| Serial Number | 98428920 |
| Word Mark | CU-BRITE |
| Filing Date | Friday, March 1, 2024 |
| Status | 700 - REGISTERED |
| Status Date | Tuesday, June 10, 2025 |
| Registration Number | 7822080 |
| Registration Date | Tuesday, June 10, 2025 |
| Mark Drawing | 4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | Tuesday, April 22, 2025 |
| Goods and Services | Industrial chemicals; chemicals for use in plating; metal plating solution; chemical metal plating solution; metal plating chemical compositions, namely, electrolytic acid copper solution; metal plating solution additive; chemical additive for use in the manufacture of metal plating solution; chemical metal plating solution additive; metal plating additives; chemical additives for use in metal plating; chemical metal plating additives; metal surface treatment agents; chemical agents for metal surface cleaning; etching agents in the nature of etchants for use in the manufacture of package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemical agents for use in the plating industry for use in the manufacture of package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal plating solution, plating solution additive, plating additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemical metal plating solution, plating solution additive, plating additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal surface treatment agents, chemical agents for metal surface cleaning, etching agents, metal stripping agents for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and plating chemicals for use in package substrate, printed circuit boards, semiconductor manufacture, semiconductor device fabrication and semiconductor packaging; metal plating solution, metal plating solution additive, metal plating additives for use in package substrate, and printed circuit boards; chemical metal plating solution, chemical metal plating solution additive, chemical metal plating additives for use in package substrate, and printed circuit boards; metal surface treatment agents, chemical agents for metal surface cleaning, etching agents, metal stripping agents for use in package substrate, and printed circuit boards |
| International Class | 001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry. |
| US Class Codes | 001, 005, 006, 010, 026, 046 |
| Class Status Code | 6 - Active |
| Class Status Date | Friday, March 1, 2024 |
| Primary Code | 001 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | JCU CORPORATION |
| Party Type | 30 - Original Registrant |
| Legal Entity Type | 03 - Corporation |
| Address | Tokyo 110-0015 JP |
| Party Name | JCU CORPORATION |
| Party Type | 20 - Owner at Publication |
| Legal Entity Type | 03 - Corporation |
| Address | Tokyo 110-0015 JP |
| Party Name | JCU CORPORATION |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | Tokyo 110-0015 JP |
| Event Date | Event Description |
| Friday, March 1, 2024 | NEW APPLICATION ENTERED |
| Saturday, July 13, 2024 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Tuesday, September 17, 2024 | ASSIGNED TO EXAMINER |
| Friday, October 4, 2024 | NON-FINAL ACTION WRITTEN |
| Friday, October 4, 2024 | NON-FINAL ACTION E-MAILED |
| Friday, October 4, 2024 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| Monday, January 6, 2025 | APPLICATION EXTENSION GRANTED/RECEIPT PROVIDED |
| Monday, January 6, 2025 | APPLICATION EXTENSION TO RESPONSE PERIOD - RECEIVED |
| Thursday, March 27, 2025 | EXAMINERS AMENDMENT -WRITTEN |
| Thursday, March 27, 2025 | EXAMINERS AMENDMENT E-MAILED |
| Thursday, March 27, 2025 | EXAMINER'S AMENDMENT ENTERED |
| Thursday, March 27, 2025 | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED |
| Thursday, March 27, 2025 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Wednesday, April 16, 2025 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| Tuesday, April 22, 2025 | PUBLISHED FOR OPPOSITION |
| Tuesday, April 22, 2025 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| Tuesday, June 10, 2025 | REGISTERED-PRINCIPAL REGISTER |
| Tuesday, June 10, 2025 | NOTICE OF REGISTRATION CONFIRMATION EMAILED |