CUP-PLATER Trademark

Trademark Overview


On Wednesday, September 13, 1995, a trademark application was filed for CUP-PLATER with the United States Patent and Trademark Office. The USPTO has given the CUP-PLATER trademark a serial number of 74728652. The federal status of this trademark filing is CANCELLED - SECTION 8 as of Saturday, December 19, 2009. This trademark is owned by Electroplating Engineers of Japan Ltd.. The CUP-PLATER trademark is filed in the Computer & Software Products & Electrical & Scientific Products category with the following description:

bump plating machine for wafer

General Information


Serial Number74728652
Word MarkCUP-PLATER
Filing DateWednesday, September 13, 1995
Status710 - CANCELLED - SECTION 8
Status DateSaturday, December 19, 2009
Registration Number2246316
Registration DateTuesday, May 18, 1999
Mark Drawing1000 - Typeset: Word(s) / letter(s) / number(s)
Published for Opposition DateTuesday, March 17, 1998

Trademark Statements


Goods and Servicesbump plating machine for wafer
Pseudo MarkCUP PLATER

Classification Information


International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code2 - Sec. 8 - Entire Registration
Class Status DateSaturday, December 19, 2009
Primary Code009
First Use Anywhere DateSaturday, March 25, 1995
First Use In Commerce DateMonday, March 3, 1997

Trademark Owner History


Party NameElectroplating Engineers of Japan Ltd.
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressChuo-ku, Tokyo
JP

Party NameElectroplating Engineers of Japan Ltd.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressChuo-ku, Tokyo
JP

Party NameElectroplating Engineers of Japan Ltd.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressChuo-ku, Tokyo
JP

Trademark Events


Event DateEvent Description
Saturday, December 19, 2009CANCELLED SEC. 8 (10-YR)/EXPIRED SECTION 9
Thursday, July 12, 2007CASE FILE IN TICRS
Monday, December 20, 2004REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
Thursday, November 4, 2004REGISTERED - SEC. 8 (6-YR) & SEC. 15 FILED
Thursday, November 4, 2004REGISTERED - SEC. 8 (6-YR) & SEC. 15 FILED
Thursday, November 4, 2004PAPER RECEIVED
Tuesday, May 18, 1999REGISTERED-PRINCIPAL REGISTER
Monday, March 15, 1999ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
Saturday, March 13, 1999ASSIGNED TO EXAMINER
Thursday, March 4, 1999STATEMENT OF USE PROCESSING COMPLETE
Tuesday, February 9, 1999USE AMENDMENT FILED
Wednesday, February 10, 1999EXTENSION 1 GRANTED
Thursday, January 21, 1999EXTENSION 1 FILED
Tuesday, July 21, 1998NOA MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, March 17, 1998PUBLISHED FOR OPPOSITION
Friday, February 13, 1998NOTICE OF PUBLICATION
Tuesday, December 9, 1997APPROVED FOR PUB - PRINCIPAL REGISTER
Monday, November 17, 1997CORRESPONDENCE RECEIVED IN LAW OFFICE
Thursday, August 22, 1996CORRESPONDENCE RECEIVED IN LAW OFFICE
Monday, March 25, 1996LETTER OF SUSPENSION MAILED
Wednesday, March 6, 1996ASSIGNED TO EXAMINER

Related Keywords


plater wafer machine plating bump