DTB Trademark

Trademark Overview

On Wednesday, January 14, 2026, a trademark application was filed for DTB with the United States Patent and Trademark Office. The USPTO has given the DTB trademark a serial number of 99595335. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Wednesday, January 14, 2026. This trademark is owned by TAZMO CO., LTD.. The DTB trademark is filed in the Machinery Products, Rubber Products, and Treatment & Processing of Materials Services categories with the following description:

Laminating of adhesive tapes and self-adhesive tapes; Peeling of adhesive tapes and self-adhesive tapes; Treatment and processing of plastic films and sheets; Electron beam irradiation treatment for resin; Treatment and processing of semiconductors or wafers; Resin coating processing of semiconductors or wafers; Rental of semiconductor manufacturing machines and apparatus

Semiconductor manufacturing machines; electric irradiation apparatus for use in the manufacture of semiconductors; Apparatus for adhesion of protective tapes for the front surfaces of semiconductor chips and of protective tapes for the rear surfaces of semiconductor chips for use in the manufacture of semiconductors; Peeling apparatus of protective tapes for the front surfaces of semiconductor chips and of protective tapes for the rear surfaces of semiconductor chips for use in the manufacture of semiconductors; Apparatus for adhesion for use in the manufacture of semiconductors; Bonding apparatus for use in the manufacture of semiconductors; Die bonders; Mounting apparatus for mounting IC chips and other electronic components onto circuit boards

Plastic semi-worked products; Adhesive or adhesive-coated plastic films and plastic sheets; Adhesive tapes and self-adhesive tapes for use in the processing of semiconductors; Adhesive tapes and self-adhesive tapes for use in the mounting of semiconductors; Tapes for use in the peeling of tapes for semiconductor wafer processing; Pressure-sensitive self-adhesive tapes and pressure-sensitive adhesive tapes for use in the manufacture of electronic parts; Protective tapes for the rear surfaces of semiconductor chips
dtb

General Information

Serial Number99595335
Word MarkDTB
Filing DateWednesday, January 14, 2026
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateWednesday, January 14, 2026
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements

Goods and ServicesLaminating of adhesive tapes and self-adhesive tapes; Peeling of adhesive tapes and self-adhesive tapes; Treatment and processing of plastic films and sheets; Electron beam irradiation treatment for resin; Treatment and processing of semiconductors or wafers; Resin coating processing of semiconductors or wafers; Rental of semiconductor manufacturing machines and apparatus
Goods and ServicesSemiconductor manufacturing machines; electric irradiation apparatus for use in the manufacture of semiconductors; Apparatus for adhesion of protective tapes for the front surfaces of semiconductor chips and of protective tapes for the rear surfaces of semiconductor chips for use in the manufacture of semiconductors; Peeling apparatus of protective tapes for the front surfaces of semiconductor chips and of protective tapes for the rear surfaces of semiconductor chips for use in the manufacture of semiconductors; Apparatus for adhesion for use in the manufacture of semiconductors; Bonding apparatus for use in the manufacture of semiconductors; Die bonders; Mounting apparatus for mounting IC chips and other electronic components onto circuit boards
Goods and ServicesPlastic semi-worked products; Adhesive or adhesive-coated plastic films and plastic sheets; Adhesive tapes and self-adhesive tapes for use in the processing of semiconductors; Adhesive tapes and self-adhesive tapes for use in the mounting of semiconductors; Tapes for use in the peeling of tapes for semiconductor wafer processing; Pressure-sensitive self-adhesive tapes and pressure-sensitive adhesive tapes for use in the manufacture of electronic parts; Protective tapes for the rear surfaces of semiconductor chips

Classification Information

International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 024, 031, 034, 035
Class Status Code6 - Active
Class Status DateWednesday, January 14, 2026
Primary Code007
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE
International Class017 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal.
US Class Codes001, 005, 012, 013, 035, 050
Class Status Code6 - Active
Class Status DateWednesday, January 14, 2026
Primary Code017
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE
International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status Code6 - Active
Class Status DateWednesday, January 14, 2026
Primary Code040
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History

Party NameLintec Kabushiki Kaisha
Party Type10 - Original Applicant
Legal Entity Type29 - NOT AVAILABLE
AddressTokyo 173-0001
JP
Party NameTAZMO CO., LTD.
Party Type10 - Original Applicant
Legal Entity Type29 - NOT AVAILABLE
AddressOkayama 701-1221
JP

Trademark Events

Event DateEvent Description
Wednesday, January 14, 2026NEW APPLICATION ENTERED
Wednesday, January 14, 2026APPLICATION FILING RECEIPT MAILED

Related Keywords

tapes adhesive semiconductors semiconductor apparatus chips manufacture surfaces protective processing