CYPRIUM Trademark

Trademark Overview


On Wednesday, October 2, 2024, a trademark application was filed for CYPRIUM with the United States Patent and Trademark Office. The USPTO has given the CYPRIUM trademark a serial number of 98781948. The federal status of this trademark filing is REVIVED - AWAITING FURTHER ACTION as of Thursday, July 31, 2025. This trademark is owned by MacDermid, Incorporated. The CYPRIUM trademark is filed in the Chemical Products category with the following description:

Copper paste for industrial purposes[;] Paste made of copper nanoparticles for use in industrial applications[;] Copper paste for use in electronic and semiconductor manufacturing[;] Copper paste used in thermal management for industrial applications[;] Copper-based paste for use in via filling in printed circuit boards (PCBs) for use in electronic and semiconductor manufacturing[;] Copper-based paste for use in integrated circuit (IC) substrate manufacturing applications, Copper-based paste for power management in printed circuit board and IC substrate manufacturing applications; Copper-based paste for use in electronic die-attach assembly applications; Copper-based paste for use in sintering materials for electronic component interconnects; Copper-based paste for use in electronic devices to manage high power thermal loads; Copper-based paste for use in electronic devices to manage conductivity and circuit resistance
cyprium

General Information


Serial Number98781948
Word MarkCYPRIUM
Filing DateWednesday, October 2, 2024
Status616 - REVIVED - AWAITING FURTHER ACTION
Status DateThursday, July 31, 2025
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and ServicesCopper paste for industrial purposes[;] Paste made of copper nanoparticles for use in industrial applications[;] Copper paste for use in electronic and semiconductor manufacturing[;] Copper paste used in thermal management for industrial applications[;] Copper-based paste for use in via filling in printed circuit boards (PCBs) for use in electronic and semiconductor manufacturing[;] Copper-based paste for use in integrated circuit (IC) substrate manufacturing applications, Copper-based paste for power management in printed circuit board and IC substrate manufacturing applications; Copper-based paste for use in electronic die-attach assembly applications; Copper-based paste for use in sintering materials for electronic component interconnects; Copper-based paste for use in electronic devices to manage high power thermal loads; Copper-based paste for use in electronic devices to manage conductivity and circuit resistance

Classification Information


International Class001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
US Class Codes001, 005, 006, 010, 026, 046
Class Status Code6 - Active
Class Status DateWednesday, October 2, 2024
Primary Code001
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameMacDermid, Incorporated
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressWaterbury, CT 06702

Trademark Events


Event DateEvent Description
Wednesday, October 2, 2024NEW APPLICATION ENTERED
Sunday, April 6, 2025NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Monday, April 7, 2025ASSIGNED TO EXAMINER
Tuesday, April 15, 2025NON-FINAL ACTION E-MAILED
Tuesday, April 15, 2025NON-FINAL ACTION WRITTEN
Tuesday, April 15, 2025NOTIFICATION OF NON-FINAL ACTION E-MAILED
Wednesday, July 30, 2025ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE
Wednesday, July 30, 2025ABANDONMENT NOTICE E-MAILED - FAILURE TO RESPOND
Thursday, July 31, 2025CORRESPONDENCE RECEIVED IN LAW OFFICE
Thursday, July 31, 2025NOTICE OF REVIVAL - E-MAILED
Thursday, July 31, 2025TEAS PETITION TO REVIVE RECEIVED
Thursday, July 31, 2025PETITION TO REVIVE-GRANTED
Thursday, July 31, 2025TEAS RESPONSE TO OFFICE ACTION RECEIVED
Thursday, July 31, 2025TEAS/EMAIL CORRESPONDENCE ENTERED