| Serial Number | 79452201 |
| Word Mark | CUPRIMA |
| Filing Date | Monday, March 30, 2026 |
| Status | 640 - NON-FINAL ACTION COUNTED - NOT MAILED |
| Status Date | Thursday, July 16, 2026 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | NOT AVAILABLE |
| Goods and Services | Adhesives for use in the manufacture of electronic components; tacking agent [temporary fixing adhesives]; tacking agent, namely, temporary fixing adhesives for industrial use; temporary fixing adhesives used for electronic components; temporary fixing adhesives for use in the manufacture of semiconductors; temporary fixing adhesives used for temporary binding semiconductor chips in assembly processes of electronic components and semiconductors |
| Translation of Words in Mark | The wording "CUPRIMA" has no meaning in a foreign language. |
| Goods and Services | Powder of copper in the form of pastes used in bonding and sintering processes of electronic components; copper preforms used in bonding and sintering processes of electronic components; semi-processed copper used in bonding and sintering processes of electronic components; powder of copper in the form of pastes used as a bonding material for electronic components such as power semiconductors; copper preforms used as a bonding material for electronic components such as power semiconductors; semi-processed copper used as a bonding material for electronic components such as power semiconductors; copper and its alloys in the form of pastes used for sintering in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for die attach in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for bonding cooling components, heat dissipation components, heatsinks, and baseplates in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for clip attach in semiconductors manufacturing processes; copper and its alloys in the form of pastes used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of sheets used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; preforms of copper and copper alloys used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; semi-processed copper and its alloys used for sintering in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for die attach in manufacturing processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for bonding cooling components, heat dissipation components, heatsinks, and baseplates on printed circuit boards in manufacturing and assembly processes of electronic components such as power semiconductors; copper and its alloys in the form of pastes used for clip attach in manufacturing processes of electronic components such as power semiconductors; powder of copper in the form of pastes used for sinter joining |
| International Class | 001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry. |
| US Class Codes | 001, 005, 006, 010, 026, 046 |
| Class Status Code | 6 - Active |
| Class Status Date | Tuesday, June 30, 2026 |
| Primary Code | 001 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 006 - Common metals and their alloys; metal building materials; transportable buildings of metal; materials of metal for railway tracks; nonelectric cables and wires of common metal; ironmongery, small items of metal hardware; pipes and tubes of metal; safes; goods of common metal not included in other classes; ores. |
| US Class Codes | 002, 012, 013, 014, 023, 025, 050 |
| Class Status Code | 6 - Active |
| Class Status Date | Tuesday, June 30, 2026 |
| Primary Code | 006 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | Mitsui Kinzoku Company, Limited |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | JP |
| Event Date | Event Description |
| Thursday, June 18, 2026 | SN ASSIGNED FOR SECT 66A APPL FROM IB |
| Tuesday, June 30, 2026 | LIMITATION FROM ORIGINAL APPLICATION ENTERED |
| Tuesday, June 30, 2026 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Tuesday, June 30, 2026 | APPLICATION FILING RECEIPT MAILED |
| Monday, July 13, 2026 | ASSIGNED TO EXAMINER |
| Thursday, July 16, 2026 | NON-FINAL ACTION WRITTEN |
| Friday, July 17, 2026 | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW |