DAI-ICHI SEIKO Trademark

Trademark Overview


On Tuesday, April 19, 2005, a trademark application was filed for DAI-ICHI SEIKO with the United States Patent and Trademark Office. The USPTO has given the DAI-ICHI SEIKO trademark a serial number of 79020710. The federal status of this trademark filing is IR CANCELLED - US REGISTRATION CANCELLED as of Thursday, July 23, 2009. This trademark is owned by DAI-ICHI SEIKO CO., LTD.. The DAI-ICHI SEIKO trademark is filed in the Machinery Products, Computer & Software Products & Electrical & Scientific Products, Construction & Repair Services, and Treatment & Processing of Materials Services categories with the following description:

Secondary metal forming/working machines, namely, mechanical presses for metalworking, manual presses for metalworking, shearing machines for metalworking, bending machines for metalworking, oil hydraulic presses for metalworking and wire forming machines; packaging or wrapping machines, namely packing machines, wrapping machines and emboss packaging machines; plastic processing machines, namely compression molding machines, injection molding machines; machine parts, namely, molds for use in the manufacture of plastics; semiconductor manufacturing machines; machines for automatic assembly of connectors of plastic resin; plastic molding machines; machine parts, namely molds for use in the manufacture of semiconductors for resin sealing the semiconductors; resin sealing machines and machines for manufacture of semiconductors

Measuring and testing apparatus and instruments namely, inspection apparatus with image processing units for use in inspecting dimension and shape of moulded articles, inspection apparatus comprised of video cameras, image recognition computers, image analyzing software with image processing units for use in measuring pitches of jointing terminals for connectors, inspection apparatus comprised of video cameras, image recognition computers, image analyzing software with image processing units for checking type of products fed into automatic assembly machines and apparatus; electronic apparatus, namely, thermistors, diodes and transistors; semiconductors; sensors for measuring the revolution, pressure, flow rate and temperature of automobiles; crank angle sensors for measuring the crank angle of engines of automobiles; wheel speed sensors; FPC (flexible printed circuit board) connectors; docking connectors for use in coupling circuit boards; component parts for hard disk drives, namely, ...

Repair or maintenance of semiconductor manufacturing machines and systems

Custom manufacture of plastic processing for automobile related components, computer system components, electronic structural components; custom manufacture of pressing and plating of metal for automobile related components, computer system components, electronic structural components; custom assembling of plastic parts and metal parts for automobile related components, computer system components, electronic structural components
dai-ichi seiko

General Information


Serial Number79020710
Word MarkDAI-ICHI SEIKO
Filing DateTuesday, April 19, 2005
Status404 - IR CANCELLED - US REGISTRATION CANCELLED
Status DateThursday, July 23, 2009
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing5000 - Drawing with word(s) / letter(s) / number(s) in Stylized form
Published for Opposition DateTuesday, August 14, 2007

Trademark Statements


Goods and ServicesSecondary metal forming/working machines, namely, mechanical presses for metalworking, manual presses for metalworking, shearing machines for metalworking, bending machines for metalworking, oil hydraulic presses for metalworking and wire forming machines; packaging or wrapping machines, namely packing machines, wrapping machines and emboss packaging machines; plastic processing machines, namely compression molding machines, injection molding machines; machine parts, namely, molds for use in the manufacture of plastics; semiconductor manufacturing machines; machines for automatic assembly of connectors of plastic resin; plastic molding machines; machine parts, namely molds for use in the manufacture of semiconductors for resin sealing the semiconductors; resin sealing machines and machines for manufacture of semiconductors
Goods and ServicesMeasuring and testing apparatus and instruments namely, inspection apparatus with image processing units for use in inspecting dimension and shape of moulded articles, inspection apparatus comprised of video cameras, image recognition computers, image analyzing software with image processing units for use in measuring pitches of jointing terminals for connectors, inspection apparatus comprised of video cameras, image recognition computers, image analyzing software with image processing units for checking type of products fed into automatic assembly machines and apparatus; electronic apparatus, namely, thermistors, diodes and transistors; semiconductors; sensors for measuring the revolution, pressure, flow rate and temperature of automobiles; crank angle sensors for measuring the crank angle of engines of automobiles; wheel speed sensors; FPC (flexible printed circuit board) connectors; docking connectors for use in coupling circuit boards; component parts for hard disk drives, namely, ramps, latches, stoppers, inatia-arms that minimize the effects of shock damage to hard disk drives by sensing gravity; component parts for optical disk drives, namely, exterior components being plastic molding components; component parts for copying machines and printers for computers, namely, gears and pulleys of plastic molded components
Goods and ServicesRepair or maintenance of semiconductor manufacturing machines and systems
Goods and ServicesCustom manufacture of plastic processing for automobile related components, computer system components, electronic structural components; custom manufacture of pressing and plating of metal for automobile related components, computer system components, electronic structural components; custom assembling of plastic parts and metal parts for automobile related components, computer system components, electronic structural components

