CELERITAS Trademark

Trademark Overview


On Thursday, November 21, 2024, a trademark application was filed for CELERITAS with the United States Patent and Trademark Office. The USPTO has given the CELERITAS trademark a serial number of 98865878. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Thursday, November 21, 2024. This trademark is owned by ADVANCED CHIP AND CIRCUIT MATERIALS, INC.. The CELERITAS trademark is filed in the Rubber Products category with the following description:

dielectric prepregs, films, substrates, and copper clad and unclad laminates for use in the manufacture of printed circuit boards (PCBs) and integrated circuit (IC) packages

General Information


Serial Number98865878
Word MarkCELERITAS
Filing DateThursday, November 21, 2024
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateThursday, November 21, 2024
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and Servicesdielectric prepregs, films, substrates, and copper clad and unclad laminates for use in the manufacture of printed circuit boards (PCBs) and integrated circuit (IC) packages

Classification Information


International Class017 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal.
US Class Codes001, 005, 012, 013, 035, 050
Class Status Code6 - Active
Class Status DateThursday, November 21, 2024
Primary Code017
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameADVANCED CHIP AND CIRCUIT MATERIALS, INC.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressSan Jose, CA 95138

Trademark Events


Event DateEvent Description
Thursday, November 21, 2024NEW APPLICATION ENTERED