CU.P BOND Trademark

Trademark Overview

On Monday, October 29, 2001, a trademark application was filed for CU.P BOND with the United States Patent and Trademark Office. The USPTO has given the CU.P BOND trademark a serial number of 76330816. The federal status of this trademark filing is ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE as of Tuesday, September 17, 2002. This trademark is owned by Advanpack Solutions Pte Ltd.. The CU.P BOND trademark is filed in the Computer & Software Products & Electrical & Scientific Products and Treatment & Processing of Materials Services categories with the following description:

Conductive interconnect on, and extending from, an integrated circuit or semiconductor wafer; flip chip interconnect; pillar bump or interconnect; integrated circuit interconnect

Manufacture for others, namely, forming conductive material on an integrated circuit or semiconductor wafer; semiconductor bumping services; electroplating conductive material on integrated circuits or semiconductor wafers; integrated circuit packaging services; pillar bumping services
cu.p bond

General Information

Serial Number76330816
Word MarkCU.P BOND
Filing DateMonday, October 29, 2001
Status602 - ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE
Status DateTuesday, September 17, 2002
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing5000 - Drawing with word(s) / letter(s) / number(s) in Stylized form
Published for Opposition DateNOT AVAILABLE

Trademark Statements

Goods and ServicesConductive interconnect on, and extending from, an integrated circuit or semiconductor wafer; flip chip interconnect; pillar bump or interconnect; integrated circuit interconnect
Goods and ServicesManufacture for others, namely, forming conductive material on an integrated circuit or semiconductor wafer; semiconductor bumping services; electroplating conductive material on integrated circuits or semiconductor wafers; integrated circuit packaging services; pillar bumping services
Pseudo MarkCUP BOND

Classification Information

International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateWednesday, November 7, 2001
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE
International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status Code6 - Active
Class Status DateWednesday, November 7, 2001
Primary Code040
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History

Party NameAdvanpack Solutions Pte Ltd.
Party Type10 - Original Applicant
Legal Entity Type99 - Other
AddressSingapore 739256
SG

Trademark Events

Event DateEvent Description
Tuesday, September 17, 2002ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE
Tuesday, January 15, 2002NON-FINAL ACTION MAILED
Thursday, January 3, 2002ASSIGNED TO EXAMINER

Related Keywords

bond integrated semiconductor circuit interconnect services conductive pillar material bumping wafer