CFB Trademark

Trademark Overview

On Friday, May 8, 2026, a trademark application was filed for CFB with the United States Patent and Trademark Office. The USPTO has given the CFB trademark a serial number of 99811360. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Friday, May 8, 2026. This trademark is owned by OKI ELECTRIC INDUSTRY CO., LTD.. The CFB trademark is filed in the Computer & Software Products & Electrical & Scientific Products, Treatment & Processing of Materials Services, and Computer & Software Services & Scientific Services categories with the following description:

Processing and manufacturing of semiconductor wafers; assembling and processing of semiconductor elements; manufacturing, assembling and processing services of semiconductor components and integrated circuits; assembling and packing for semiconductors and integrated circuits; assembling and packaging of semiconductor wafers and integrated circuits; custom manufacturing of wafer components (thin films using epitaxial technology), wafer IC chips, printed circuit boards, and semiconductor circuits; custom manufacturing of semiconductor wafers for others (including bonding thin films using epitaxial technology to semiconductor wafers); custom manufacturing and processing of thin semiconductor films on semiconductor substrates.

(Class 42) Research in the field of semiconductor processing technology; testing, research and development relating to electronic circuits, semiconductor elements, integrated circuits and large scale integrated circuits; designing of electronic circuits, semiconductor elements, integrated circuits and large scale integrated circuits.

Semiconductor wafers; semiconductor substrates; semiconductor elements; light emitting diode chips; light emitting diode elements; photodiodes; integrated circuits; diode arrays; semiconductors; semiconductor devices formed by bonding heterogeneous materials; semiconductor devices; semiconductor wafers with thin films bonded together using epitaxial technology; optical semiconductors.
cfb

General Information

Serial Number99811360
Word MarkCFB
Filing DateFriday, May 8, 2026
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateFriday, May 8, 2026
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements

Goods and ServicesProcessing and manufacturing of semiconductor wafers; assembling and processing of semiconductor elements; manufacturing, assembling and processing services of semiconductor components and integrated circuits; assembling and packing for semiconductors and integrated circuits; assembling and packaging of semiconductor wafers and integrated circuits; custom manufacturing of wafer components (thin films using epitaxial technology), wafer IC chips, printed circuit boards, and semiconductor circuits; custom manufacturing of semiconductor wafers for others (including bonding thin films using epitaxial technology to semiconductor wafers); custom manufacturing and processing of thin semiconductor films on semiconductor substrates.
Goods and Services(Class 42) Research in the field of semiconductor processing technology; testing, research and development relating to electronic circuits, semiconductor elements, integrated circuits and large scale integrated circuits; designing of electronic circuits, semiconductor elements, integrated circuits and large scale integrated circuits.
Goods and ServicesSemiconductor wafers; semiconductor substrates; semiconductor elements; light emitting diode chips; light emitting diode elements; photodiodes; integrated circuits; diode arrays; semiconductors; semiconductor devices formed by bonding heterogeneous materials; semiconductor devices; semiconductor wafers with thin films bonded together using epitaxial technology; optical semiconductors.

Classification Information

International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateFriday, May 8, 2026
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE
International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status Code6 - Active
Class Status DateFriday, May 8, 2026
Primary Code040
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE
International Class042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
US Class Codes100, 101
Class Status Code6 - Active
Class Status DateFriday, May 8, 2026
Primary Code042
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History

Party NameOKI ELECTRIC INDUSTRY CO., LTD.
Party Type10 - Original Applicant
Legal Entity Type99 - Other
AddressTokyo 105-8460
JP

Trademark Events

Event DateEvent Description
Friday, May 8, 2026NEW APPLICATION ENTERED
Friday, May 8, 2026APPLICATION FILING RECEIPT MAILED

Related Keywords

semiconductor circuits integrated wafers processing elements manufacturing technology assembling films