| Goods and Services | Electronic and electrical components, namely, frequency control devices in the nature of electrical signal generation, electrical signal filtering and shaping Crystal resonators, Crystal oscillators, Surface Acoustic Wave Filter, Ceramic resonators and filter, electromagnetic interference filters; Metal Oxide Silicon Field effect transistor (MOSFET); rectifier; light emitting diodes (LED); supercapacitors for energy storage; ultracapacitors for energy storage; capacitors, electrical and electronic inductors, electric resistors; electronic and electrical circuit protection devices, namely, fuses, circuit breakers, varistors, thermistors; batteries; semiconductors; diodes; transistors; voltage regulators; radio signal tuners; amplifiers; transmitters of electronic signals; receivers of electronic signals; integrated circuits; application-specific integrated circuits; microcontrollers; logic circuits; logic integrated circuits; mixed signal integrated circuits; power management integrated circuits; electronic servo motor controllers; electronic controls for motors; electric sensors; light emitting diodes; display devices, namely electronic display interfaces, liquid crystal displays, flat panel display screens; optical sensors; opto-isolaters; optocouplers; memory boards; memory cards; memory modules; electrical and electronic connectors; wire to board connectors; optical fiber connectors; connectors for electronic circuits; board to board connectors, namely, electronic connectors to connect Printed Circuit Boards (PCBs) for electronic signal and power transmission; wire to wire connectors, namely, electronic connectors to connect cable wires for electronic signal and power transmission; wire to board connectors, namely, electronic connectors connect cable wire and PCB board for electronic signal and power transmission; terminals, namely, metal terminal as contact for connectors; battery terminals; component parts of batteries, namely, battery clips, battery contacts, battery springs; pin headers, namely, electronic header connectors; electronic sockets; semiconductor wafers; wafers for integrated circuits; electric switch housings; electronic connector housings; housings for printed circuit boards; flat flexible cable (FFC) and flexible printed circuit (FPC) connectors, namely, electronic connectors connects FFC and FPC to PCB for signal and power transmission; peripheral component interconnect express (PCI-E) connectors, namely, electrical and electronic connectors that connects various server and storage components with the motherboard, following PCI-E standard; industrial connectors, namely, electrical and electronic connectors that transmit signal and power for industrial application; terminal blocks, namely electrical terminal blocks; heavy-duty connectors, namely, electrical and electronic connectors for signal and power connection; high power connectors, namely, electrical connectors; high speed connectors, namely, electronic connector; small form factor pluggable (SFP), quad small form factor pluggable (QSFP), and octal small form factor pluggable (OSFP) connectors, namely, electronic connector; input/output (I/O) connectors, namely, electronic connector; universal serial bus (USB) connectors, namely, electronic connectors; D-subminiature (d-sub) connectors, namely, electronic connectors following D-Sub standards for signal transmission; display port (DP) connectors, electronic connectors following DP standards for signal transmission; ethernet connectors, namely, electronic connectors for ethernet signal transmission; registered jack (RJ45) connectors; electronic connector for ethernet application; dc jacks, namely, electrical connectors that supply DC(direct current) power; audio jacks connectors, namely, electronic connectors for audio signal transmission in audio devices; high definition multimedia interface connectors, namely, electronic connectors following high definition multimedia interface standards for signal; digital visual interface (DVI)connectors, namely, electronic connectors following DVI standards for signal transmission; pogo pins, namely, electronic connectors with spring loaded contact mechanism, for data and power transmission ; insulation-displacement contact (IDC) connectors, namely, electrical and electronic connectors that connect cable to using directly piercing the insulation layer of the wire through blade crimping technology; radio frequency (RF) connectors, namely, electronic circular coaxial connector for signal transmission; mini radio frequency (RF)connectors, namely, electronic circular coaxial connector for signal ; radio frequency (RF)switches, namely, electronic connector for signal transmission; Sub Miniature version A (SMA) connectors, namely, electronic connector with threaded connection for signal transmission ; Threaded Neill Concelman (TNC) connectors, namely, connector for signal transmission; rectangular connectors, namely, electrical and electronic connector with a rectangular mating interface for signal and power transmission; circular connectors, namely, electrical and electronic connector with a circular mating interface for signal and power transmission; automotive connectors, namely, electrical and electronic connectors that transmit signal and power for automotive application; fakra connectors, namely, electronic connector that transmit high frequency electronic signal for cameras, sensors and antennas, radar; mini fakra connectors, namely, electronic connector transmit high frequency electronic signal for cameras, sensors and antennas, radar applications; high speed data (HSD) connectors, namely, electronic connectors that