industry Co., Ltd.
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressTokyo 120-8555
JP
Party NameSenju Metal Industry Co., Ltd.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressTokyo
JP
Party NameSenju Metal Industry Co., Ltd.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressTokyo
JP

Trademark Events

Event DateEvent Description
Friday, January 17, 2003APPROVED FOR PUB - PRINCIPAL REGISTER
Monday, December 1, 2003SOU EXTENSION 1 FILED
Tuesday, October 29, 2002ASSIGNED TO EXAMINER
Wednesday, October 30, 2002ASSIGNED TO EXAMINER
Friday, November 8, 2002NON-FINAL ACTION MAILED
Monday, January 13, 2003EXAMINERS AMENDMENT MAILED
Wednesday, February 19, 2003NOTICE OF PUBLICATION
Tuesday, March 11, 2003PUBLISHED FOR OPPOSITION
Tuesday, June 3, 2003NOA MAILED - SOU REQUIRED FROM APPLICANT
Monday, December 1, 2003PAPER RECEIVED
Monday, December 1, 2003USE AMENDMENT FILED
Wednesday, January 14, 2004SOU EXTENSION 1 GRANTED
Wednesday, January 14, 2004STATEMENT OF USE PROCESSING COMPLETE
Thursday, January 22, 2004CASE FILE IN TICRS
Friday, January 23, 2004ASSIGNED TO EXAMINER
Tuesday, February 2, 2010TEAS SECTION 8 & 15 RECEIVED
Wednesday, February 10, 2010CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Thursday, February 11, 2010REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
Friday, January 23, 2004ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
Tuesday, March 30, 2004REGISTERED-PRINCIPAL REGISTER
Friday, March 7, 2014TEAS SECTION 8 & 9 RECEIVED
Thursday, March 27, 2014NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
Thursday, March 30, 2023COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
Thursday, May 23, 2024CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Friday, March 7, 2014REGISTERED - COMBINED SECTION 8 (10-YR) & SEC. 9 FILED
Thursday, March 27, 2014REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
Thursday, March 27, 2014REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS)
Thursday, March 27, 2014CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Monday, February 12, 2024TEAS SECTION 8 & 9 RECEIVED
Thursday, May 23, 2024REGISTERED AND RENEWED (SECOND RENEWAL - 10 YRS)
Thursday, May 23, 2024REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
Thursday, May 23, 2024NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED

Related Keywords

solder lead free ingot form paste wire ball