| Serial Number | 76360995 |
| Word Mark | CU.P BUMP |
| Filing Date | Tuesday, January 22, 2002 |
| Status | 606 - ABANDONED - NO STATEMENT OF USE FILED |
| Status Date | Wednesday, June 8, 2005 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 1000 - Typeset: Word(s) / letter(s) / number(s) |
| Published for Opposition Date | Tuesday, September 14, 2004 |
| Disclaimer with Predetermined Text | "BUMP" |
| Goods and Services | conductive interconnect components, containing copper, on and extending from, an integrated circuit or semiconductor wafer, flip chip interconnect components, namely, flip chip on lead frames, flip chip on substrates and micro electromechanical systems; pillar bump components, namely, wafer level chips skill package and micro electromechanical systems; integrated circuit interconnect components, namely, chip on chip components for micro electromechanical systems |
| Goods and Services | Custom manufacture of bumps, namely conductive material, including copper, on an integrated circuit or semiconductor wafter; custom semiconductor bumping services; custom electroplating of conductive material on integrated circuits or semiconductor wafers; custom pillar bumping services |
| Pseudo Mark | CU DOT P BUMP, CUP BUMP |
| International Class | 009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus. |
| US Class Codes | 021, 023, 026, 036, 038 |
| Class Status Code | 6 - Active |
| Class Status Date | Wednesday, January 30, 2002 |
| Primary Code | 009 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 040 - Treatment of materials. |
| US Class Codes | 100, 103, 106 |
| Class Status Code | 6 - Active |
| Class Status Date | Wednesday, January 30, 2002 |
| Primary Code | 040 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | Advanpack Solutions Pte Ltd. |
| Party Type | 20 - Owner at Publication |
| Legal Entity Type | 99 - Other |
| Address | Singapore 739256 SG |
| Party Name | Advanpack Solutions Pte Ltd. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 99 - Other |
| Address | Singapore 739256 SG |
| Event Date | Event Description |
| Monday, September 26, 2005 | ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED |
| Monday, September 26, 2005 | ABANDONMENT - NO USE STATEMENT FILED |
| Tuesday, December 7, 2004 | NOA MAILED - SOU REQUIRED FROM APPLICANT |
| Tuesday, September 14, 2004 | PUBLISHED FOR OPPOSITION |
| Wednesday, August 25, 2004 | NOTICE OF PUBLICATION |
| Friday, July 2, 2004 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Wednesday, April 14, 2004 | EXAMINERS AMENDMENT MAILED |
| Wednesday, February 18, 2004 | PETITION TO REVIVE-GRANTED |
| Thursday, October 2, 2003 | PETITION TO REVIVE-RECEIVED |
| Thursday, October 2, 2003 | PAPER RECEIVED |
| Monday, September 15, 2003 | ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE |
| Saturday, August 30, 2003 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
| Friday, January 24, 2003 | FINAL REFUSAL MAILED |
| Wednesday, November 6, 2002 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Wednesday, November 6, 2002 | PAPER RECEIVED |
| Monday, May 6, 2002 | NON-FINAL ACTION MAILED |
| Monday, May 6, 2002 | ASSIGNED TO EXAMINER |
| Monday, April 29, 2002 | ASSIGNED TO EXAMINER |
| Monday, April 29, 2002 | ASSIGNED TO EXAMINER |
| Friday, April 26, 2002 | ASSIGNED TO EXAMINER |