DFX Trademark

Trademark Overview

On Thursday, November 9, 2017, a trademark application was filed for DFX with the United States Patent and Trademark Office. The USPTO has given the DFX trademark a serial number of 87677877. The federal status of this trademark filing is REGISTERED as of Tuesday, June 30, 2020. This trademark is owned by Disco Corporation. The DFX trademark is filed in the Machinery Products category with the following description:

Semiconductor wafer processing machines, namely, machines for stretching a plastic film to which a semiconductor wafer weakened along a number of cutting lines is adhered to thereby cut the semiconductor wafer along the cutting lines; semiconductor manufacturing machines
dfx

General Information

Serial Number87677877
Word MarkDFX
Filing DateThursday, November 9, 2017
Status700 - REGISTERED
Status DateTuesday, June 30, 2020
Registration Number6091407
Registration DateTuesday, June 30, 2020
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, August 14, 2018

Trademark Statements

Goods and ServicesSemiconductor wafer processing machines, namely, machines for stretching a plastic film to which a semiconductor wafer weakened along a number of cutting lines is adhered to thereby cut the semiconductor wafer along the cutting lines; semiconductor manufacturing machines

Classification Information

International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 031, 034, 035
Class Status Code6 - Active
Class Status DateMonday, November 20, 2017
Primary Code007
First Use Anywhere DateWednesday, December 13, 2017
First Use In Commerce DateWednesday, December 20, 2017

Trademark Owner History

Party NameDisco Corporation
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressTokyo 143-8580
JP
Party NameDisco Corporation
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressTokyo 143-8580
JP
Party NameDisco Corporation
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressTokyo 143-8580
JP

Trademark Events

Event DateEvent Description
Monday, November 13, 2017NEW APPLICATION ENTERED
Thursday, February 22, 2018ASSIGNED TO EXAMINER
Tuesday, July 3, 2018CORRESPONDENCE RECEIVED IN LAW OFFICE
Tuesday, July 3, 2018TEAS/EMAIL CORRESPONDENCE ENTERED
Wednesday, July 4, 2018APPROVED FOR PUB - PRINCIPAL REGISTER
Monday, November 20, 2017NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Tuesday, February 27, 2018PRIORITY ACTION WRITTEN
Tuesday, February 27, 2018PRIORITY ACTION E-MAILED
Tuesday, February 27, 2018NOTIFICATION OF PRIORITY ACTION E-MAILED
Monday, March 26, 2018TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Monday, March 26, 2018ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Tuesday, July 3, 2018TEAS RESPONSE TO OFFICE ACTION RECEIVED
Wednesday, July 25, 2018NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Tuesday, August 14, 2018OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Friday, March 22, 2019NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Wednesday, September 18, 2019SOU TEAS EXTENSION RECEIVED
Wednesday, September 18, 2019SOU EXTENSION 2 FILED
Tuesday, August 14, 2018PUBLISHED FOR OPPOSITION
Tuesday, October 9, 2018NOA E-MAILED - SOU REQUIRED FROM APPLICANT
Wednesday, March 20, 2019SOU TEAS EXTENSION RECEIVED
Wednesday, March 20, 2019SOU EXTENSION 1 FILED
Wednesday, March 20, 2019SOU EXTENSION 1 GRANTED
Wednesday, September 18, 2019SOU EXTENSION 2 GRANTED
Tuesday, May 26, 2020ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
Wednesday, May 27, 2020NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED
Tuesday, June 30, 2020REGISTERED-PRINCIPAL REGISTER
Monday, June 30, 2025COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED
Saturday, April 18, 2020CASE ASSIGNED TO INTENT TO USE PARALEGAL
Friday, September 20, 2019NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Thursday, April 2, 2020TEAS STATEMENT OF USE RECEIVED
Thursday, April 2, 2020USE AMENDMENT FILED
Saturday, April 18, 2020STATEMENT OF USE PROCESSING COMPLETE

Related Keywords

semiconductor machines wafer lines along cutting number thereby manufacturing adhered