ECO SOLDER Trademark

Trademark Overview

On Thursday, April 27, 2000, a trademark application was filed for ECO SOLDER with the United States Patent and Trademark Office. The USPTO has given the ECO SOLDER trademark a serial number of 76036301. The federal status of this trademark filing is REGISTERED AND RENEWED as of Thursday, July 6, 2023. This trademark is owned by Senju Metal Industry Co., Ltd.. The ECO SOLDER trademark is filed in the Metal Products category with the following description:

Solder, solder paste, solder wire, solder form, solder ball, ingot solder and lead-free solder
eco solder

General Information

Serial Number76036301
Word MarkECO SOLDER
Filing DateThursday, April 27, 2000
Status800 - REGISTERED AND RENEWED
Status DateThursday, July 6, 2023
Registration Number2678661
Registration DateTuesday, January 21, 2003
Mark Drawing3000 - Illustration: Drawing or design which also includes word(s) / letter(s) / number(s)
Published for Opposition DateTuesday, January 15, 2002

Trademark Statements

Goods and ServicesSolder, solder paste, solder wire, solder form, solder ball, ingot solder and lead-free solder
Disclaimer with Predetermined Text"SOLDER"
Lining/Stippling StatementThe lining is a feature of the mark and does not indicate color.

Classification Information

International Class006 - Common metals and their alloys; metal building materials; transportable buildings of metal; materials of metal for railway tracks; nonelectric cables and wires of common metal; ironmongery, small items of metal hardware; pipes and tubes of metal; safes; goods of common metal not included in other classes; ores.
US Class Codes002, 012, 013, 014, 023, 025, 050
Class Status Code6 - Active
Class Status DateFriday, July 7, 2000
Primary Code006
First Use Anywhere DateMonday, April 3, 2000
First Use In Commerce DateFriday, July 19, 2002

Trademark Owner History

Party NameSenju Metal Industry Co., Ltd.
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressTokyo 120-8555
JP
Party NameSenju Metal Industry Co., Ltd.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressTokyo
JP
Party NameSenju Metal Industry Co., Ltd.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressTokyo
JP

Trademark Events

Event DateEvent Description
Thursday, July 6, 2023NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
Thursday, July 6, 2023REGISTERED AND RENEWED (SECOND RENEWAL - 10 YRS)
Thursday, July 6, 2023REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
Thursday, July 6, 2023CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Monday, December 12, 2022TEAS SECTION 8 & 9 RECEIVED
Friday, January 21, 2022COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
Thursday, February 7, 2013NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
Thursday, February 7, 2013REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS)
Thursday, February 7, 2013REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
Thursday, February 7, 2013CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Tuesday, January 22, 2013TEAS SECTION 8 & 9 RECEIVED
Saturday, January 31, 2009REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
Tuesday, January 13, 2009TEAS SECTION 8 & 15 RECEIVED
Monday, December 31, 2007CASE FILE IN TICRS
Tuesday, January 21, 2003REGISTERED-PRINCIPAL REGISTER
Friday, November 15, 2002ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
Friday, October 4, 2002STATEMENT OF USE PROCESSING COMPLETE
Friday, October 4, 2002USE AMENDMENT FILED
Friday, October 4, 2002SOU EXTENSION 1 GRANTED
Friday, October 4, 2002SOU EXTENSION 1 FILED
Friday, October 4, 2002PAPER RECEIVED
Tuesday, April 9, 2002NOA MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, January 15, 2002PUBLISHED FOR OPPOSITION
Wednesday, December 26, 2001NOTICE OF PUBLICATION
Tuesday, July 31, 2001APPROVED FOR PUB - PRINCIPAL REGISTER
Tuesday, May 1, 2001CORRESPONDENCE RECEIVED IN LAW OFFICE
Friday, November 3, 2000NON-FINAL ACTION MAILED
Thursday, October 26, 2000ASSIGNED TO EXAMINER
Tuesday, October 24, 2000ASSIGNED TO EXAMINER

Related Keywords

solder lead free ingot form paste wire ball