DTB Trademark
Trademark Overview
On Wednesday, January 14, 2026, a trademark application was filed for DTB with the United States Patent and Trademark Office. The USPTO has given the DTB trademark a serial number of 99595335. The federal status of this trademark filing is NON-FINAL ACTION - MAILED as of Friday, May 22, 2026. This trademark is owned by TAZMO CO., LTD.. The DTB trademark is filed in the Machinery Products, Rubber Products, and Treatment & Processing of Materials Services categories with the following description:
Laminating of adhesive tapes and self-adhesive tapes; Peeling of adhesive tapes and self-adhesive tapes; Treatment and processing of plastic films and sheets; Electron beam irradiation treatment for resin; Treatment and processing of semiconductors or wafers; Resin coating processing of semiconductors or wafers; Rental of semiconductor manufacturing machines and apparatus
Semiconductor manufacturing machines; electric irradiation apparatus for use in the manufacture of semiconductors; Apparatus for adhesion of protective tapes for the front surfaces of semiconductor chips and of protective tapes for the rear surfaces of semiconductor chips for use in the manufacture of semiconductors; Peeling apparatus of protective tapes for the front surfaces of semiconductor chips and of protective tapes for the rear surfaces of semiconductor chips for use in the manufacture of semiconductors; Apparatus for adhesion for use in the manufacture of semiconductors; Bonding apparatus for use in the manufacture of semiconductors; Die bonders; Mounting apparatus for mounting IC chips and other electronic components onto circuit boards
Plastic semi-worked products; Adhesive or adhesive-coated plastic films and plastic sheets; Adhesive tapes and self-adhesive tapes for use in the processing of semiconductors; Adhesive tapes and self-adhesive tapes for use in the mounting of semiconductors; Tapes for use in the peeling of tapes for semiconductor wafer processing; Pressure-sensitive self-adhesive tapes and pressure-sensitive adhesive tapes for use in the manufacture of electronic parts; Protective tapes for the rear surfaces of semiconductor chips
General Information
| Serial Number | 99595335 |
| Word Mark | DTB |
| Filing Date | Wednesday, January 14, 2026 |
| Status | 641 - NON-FINAL ACTION - MAILED |
| Status Date | Friday, May 22, 2026 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | NOT AVAILABLE |
Trademark Statements
| Goods and Services | Laminating of adhesive tapes and self-adhesive tapes; Peeling of adhesive tapes and self-adhesive tapes; Treatment and processing of plastic films and sheets; Electron beam irradiation treatment for resin; Treatment and processing of semiconductors or wafers; Resin coating processing of semiconductors or wafers; Rental of semiconductor manufacturing machines and apparatus |
| Goods and Services | Semiconductor manufacturing machines; electric irradiation apparatus for use in the manufacture of semiconductors; Apparatus for adhesion of protective tapes for the front surfaces of semiconductor chips and of protective tapes for the rear surfaces of semiconductor chips for use in the manufacture of semiconductors; Peeling apparatus of protective tapes for the front surfaces of semiconductor chips and of protective tapes for the rear surfaces of semiconductor chips for use in the manufacture of semiconductors; Apparatus for adhesion for use in the manufacture of semiconductors; Bonding apparatus for use in the manufacture of semiconductors; Die bonders; Mounting apparatus for mounting IC chips and other electronic components onto circuit boards |
| Goods and Services | Plastic semi-worked products; Adhesive or adhesive-coated plastic films and plastic sheets; Adhesive tapes and self-adhesive tapes for use in the processing of semiconductors; Adhesive tapes and self-adhesive tapes for use in the mounting of semiconductors; Tapes for use in the peeling of tapes for semiconductor wafer processing; Pressure-sensitive self-adhesive tapes and pressure-sensitive adhesive tapes for use in the manufacture of electronic parts; Protective tapes for the rear surfaces of semiconductor chips |
Classification Information
| International Class | 007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs. |
| US Class Codes | 013, 019, 021, 023, 024, 031, 034, 035 |
| Class Status Code | 6 - Active |
| Class Status Date | Wednesday, January 14, 2026 |
| Primary Code | 007 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 017 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal. |
| US Class Codes | 001, 005, 012, 013, 035, 050 |
| Class Status Code | 6 - Active |
| Class Status Date | Wednesday, January 14, 2026 |
| Primary Code | 017 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 040 - Treatment of materials. |
| US Class Codes | 100, 103, 106 |
| Class Status Code | 6 - Active |
| Class Status Date | Wednesday, January 14, 2026 |
| Primary Code | 040 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
Trademark Owner History
| Party Name | Lintec Kabushiki Kaisha |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 29 - NOT AVAILABLE |
| Address | Tokyo 173-0001
JP |
| Party Name | TAZMO CO., LTD. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 29 - NOT AVAILABLE |
| Address | Okayama 701-1221
JP |
Trademark Events
| Event Date | Event Description |
| Wednesday, January 14, 2026 | NEW APPLICATION ENTERED |
| Wednesday, January 14, 2026 | APPLICATION FILING RECEIPT MAILED |
| Sunday, May 3, 2026 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Wednesday, May 13, 2026 | ASSIGNED TO EXAMINER |
| Friday, May 22, 2026 | NON-FINAL ACTION WRITTEN |
| Friday, May 22, 2026 | NON-FINAL ACTION E-MAILED |
| Friday, May 22, 2026 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