transmit high-speed signal and power in automotive application, for cameras, USB interfaces, Ethernet, Firewire and similar high-speed communication protocols; backplane connectors, namely, electronic connectors transmit signals between the main system board (the backplane) and peripheral PCB boards or modules; electronic and electrical wires, used for transmitting electronic signals; Cables and cable assemblies, namely, interconnect solutions consisting of connectors, conductors, insulation, shielding, and protective jackets, designed for reliable transmission of data, control signals, and electrical power; cable harnesses, namely, organized bundles of conductors terminated with connectors and wrapped with insulation and protective sheathing, designed to transmit electrical power, control signals, and data. power cables; power whips, namely, cables transmit power between power source and devices; Optical cables, namely, fiber-based interconnect solutions consisting of optical fibers, connectors, protective jackets, and shielding elements, designed for high-speed data transmission over long distances; USB cables, namely, copper-based interconnect solutions consisting of conductors, USB connectors, insulation, shielding, and protective jackets, designed for data transfer and low-power delivery; High-speed direct attach cables (DAC), namely, copper-based cable assemblies consisting of twinax conductors, high-speed connectors, shielding, and protective jackets, designed for short-reach, low-latency transmission of high-speed data. electric vehicle (EV)charging cables, namely, electrical cable assemblies consisting of high-current conductors, insulation, shielding, protective jackets, and integrated connectors, designed for safe and efficient transmission of high-voltage DC or AC power in EV charging systems; electric vehicle (EV)charging inlet, namely, electrical connectors integrated into the vehicle body, consisting of high-current contacts, insulation, sealing gaskets, and safety interlock features, designed to receive AC or DC power from external charging equipment. copper busbars, namely, solid electrical conductors made of high-purity copper, designed for efficient high-current and low-resistance power distribution in electrical systems, consisting of flat or shaped bars with insulation, plating, and mounting feature; aluminum busbars, namely, solid electrical conductors made of high-strength aluminum alloys, designed for lightweight and cost-effective high-current power distribution in electrical systems, consisting of flat or shaped bars with insulation, plating, and mounting features; flexible busbars, namely, laminated or braided electrical conductors made of stacked copper foils or tinned-copper braids, designed to accommodate vibration, thermal expansion, and assembly tolerances while providing compact, low-inductance, high-current power distribution in electrical systems, consisting of insulated flat or shaped sections with optional surface plating defined bend radii, hole patterns, and integrated termination or mounting features; multilayer busbars, namely, laminated electrical conductors composed of multiple stacked copper or aluminum layers separated by insulation, designed for compact, low-inductance, and high-current power distribution in electrical systems, consisting of precisely aligned layers with dielectric barriers, surface plating, and integrated mounting or termination; lamination busbars, namely, laminated electrical conductors formed by stacking and bonding multiple copper or aluminum layers with insulating films, designed for compact, low-inductance, and high-current power distribution in electrical systems, consisting of precision-aligned conductive layers, dielectric insulation, surface plating, and integrated mounting or termination features; rod busbars, namely, solid cylindrical electrical conductors made of high-conductivity copper or aluminum alloys, designed for robust and efficient high-current power distribution in electrical systems, consisting of straight or bent rods with optional insulation, surface plating, and integrated mounting or termination features; integrated busbars, namely, custom-engineered electrical conductors combining multiple phases, insulation layers, and connection interfaces into a single compact assembly, designed for optimized space utilization, low inductance, and high-current power distribution in electrical systems, consisting of laminated conductive layers, dielectric barriers, surface plating , and integrated mounting or termination features; solid busbars, namely, rigid electrical conductors made of high-conductivity copper or aluminum alloys, designed for durable and efficient high-current power distribution in electrical systems, consisting of straight or shaped bars with optional insulation, surface plating and integrated mounting or termination features; automotive busbars, namely, custom-engineered electrical conductors made of high-conductivity copper or aluminum alloys, designed for compact, lightweight, and reliable high-current power distribution in electric and hybrid vehicle systems, consisting of laminated or solid sections with insulation, surface plating integrated mounting features, and connection interfaces for battery packs, inverters, and power electronics; open compute project (OCP) busbars, namely, standardized electrical conductors designed according to OCP specifications for high-efficiency, scalable power distribution in data center and server rack systems, consisting of rigid or laminated copper or aluminum sections with insulation, surface plating, integrated mounting features, and connection interfaces for