Classification Information


International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 031, 034, 035
Class Status Code8 - Abandoned
Class Status DateWednesday, April 8, 2009
Primary Code007
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code8 - Abandoned
Class Status DateWednesday, April 8, 2009
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class037 - Building construction; repair; installation services.
US Class Codes100, 103, 106
Class Status Code8 - Abandoned
Class Status DateWednesday, April 8, 2009
Primary Code037
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status Code8 - Abandoned
Class Status DateWednesday, April 8, 2009
Primary Code040
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameDAI-ICHI SEIKO CO., LTD.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressJP

Party NameDAI-ICHI SEIKO CO., LTD.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressJP

Trademark Events


Event DateEvent Description
Thursday, July 23, 2009DEATH OF INTERNATIONAL REGISTRATION
Wednesday, April 8, 2009ABANDONMENT NOTICE MAILED - INTER PARTES DECISION
Wednesday, April 8, 2009ABANDONMENT - AFTER INTER PARTES DECISION
Wednesday, April 8, 2009OPPOSITION TERMINATED NO. 999999
Wednesday, April 8, 2009OPPOSITION SUSTAINED NO. 999999
Friday, October 5, 2007REFUSAL PROCESSED BY IB
Friday, September 14, 2007OPPOSITION INSTITUTED NO. 999999
Thursday, September 13, 2007OPPOSITION NOTICE (IB REFUSAL) SENT TO IB
Thursday, September 13, 2007OPPOSITION NOTICE (IB REFUSAL) CREATED
Wednesday, September 12, 2007OPPOSITION PAPERS RECEIVED AT TTAB
Friday, August 31, 2007NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB
Thursday, August 16, 2007NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
Thursday, August 16, 2007NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB
Tuesday, August 14, 2007PUBLISHED FOR OPPOSITION
Wednesday, July 25, 2007NOTICE OF PUBLICATION
Monday, May 14, 2007PAPER RECEIVED
Wednesday, July 11, 2007LAW OFFICE PUBLICATION REVIEW COMPLETED
Wednesday, July 11, 2007ASSIGNED TO LIE
Wednesday, June 6, 2007APPROVED FOR PUB - PRINCIPAL REGISTER
Monday, May 14, 2007EX PARTE APPEAL-INSTITUTED
Monday, May 14, 2007EXPARTE APPEAL RECEIVED AT TTAB
Friday, March 30, 2007TEAS/EMAIL CORRESPONDENCE ENTERED
Thursday, March 29, 2007CORRESPONDENCE RECEIVED IN LAW OFFICE
Thursday, March 29, 2007TEAS RESPONSE TO OFFICE ACTION RECEIVED
Monday, November 13, 2006FINAL REFUSAL E-MAILED
Monday, November 13, 2006FINAL REFUSAL WRITTEN
Wednesday, October 11, 2006TEAS/EMAIL CORRESPONDENCE ENTERED
Tuesday, September 26, 2006CORRESPONDENCE RECEIVED IN LAW OFFICE
Tuesday, October 10, 2006ASSIGNED TO EXAMINER
Tuesday, September 26, 2006TEAS RESPONSE TO OFFICE ACTION RECEIVED
Tuesday, September 26, 2006TEAS CHANGE OF CORRESPONDENCE RECEIVED
Thursday, April 13, 2006REFUSAL PROCESSED BY IB
Wednesday, March 29, 2006NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
Tuesday, March 28, 2006REFUSAL PROCESSED BY MPU
Friday, March 24, 2006NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
Thursday, March 23, 2006NON-FINAL ACTION WRITTEN
Friday, March 17, 2006ASSIGNED TO EXAMINER
Friday, March 17, 2006NEW APPLICATION ENTERED IN TRAM
Thursday, March 16, 2006SN ASSIGNED FOR SECT 66A APPL FROM IB