Trademark Overview
On Friday, May 16, 2025, a trademark application was filed for CAPRAM with the United States Patent and Trademark Office. The USPTO has given the CAPRAM trademark a serial number of 79430208. The federal status of this trademark filing is PUBLICATION/ISSUE REVIEW COMPLETE as of Wednesday, June 17, 2026. This trademark is owned by SEMRON GmbH. The CAPRAM trademark is filed in the Chemical Products, Computer & Software Products & Electrical & Scientific Products, Treatment & Processing of Materials Services, and Computer & Software Services & Scientific Services categories with the following description:
Custom manufacturing of computer chips for others; custom manufacturing of integrated circuits for others; custom manufacturing of semiconductor components, devices and circuits for others; custom manufacturing and assembly services for semiconductor components and integrated circuits for others; custom manufacturing of AI hardware for others; semiconductor processing services, namely, ion implantation services, chemical vapor deposition services, physical vapor deposition services, atomic layer deposition services, photolithography services, and chemical mechanical planarization services for the manufacture of semiconductors; treatment and processing of semiconductors, namely, wafer thinning services, through-silicon via etching services, wafer bonding services, annealing services, and dry etching services for the manufacture of three-dimensional integrated circuits.
Semiconductors; semiconductor devices; semiconductor chips; semiconductor power elements; semiconductor memory devices; semiconductor memory units; computer chipsets; integrated circuit chips; chips, namely, integrated circuits; silicon chips in the nature of electronic components; electronic memory chips in the nature of integrated circuits; computer chipsets for transferring data to and from a central processing unit; recorded computer software for developing integrated circuits; recorded software for operating and managing integrated circuit components; integrated circuit memories; electronic memory circuits in the nature of integrated circuits; integrated circuit memory cards; compilers, namely, downloadable compiler software; downloadable artificial intelligence software; downloadable artificial intelligence software for analysis; downloadable machine learning software; downloadable machine learning software for analysis; memory devices, namely, memory cards; memory modules; downl...
Integrated circuit design; computer hardware design; computer chip design and development; AI hardware design and development; computer hardware development; electronic circuit design engineering services; semiconductor manufacturing technological consulting; silicon photonics chip manufacturing technological research; semiconductor technology research and development; artificial intelligence technology research and development; artificial intelligence technology research; artificial intelligence technology consulting; provision of computer programs, namely, providing online, non-downloadable software for artificial intelligence in data networks; artificial intelligence technology consulting; edge computing research; semiconductor processing technology research; semiconductor processing technology technical consulting; In-memory computing technology development; Software as a Service (SaaS) featuring software for use in optimizing, quantizing, and compressing artificial intelligence as...
Silicon; semiconductor silicon; chemicals for the manufacture of semiconductors; chemical preparations for the manufacture of electronic components; chemical compositions for the manufacture of computer chips; industrial chemicals for the manufacture of integrated circuits; chemical products for the electronics industry, namely, deposition chemicals, etching chemicals, cleaning chemicals, and surface treatment chemicals for use in flash memory manufacture; chemicals for the manufacture of semiconductor chips; etchants for the manufacture of semiconductors; adhesives for industrial purposes in the form of chips; dopants, namely, boron, phosphorus, arsenic, and antimony, for the manufacture of semiconductors; chemical starting materials, namely silane, tetraethyl orthosilicate, trimethylaluminum, hafnium tetrachloride, and tungsten hexafluoride, for the deposition of thin films on semiconductor wafers for the manufacture of semiconductors; chemical substances, namely silane, tetraethyl o...
