| Serial Number | 79313789 |
| Word Mark | CELLFIL |
| Filing Date | Monday, February 22, 2021 |
| Status | 700 - REGISTERED |
| Status Date | Tuesday, May 31, 2022 |
| Registration Number | 6741699 |
| Registration Date | Tuesday, May 31, 2022 |
| Mark Drawing | 4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | Tuesday, March 15, 2022 |
| Goods and Services | Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for sealing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the form of film for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the form of film for sealing electronic components; electrical insulating materials, namely, insulating coating materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing display panels; electrical insulating materials, namely, insulating coating materials for protecting copper foil on the surface of printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing package application boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, electrical insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for sealing electronic components; electrical insulating materials, namely, insulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics |
| Goods and Services | Dyes, namely, synthetic dyes; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks being printing inks for use in the process of producing electronic components; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink |
| Goods and Services | Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; chemicals for use in the process of producing printed circuit boards, namely, etching resist; chemicals for use in the process of producing printed circuit boards, namely, photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the form of film for sealing electronic components; unexposed dry films, namely, mold dry films for electronic components; unexposed dry films, namely, insulation mold dry films for electronic components; unexposed dry films, namely, thermal curing type mold dry films for electronic components; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light in the color of black in the form of paste for use in the process of forming of black matrix; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; chemical coatings used in the manufacture of printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical agents for plugging holes on printed circuit boards; chemical sealants for use in the process of producing electronic components; synthetic resins that are used as sealants for use in the process of producing electronic components; chemical preparations for industrial purposes; industrial chemicals; conductive adhesives for industrial purposes; glue and adhesives for industrial purposes |
| International Class | 001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry. |
| US Class Codes | 001, 005, 006, 010, 026, 046 |
| Class Status Code | 6 - Active |
| Class Status Date | Wednesday, June 30, 2021 |
| Primary Code | 001 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 002 - Paints, varnishes, lacquers; preservatives against rust and against deterioration of wood; colorants; mordants; raw natural resins; metals in foil and powder form for painters, decorators, printers and artists. |
| US Class Codes | 006, 011, 016 |
| Class Status Code | 6 - Active |
| Class Status Date | Wednesday, June 30, 2021 |
| Primary Code | 002 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 017 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal. |
| US Class Codes | 001, 005, 012, 013, 035, 050 |
| Class Status Code | 6 - Active |
| Class Status Date | Wednesday, June 30, 2021 |
| Primary Code | 017 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | TAIYO HOLDINGS CO., LTD. |
| Party Type | 30 - Original Registrant |
| Legal Entity Type | 03 - Corporation |
| Address | JP |
| Party Name | TAIYO HOLDINGS CO., LTD. |
| Party Type | 20 - Owner at Publication |
| Legal Entity Type | 03 - Corporation |
| Address | JP |
| Party Name | TAIYO HOLDINGS CO., LTD. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | JP |
| Event Date | Event Description |
| Thursday, September 15, 2022 | FINAL DISPOSITION NOTICE SENT TO IB |
| Thursday, September 15, 2022 | FINAL DISPOSITION PROCESSED |
| Wednesday, August 31, 2022 | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB |
| Saturday, July 9, 2022 | CHANGE OF NAME/ADDRESS REC'D FROM IB |
| Tuesday, May 31, 2022 | NOTICE OF REGISTRATION CONFIRMATION EMAILED |
| Tuesday, May 31, 2022 | REGISTERED-PRINCIPAL REGISTER |
| Monday, March 21, 2022 | NOTIFICATION PROCESSED BY IB |
| Tuesday, March 15, 2022 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| Tuesday, March 15, 2022 | PUBLISHED FOR OPPOSITION |
| Wednesday, February 23, 2022 | NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB |
| Wednesday, February 23, 2022 | NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB |
| Wednesday, February 23, 2022 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| Monday, February 14, 2022 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
| Monday, February 14, 2022 | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED |
| Monday, February 14, 2022 | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED |
| Wednesday, February 9, 2022 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Wednesday, February 9, 2022 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Wednesday, February 9, 2022 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Wednesday, February 9, 2022 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Friday, November 5, 2021 | REFUSAL PROCESSED BY IB |
| Tuesday, October 12, 2021 | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB |
| Tuesday, October 12, 2021 | REFUSAL PROCESSED BY MPU |
| Saturday, September 25, 2021 | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW |
| Friday, September 24, 2021 | NON-FINAL ACTION WRITTEN |
| Thursday, September 16, 2021 | ASSIGNED TO EXAMINER |
| Thursday, August 5, 2021 | CORRECTION FROM IB ENTERED - NO REVIEW REQUIRED |
| Saturday, July 31, 2021 | CORRECTION TRANSACTION RECEIVED FROM IB |
| Tuesday, July 6, 2021 | APPLICATION FILING RECEIPT MAILED |
| Wednesday, June 30, 2021 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM |
| Monday, June 28, 2021 | LIMITATION FROM ORIGINAL APPLICATION ENTERED |
| Thursday, June 24, 2021 | SN ASSIGNED FOR SECT 66A APPL FROM IB |