| Serial Number | 88719666 |
| Word Mark | CMC MATERIALS |
| Filing Date | Monday, December 9, 2019 |
| Status | 700 - REGISTERED |
| Status Date | Tuesday, March 8, 2022 |
| Registration Number | 6667339 |
| Registration Date | Tuesday, March 8, 2022 |
| Mark Drawing | 3000 - Illustration: Drawing or design which also includes word(s) / letter(s) / number(s) |
| Published for Opposition Date | Tuesday, May 26, 2020 |
| Description of Mark | The mark consists of horizontal wavy line with a horizontal straight line bisecting the wavy line equally to the left of the words "CMC MATERIALS". |
| Goods and Services | Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for use in the manufacture of advanced integrated circuit devices within the semiconductor industry |
| Pseudo Mark | CABOT MICROELECTRONICS CORPORATION MATERIALS |
| Goods and Services | Industrial abrasives, namely, abrasive compounds for lapping and polishing semiconductors, silicon wafers, glass and metal surfaces; Chemical cleaner directed to the electronics industry; Post-copper chemical mechanical planarization (cmp) cleaning solution for use in the manufacturing and processing of semiconductors; Chemical cleaning solution for processing of integrated circuit (ic) in the opto-electronics and photonics industries; Post-ash cleaning solution for use in the manufacturing and processing of semiconductors; Abrasive preparations, namely, chemical cleaners, namely, abrasive dispersion slurries and cleaning and polishing preparations for use in the finishing of electronic components and substrates, optical components, glass, metals, plastics, machinery, computer parts, magnetic data-storage disks and heads |
| Indication of Colors claimed | Color is not claimed as a feature of the mark. |
| Goods and Services | Chemical slurry for polishing semiconductors; Chemical slurries for polishing semiconductors, silicon wafers, glass, metals, plastics, machinery, electronic components and substrates, optical components, computer parts, magnetic data-storage disks and heads for use in the semiconductor, electronic, rigid disk and magnetic head industries; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth, or otherwise modify their chemical-mechanical properties; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth or otherwise modify their mechanical, physical, chemical and electrical properties; Chemical solutions for use in the manufacturing and processing of semiconductors, namely, photoresist stripper, benzotriazole (BTA) and L-proline solution; Fumed silica dispensed in water used to polish semiconductors; Aqueous metal oxide dispersions for use in semiconductor polishing; Chemical additives, namely, abrasive dispersions for use in the manufacture of electronic components and substrates, optical components, metals, machinery, computer parts, and magnetic data-storage disks and heads; Chemical slurries for use in the manufacture of advanced integrated circuit devices within the semi-conductor industry; High purity chemical compositions for electronic component manufacture; Chemical compositions for use in semiconductor manufacturing, solar cell panel manufacturing and flat panel display manufacturing; Chemical compositions for removal of photoresist and post-etch residues in the manufacture of semiconductors, integrated circuits and related products; Chemicals for use in industry and science; Chemical preparations for use in industry and science, namely, for use in the semiconductor and micro-electronics industries; Chemical mechanical polishing (cmp) slurry and chemical mechanical planarization (cmp) slurry for use in the manufacturing and processing of semiconductors in the optoelectronics and photonics industries |
| Disclaimer with Predetermined Text | "MATERIALS" |
| International Class | 001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry. |
| US Class Codes | 001, 005, 006, 010, 026, 046 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, December 12, 2019 |
| Primary Code | 001 |
| First Use Anywhere Date | Monday, May 24, 2021 |
| First Use In Commerce Date | Monday, May 24, 2021 |
| International Class | 003 - Bleaching preparations and other substances for laundry use; cleaning, polishing, scouring and abrasive preparations; soaps; perfumery, essential oils, cosmetics, hair lotions; dentifrices. |
| US Class Codes | 001, 004, 006, 050, 051, 052 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, December 12, 2019 |
| Primary Code | 003 |
| First Use Anywhere Date | Monday, May 17, 2021 |
| First Use In Commerce Date | Monday, May 17, 2021 |
