C-MAX Trademark

Trademark Overview


On Wednesday, April 1, 2026, a trademark application was filed for C-MAX with the United States Patent and Trademark Office. The USPTO has given the C-MAX trademark a serial number of 79454277. The federal status of this trademark filing is NEW APPLICATION - ASSIGNED TO EXAMINER as of Monday, July 20, 2026. This trademark is owned by NIHON HANDA Co., Ltd.. The C-MAX trademark is filed in the Chemical Products category with the following description:

Conductive adhesives; copper particle conductive adhesives.
c-max

General Information


Serial Number79454277
Word MarkC-MAX
Filing DateWednesday, April 1, 2026
Status638 - NEW APPLICATION - ASSIGNED TO EXAMINER
Status DateMonday, July 20, 2026
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Pseudo MarkC MAX
Goods and ServicesConductive adhesives; copper particle conductive adhesives.

Classification Information


International Class001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
US Class Codes001, 005, 006, 010, 026, 046
Class Status Code6 - Active
Class Status DateThursday, July 16, 2026
Primary Code001
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameNIHON HANDA Co., Ltd.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressJP

Trademark Events


Event DateEvent Description
Thursday, July 16, 2026SN ASSIGNED FOR SECT 66A APPL FROM IB
Friday, July 17, 2026NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Friday, July 17, 2026APPLICATION FILING RECEIPT MAILED
Monday, July 20, 2026ASSIGNED TO EXAMINER

Related Keywords


conductive adhesives particle copper