modular power shelves and IT equipment; power elements; printed circuits boards; flexible printed circuits; flexible flat cables, namely, thin and bendable electrical conductors arranged in parallel within a flat, insulated ribbon structure, designed for compact, lightweight, and reliable signal or power transmission in electronic and electromechanical; high speed active copper cables and active electrical cables, namely, electrically enhanced transmission assemblies using copper conductors combined with integrated signal conditioning electronics, designed for reliable, low-latency, and high-bandwidth data transfer in high-performance computing and networking systems, consisting of precision-twisted copper pairs with shielding, active equalization circuitry, low-loss insulation, and standardized high-speed connectors; internal high-speed cables, namely, precision-engineered transmission assemblies using copper or hybrid conductors with controlled impedance, designed for ultra-low-loss, high-bandwidth signal delivery within electronic enclosures or system chassis, consisting of shielded twisted pairs or twinax structures with low-dielectric insulation, optional active equalization, and standardized high-speed connectors for board-to-board or module interconnects; input-output (I/O) cables, namely, electrical or hybrid transmission assemblies designed for reliable signal and power connectivity between peripheral devices and host systems, consisting of copper or optical conductors with insulation, shielding for electromagnetic interference suppression, standardized connectors, and optional active components for signal conditioning or protocol; type C cable, reversible high-speed transmission assemblies designed for universal connectivity and power delivery between electronic devices, consisting of copper conductors with low-loss insulation, shielding for electromagnetic interference suppression, integrated control circuitry for USB Power Delivery and data protocols, and standardized USB Type-C connectors supporting multiple modes; cables, namely, certified transmission assemblies designed for secure and reliable power delivery and data transfer between portable electronic devices and accessories, consisting of copper conductors with low-loss insulation, shielding for electromagnetic interference suppression, integrated authentication circuitry, and standardized Lightning or USB Type-C connectors; display port (DP) cable, namely, high-speed digital transmission assemblies designed for reliable delivery of video, audio, and auxiliary data between computing devices and displays, consisting of copper conductors with low-loss insulation, shielding for electromagnetic interference suppression, standardized DisplayPort connectors supporting multiple resolutions and refresh rates, and optional active circuitry for signal boosting over extended lengths; high definition multimedia interface cables, namely, digital transmission assemblies designed for high-quality audio and video connectivity between consumer electronics and display devices, consisting of copper conductors with precision impedance control, multi-layer shielding for EMI suppression, standardized high definition multimedia interface connectors supporting advanced protocols such as Ethernet and ARC, and optional active components for extended cable runs; copper clad steel (CCS) cables, namely, composite electrical conductors consisting of a high-strength steel core uniformly coated with copper, designed for enhanced tensile strength, corrosion resistance, and cost-effective signal or power transmission in telecommunication and electrical systems, consisting of stranded or solid CCS wires with insulation, optional shielding, and standardized termination; photovoltaic (PV) cable, namely, specialized electrical conductors designed for reliable DC power transmission in solar energy systems, consisting of stranded copper conductors with cross-linked polymer insulation, UV and weather-resistant outer jackets, optional shielding, and standardized termination features for photovoltaic modules, inverters, and junction; optical signal interconnect devices, namely, optical fiber cables, namely, multifiber push-on (MPO), lucent connector (LC), fiber channel (FC), and square connector (SC) optical fiber cables; active optical cables, namely, high-performance interconnect solutions integrating optical transceivers and fiber assemblies, designed for ultra-high-speed, low-latency data transmission over extended distances in data centers and high-performance computing systems, consisting of optical fibers, embedded electronics for signal conversion, connectors, and protective sheathing; active optical cables (AOC), namely, octal small form-factor pluggable (OSFP), quad small form factor pluggable (QSFP), and small form factor pluggable (SFP) optical cables; octal small form-factor pluggable (OSFP), quad small form factor pluggable (QSFP), and small form factor pluggable (SFP) transceivers; optical modular, namely, pre-terminated fiber optic interconnect solutions designed for high-density, high-speed data transmission in telecommunication and data center systems, consisting of multiple optical fibers organized in modular cassettes or panels with precision alignment, protective housings, standardized connectors such as MPO/MTP, and optional polarity management features for simplified installation and scalability electric buzzers; audio speakers; microphones; piezo devices, namely, piezoelectric sensors, piezoelectric switches, piezoelectric actuators, piezoelectric transducers, electrical transducers; electromagnetic transducers; ultrasonic sensors; powder level sensors; air