| International Class | 007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs. |
| US Class Codes | 013, 019, 021, 023, 024, 031, 034, 035 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, December 12, 2019 |
| Primary Code | 007 |
| First Use Anywhere Date | Wednesday, May 19, 2021 |
| First Use In Commerce Date | Wednesday, May 19, 2021 |
| Party Name | CMC MATERIALS LLC |
| Party Type | 31 - New Owner After Registration |
| Legal Entity Type | 16 - Limited Liability Company |
| Address | WILMINGTON, DE 19801 |
| Party Name | CMC MATERIALS, INC. |
| Party Type | 30 - Original Registrant |
| Legal Entity Type | 03 - Corporation |
| Address | AURORA, IL 60504 |
| Party Name | CMC MATERIALS, INC. |
| Party Type | 21 - New Owner After Publication |
| Legal Entity Type | 03 - Corporation |
| Address | AURORA, IL 60504 |
| Party Name | Cabot Microelectronics Corporation |
| Party Type | 20 - Owner at Publication |
| Legal Entity Type | 03 - Corporation |
| Address | Aurora, IL 60504 |
| Party Name | Cabot Microelectronics Corporation |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | Aurora, IL 60504 |
| Event Date | Event Description |
| Wednesday, October 18, 2023 | AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP |
| Wednesday, August 9, 2023 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
| Wednesday, August 9, 2023 | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED |
| Wednesday, August 9, 2023 | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED |
| Wednesday, August 9, 2023 | APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED |
| Wednesday, August 9, 2023 | TEAS CHANGE OF OWNER ADDRESS RECEIVED |
| Tuesday, March 8, 2022 | REGISTERED-PRINCIPAL REGISTER |
| Wednesday, February 2, 2022 | NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED |
| Tuesday, February 1, 2022 | ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED |
| Tuesday, February 1, 2022 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| Monday, January 31, 2022 | STATEMENT OF USE PROCESSING COMPLETE |
| Friday, January 21, 2022 | USE AMENDMENT FILED |
| Monday, January 31, 2022 | SOU EXTENSION 3 GRANTED |
| Friday, January 21, 2022 | SOU EXTENSION 3 FILED |
| Monday, January 31, 2022 | CASE ASSIGNED TO INTENT TO USE PARALEGAL |
| Friday, January 21, 2022 | SOU TEAS EXTENSION RECEIVED |
| Friday, January 21, 2022 | TEAS STATEMENT OF USE RECEIVED |
| Friday, July 23, 2021 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| Wednesday, July 21, 2021 | SOU EXTENSION 2 GRANTED |
| Wednesday, July 21, 2021 | SOU EXTENSION 2 FILED |
| Wednesday, July 21, 2021 | SOU TEAS EXTENSION RECEIVED |
| Wednesday, May 12, 2021 | AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP |
| Saturday, April 3, 2021 | PETITION TO DIRECTOR GRANTED |
| Tuesday, April 13, 2021 | ASSIGNED TO PETITION STAFF |
| Tuesday, April 13, 2021 | ASSIGNED TO PETITION STAFF |
| Friday, January 15, 2021 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| Wednesday, January 13, 2021 | SOU EXTENSION 1 GRANTED |
| Wednesday, January 13, 2021 | SOU EXTENSION 1 FILED |
| Wednesday, January 13, 2021 | SOU TEAS EXTENSION RECEIVED |
| Wednesday, January 13, 2021 | TEAS PETITION TO DIRECTOR RECEIVED |
| Tuesday, July 21, 2020 | NOA E-MAILED - SOU REQUIRED FROM APPLICANT |
| Tuesday, May 26, 2020 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| Tuesday, May 26, 2020 | PUBLISHED FOR OPPOSITION |
| Wednesday, May 6, 2020 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| Wednesday, April 22, 2020 | ASSIGNED TO LIE |
| Tuesday, April 14, 2020 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Monday, April 13, 2020 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Monday, April 13, 2020 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Monday, April 13, 2020 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Tuesday, February 25, 2020 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| Tuesday, February 25, 2020 | NON-FINAL ACTION E-MAILED |
| Tuesday, February 25, 2020 | NON-FINAL ACTION WRITTEN |
| Tuesday, February 25, 2020 | NON-FINAL ACTION WRITTEN |
| Tuesday, February 25, 2020 | NON-FINAL ACTION WRITTEN |
| Monday, February 24, 2020 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| Monday, February 24, 2020 | NON-FINAL ACTION E-MAILED |
| Monday, February 24, 2020 | NON-FINAL ACTION WRITTEN |
| Monday, February 24, 2020 | ASSIGNED TO EXAMINER |
| Friday, December 13, 2019 | NOTICE OF DESIGN SEARCH CODE E-MAILED |
| Thursday, December 12, 2019 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Thursday, December 12, 2019 | NEW APPLICATION ENTERED |