CU-BRITE Trademark

Trademark Overview

On Friday, March 1, 2024, a trademark application was filed for CU-BRITE with the United States Patent and Trademark Office. The USPTO has given the CU-BRITE trademark a serial number of 98428920. The federal status of this trademark filing is PUBLICATION/ISSUE REVIEW COMPLETE as of Thursday, April 3, 2025. This trademark is owned by JCU CORPORATION. The CU-BRITE trademark is filed in the Chemical Products category with the following description:

Industrial chemicals; chemicals for use in plating; metal plating solution; chemical metal plating solution; metal plating chemical compositions, namely, electrolytic acid copper solution; metal plating solution additive; chemical additive for use in the manufacture of metal plating solution; chemical metal plating solution additive; metal plating additives; chemical additives for use in metal plating; chemical metal plating additives; metal surface treatment agents; chemical agents for metal surface cleaning; etching agents in the nature of etchants for use in the manufacture of package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemical agents for use in the plating industry for use in the manufacture of package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal plating solution, plating solution additive, plating additives ...
cu-brite

General Information

Serial Number98428920
Word MarkCU-BRITE
Filing DateFriday, March 1, 2024
Status681 - PUBLICATION/ISSUE REVIEW COMPLETE
Status DateThursday, April 3, 2025
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, April 22, 2025

Trademark Statements

Goods and ServicesIndustrial chemicals; chemicals for use in plating; metal plating solution; chemical metal plating solution; metal plating chemical compositions, namely, electrolytic acid copper solution; metal plating solution additive; chemical additive for use in the manufacture of metal plating solution; chemical metal plating solution additive; metal plating additives; chemical additives for use in metal plating; chemical metal plating additives; metal surface treatment agents; chemical agents for metal surface cleaning; etching agents in the nature of etchants for use in the manufacture of package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemical agents for use in the plating industry for use in the manufacture of package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal plating solution, plating solution additive, plating additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemical metal plating solution, plating solution additive, plating additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal surface treatment agents, chemical agents for metal surface cleaning, etching agents, metal stripping agents for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and plating chemicals for use in package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication and semiconductor packaging; metal plating solution, metal plating solution additive, metal plating additives for use in package substrate, and printed circuit boards; chemical metal plating solution, chemical metal plating solution additive, chemical metal plating additives for use in package substrate, and printed circuit boards; metal surface treatment agents, chemical agents for metal surface cleaning, etching agents, metal stripping agents for use in package substrate, and printed circuit boards

Classification Information

International Class001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
US Class Codes001, 005, 006, 010, 026, 046
Class Status Code6 - Active
Class Status DateFriday, March 1, 2024
Primary Code001
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History

Party NameJCU CORPORATION
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressTokyo 110-0015
JP

Trademark Events

Event DateEvent Description
Friday, March 1, 2024NEW APPLICATION ENTERED
Saturday, July 13, 2024NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Tuesday, September 17, 2024ASSIGNED TO EXAMINER
Friday, October 4, 2024NON-FINAL ACTION WRITTEN
Friday, October 4, 2024NON-FINAL ACTION E-MAILED
Friday, October 4, 2024NOTIFICATION OF NON-FINAL ACTION E-MAILED
Monday, January 6, 2025APPLICATION EXTENSION GRANTED/RECEIPT PROVIDED
Monday, January 6, 2025APPLICATION EXTENSION TO RESPONSE PERIOD - RECEIVED
Thursday, March 27, 2025EXAMINERS AMENDMENT -WRITTEN
Thursday, March 27, 2025EXAMINERS AMENDMENT E-MAILED
Thursday, March 27, 2025EXAMINER'S AMENDMENT ENTERED
Thursday, March 27, 2025NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
Thursday, March 27, 2025APPROVED FOR PUB - PRINCIPAL REGISTER

Related Keywords

brite plating metal chemical solution semiconductor manufacture agents additive additives printed