quality sensors; micro-electromechanical systems time-of-flight (MEMS ToF) sensors; pressure sensors; magnetic field sensors; photoplethysmography sensors, using light-emitting diodes (LEDs) and photodetectors; temperature sensors; cooling fans for analog and digital electrical and electronic equipment, namely, internal cooling fans for smartphones, internal cooling fans for computers, Power supply and rack and enclosure; heat sinks for use in electronic components; liquid cooling systems, namely, integrated thermal management assemblies designed for efficient heat dissipation in high-performance electronic or computing systems, consisting of a pump, radiator, reservoir, cold plate, manifold, quick-disconnect fittings, controller, monitoring unit, and a series of tubes for coolant circulation; quick disconnect couplings, namely, precision-engineered mechanical connectors designed for rapid and secure connection or disconnection of fluid lines in cooling, hydraulic, or pneumatic systems, consisting of mating halves with integrated sealing elements, locking mechanisms, optional shut-off valves, and standardized interface geometries for leak-free operation; universal quick disconnect couplings for liquid cooling systems; universal quick disconnect (UQD) connectors, namely, standardized fluid coupling assemblies designed for rapid, secure, and leak-free connection or disconnection of liquid cooling lines in high-performance computing and electronic systems, consisting of precision-machined mating halves with integrated sealing elements, locking mechanisms, optional shut-off valves, and universal interface geometries for compatibility across multiple platforms; universal quick disconnect blind mate (UQDB) connectors, namely, precision-engineered fluid coupling assemblies designed for rapid, secure, and leak-free blind mating of liquid cooling lines in high-performance computing and electronic systems, consisting of self-aligning mating halves with integrated sealing elements, locking mechanisms, optional shut-off valves, and universal interface geometries for tool-less installation and compatibility across multiple platforms; universal blind-mate quick (BMQC) connectors, namely, precision-engineered fluid coupling assemblies designed for rapid, secure, and leak-free blind mating of liquid cooling lines in high-performance computing and electronic systems, consisting of self-aligning mating halves with integrated sealing elements, locking mechanisms, optional shut-off valves, and universal interface geometries for tool-less installation and compatibility across multiple platforms; tubes, namely, flexible material that carries liquid for liquid cooling devises; liquid leakage detection wires, namely, sensor-based cable assemblies designed for early detection of liquid presence in cooling or fluid distribution systems, consisting of conductive sensing elements embedded in insulated wires, protective outer jackets, standardized connectors for integration with monitoring controllers, and optional alarm or shutdown interfaces for system safety; liquid cooling distribution manifolds, namely, precision-engineered assemblies designed for centralized coolant routing and flow management in high-performance computing and electronic systems, consisting of machined or molded bodies with multiple inlet and outlet ports, integrated sealing elements, optional flow control valves, mounting features, and standardized quick-disconnect interfaces for modular liquid cooling loops; cold plates, namely, precision-engineered thermal interface assemblies designed for efficient heat transfer from electronic components to liquid cooling loops, consisting of a machined or extruded metal base with microchannel or pin-fin structures, integrated sealing elements, inlet and outlet ports for coolant flow, and mounting features for secure attachment to processors, power modules, or other heat-generating devices, hoses, pumps, namely, precision-engineered fluid circulation assemblies designed for continuous and reliable coolant flow in high-performance electronic and computing systems, consisting of a motor-driven impeller housed in a sealed chamber, integrated inlet and outlet ports, vibration-damping mounts, optional speed control electronics, and standardized interfaces for connection to reservoirs and cooling loops; antennas; external antennas, cabled external antennas, dipole antennas, patch antennas, dome antennas, multiple-input and multiple-output (MIMO) antennas, stub antennas, automotive antennas; internal antennas, printed circuit board (PCB) antennas, flexible printed circuit (FPC) antennas, chip antennas, helix antennas, metal antennas, near field communication (NFC) antennas, precision location antennas, GPS antennas, global navigation satellite system (GNSS) antennas; antenna array, namely, structured assemblies of multiple radiating elements arranged in a defined geometric configuration, designed for high-gain, directional, and beamforming capabilities in wireless communication and radar systems, consisting of individual antenna elements with feed networks, phase-shifting components, mounting structures, and optional integrated control electronics for adaptive performance; antenna filter unit, namely, precision RF components designed to selectively pass desired frequency bands while attenuating unwanted signals, enabling optimized performance in wireless communication systems, consisting of resonators, dielectric or cavity structures, integrated shielding, connectors, and mounting features; levelers, namely, adjustable height support and feet for electronic equipment, and cabinets and racks for holding electronic equipment |
