| Goods and Services | Hydrogen production equipment namely electrolysis machines for generating hydrogen; chemical processing machines and apparatus; Hydrogen station equipment, namely, hydrogen supplying machines for service stations; Fuel supply system comprised of fuel dispensing machines, namely, fuel dispensing machines for vehicles and its components; AC electric motors and DC electric motors and their parts not including those for land; Alternators; direct current generators; Hydrogen-powered gas turbine generator; Hydrogen-based boiler power generation equipment namely generators; Semiconductor manufacturing equipment, namely, wafer processing machines, photolithography systems comprised of steppers and coater-developers, etching machines for etching conductive films, insulating films, semiconductor films, oxide films, and nitride films, ion implantation machines, deposition machines for depositing conductive films, insulating films, semiconductor films, and diffusion barrier films, cleaning machines for removing particles, organic residues, metal residues, and chemical residues from semiconductor wafers, chemical mechanical polishing machines, semiconductor testing machines, and their structural replacement parts; Organic light-emitting diode manufacturing equipment, namely, substrate cleaning machines, chemical vapor deposition systems, organic material deposition equipment comprised of load lock chambers, degas chambers, deposition chambers, and mask alignment chambers, patterning machines for forming thin films including organic layers, electrode layers, and encapsulation layers into predetermined patterns, and etching machines for selectively removing unwanted portions of transparent electrodes, metal films, and insulating films, encapsulation machines for encapsulating light-emitting devices including organic layers and electrodes, and thin-film encapsulation systems, deposition mask alignment equipment comprised of mask holding mechanisms, substrate stages, position adjustment mechanisms, drive mechanisms, optical alignment sensors, gap control mechanisms, and control computers, inspection and testing machines for inspecting and testing electrical characteristics, optical characteristics, dimensional accuracy, positional accuracy, and encapsulation integrity of organic light-emitting diode devices, and control units for controlling operation of manufacturing equipment, process conditions, material handling, interlock functions, and monitoring functions in organic light-emitting diode manufacturing processes; Manufacturing equipment for organic electroluminescent display devices, namely, substrate handling robots, thin-film encapsulation equipment for forming encapsulation layers to protect organic electroluminescent materials from moisture and external environment during manufacturing, mask alignment systems, organic material deposition equipment for depositing organic thin-film materials including light-emitting layers and charge transport layers of organic electroluminescent devices on substrates, inspection modules for inspecting film deposition quality including film thickness and uniformity, patterning accuracy, electrical characteristics, and optical characteristics, and their structural replacement parts; LCD panel manufacturing equipment, namely, substrate cleaning machines, alignment machines, liquid crystal injection machines, sealing machines for sealing liquid crystal materials between glass substrates with sealing materials, inspection machines for inspecting display defects including pixel defects, luminance non-uniformity and color non-uniformity, electrical characteristics including wiring disconnection and short circuits, thin film transistor on/off characteristics, driving voltage and leakage current, and appearance defects including scratches, contamination, and foreign matter, and their structural replacement parts; Semiconductor thin film formation equipment, namely, chemical vapor deposition machines, physical vapor deposition machines, atomic layer deposition machines, sputtering machines, epitaxial growth reactors, and their structural replacement parts; Vacuum thin film forming equipment, namely, vacuum evaporation systems comprised of vacuum chamber units, evacuation and vacuum system units, evaporation source units, substrate holding and transfer units, patterning and deposition control units, film thickness and process control units, and material supply and preheating and drying units, sputtering systems comprised of vacuum chamber units, evacuation and vacuum system units, gas introduction and pressure control units, plasma generation and power supply units, target and cathode units, substrate stage and transfer units, film thickness and process control units, and shielding units, molecular beam epitaxy chambers, ion plating apparatus, and their structural replacement parts; Vacuum deposition equipment, namely, vacuum coating machines, vacuum plating machines, ion plating machines, and their structural replacement parts; Molecular launcher machines for thin film deposition in semiconductor manufacturing; Sputtering equipment, namely, magnetron sputtering machines, DC and RF sputtering systems, batch and in-line sputter deposition machines, and their structural replacement parts; Ultrasonic cleaning equipment, namely, ultrasonic bath cleaners, ultrasonic spray cleaning systems comprised of cleaning chambers, ultrasonic oscillation units, spray supply units, cleaning liquid supply and circulation units, wafer transfer and holding units, cleaning process control units, drying units, and waste liquid and exhaust units, transducer-based cleaning systems comprised of cleaning tank units, transducer units, ultrasonic oscillation units, cleaning liquid supply and circulation units, wafer transfer and holding units, control units, drying units, and waste liquid and exhaust units, and their structural replacement parts; Manufacturing equipment for electronic circuit boards, namely, PCB etching machines, solder mask application systems comprised of board transfer and positioning units, surface cleaning units, resist supply units, coating units, film thickness and coating quality control units, exposure units, developing units, drying units, control units, and exhaust and waste liquid treatment units, drilling and routing machines, pick-and-place machines for picking electronic components including chip resistors, capacitors, integrated circuits, transistors, diodes, LEDs, and sensor components and placing the picked electronic components onto predetermined mounting positions on circuit boards, reflow soldering ovens, and their structural replacement parts; Plasma etching equipment, namely, dry etching machines, reactive ion etching machines, deep reactive ion etching machines, plasma ashing systems comprised of plasma sources, reaction chambers, gas supply units, exhaust units, transfer units, temperature control units, and process control and monitoring units, and structural replacement parts therefor, for use in semiconductor manufacturing; Gate valves for vacuum deposition equipment used in semiconductor manufacturing; Semiconductor manufacturing equipment, namely, jigs and fixtures for holding wafers, substrates, or components during processing, assembly, testing, or transport; Semiconductor manufacturing equipment, namely, alignment fixtures for aligning wafers during semiconductor manufacturing processes, polishing and dicing blades being machine parts for use in semiconductor wafer polishing and dicing machines, and calibration tools and modules for calibrating semiconductor manufacturing equipment |
