| Serial Number | 79364266 |
| Word Mark | BONDTECH |
| Filing Date | Wednesday, July 27, 2022 |
| Status | 700 - REGISTERED |
| Status Date | Tuesday, October 8, 2024 |
| Registration Number | 7525561 |
| Registration Date | Tuesday, October 8, 2024 |
| Mark Drawing | 3 - Illustration: Drawing or design which also includes word(s) / letter(s) / number(s) |
| Published for Opposition Date | Tuesday, July 23, 2024 |
| Description of Mark | The mark consists of the stylized wording "BONDTECH" combined with an oval outline. |
| NOT AVAILABLE | "BOND TECH" for Semiconductor manufacturing equipment, namely, semiconductor manufacturing machines, and semiconductor wafer processing equipment; semiconductor manufacturing machines and components thereof; semiconductor manufacturing machines and structural components thereof; machines for manufacturing semiconductor equipment, semiconductor manufacturing machine components and appendages being parts of semiconductor manufacturing machines; semiconductor wafer processing machines and equipment, and structural components thereof; robots for manufacturing semiconductors, and structural components and appendages in the nature of structural parts thereof; semiconductor wafer processing equipment and structural components thereof; wafer manufacturing equipment for semiconductor manufacturing; semiconductor element manufacturing machines; semiconductor element manufacturing equipment, namely, machines therefor; integrated circuit manufacturing equipment, namely, machines therefor, and components thereof; stacked semiconductor chips manufacturing equipment, namely, machines for manufacturing stacked semiconductor chips; equipment for manufacturing and processing microelectromechanical systems (MEMS), namely, electromechanical manufacturing machines and components and appendages in the nature of parts thereof; semiconductor plating devices being parts of machines; semiconductor thin-film formation devices being parts of machines, in International Class 7, and Repair and maintenance of semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of semiconductor product manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor processing machines and apparatuses, and providing information related thereto; repair and maintenance of robots for manufacturing semiconductors, and providing information related thereto; repair and maintenance of semiconductor wafer processing equipment, and providing information related thereto; repair and maintenance of wafer manufacturing equipment for semiconductor manufacturing, and providing information related thereto; repair and maintenance of semiconductor element manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of semiconductor element manufacturing equipment, and providing information related thereto; repair and maintenance of integrated circuit manufacturing equipment, and providing information related thereto; repair and maintenance of stacked semiconductor chips manufacturing equipment, and providing information related thereto; repair and maintenance of equipment for manufacturing and processing microelectromechanical systems (MEMS), and providing information related thereto; repair and maintenance of devices for mounting IC chips on circuit boards, and providing information related thereto; repair and maintenance of semiconductor plating devices, and providing information related thereto; repair and maintenance of semiconductor thin-film formation devices, and providing information related thereto; repair and maintenance of electronic machines and apparatuses, and providing information related thereto in International Class 37 |
| Goods and Services | Semiconductor manufacturing equipment, namely, semiconductor manufacturing machines, and semiconductor wafer processing equipment; machine couplings and transmission components and machine elements in the nature of shock prevention devices for semiconductor manufacturing equipment; semiconductor manufacturing machines and components thereof; semiconductor manufacturing machines and semiconductor exposure apparatuses for use in manufacture, and structural components thereof; positioning devices for semiconductor manufacturing equipment, namely, ball transfer units, and components thereof, namely, bearings, as parts of machines; hydraulic and pneumatic controls for semiconductor manufacturing equipment, and components thereof, namely, hydraulic valves being parts of machines, and oil-water separators for pneumatic controls being parts of machines; machines for manufacturing semiconductor equipment, semiconductor manufacturing machine components and appendages being parts of semiconductor manufacturing machines; semiconductor wafer processing machines and equipment, and structural components thereof; robots for manufacturing semiconductors, and structural components and appendages in the nature of structural parts thereof; semiconductor wafer processing equipment and structural components thereof; wafer manufacturing equipment for semiconductor manufacturing; semiconductor element manufacturing machines and exposure apparatuses for use in manufacture; semiconductor element manufacturing equipment, namely, machines therefor; integrated circuit manufacturing equipment, namely, machines therefor, and components thereof; stacked semiconductor chips manufacturing equipment, namely, machines for manufacturing stacked semiconductor chips; machines for nanoimprint lithography (NIL) for semiconductor manufacturing; equipment for manufacturing and processing microelectromechanical systems (MEMS), namely, electromechanical manufacturing and marking machines and components and appendages in the nature of parts thereof; equipment for cleaning microelectromechanical systems (MEMS), namely, dust removing installations for cleaning purposes, and components and appendages in the nature of parts thereof; cleaning devices for semiconductor manufacturing, namely, cleaning machines for semiconductor manufacturing machines; devices in the nature of machines for mounting IC chips on circuit boards; plasma etching machines; semiconductor exposure devices, namely, apparatus for use in manufacture; semiconductor cutting devices being parts of machines; semiconductor polishing devices being parts of machines; semiconductor plating devices being parts of machines; semiconductor etching devices being parts of machines; semiconductor thin-film formation devices being parts of machines; none of the aforementioned goods being 3D printers or machines for moulding plastics, or parts or fittings thereof |
| Goods and Services | Repair and maintenance of semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of positioning devices for semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of control devices for semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor product manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor processing machines and apparatuses, and providing information related thereto; repair and maintenance of robots for manufacturing semiconductors, and providing information related thereto; repair and maintenance of semiconductor wafer processing equipment, and providing information related thereto; repair and maintenance of wafer manufacturing equipment for semiconductor manufacturing, and providing information related thereto; repair and maintenance of semiconductor element manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of semiconductor element manufacturing equipment, and providing information related thereto; repair and maintenance of integrated circuit manufacturing equipment, and providing information related thereto; repair and maintenance of stacked semiconductor chips manufacturing equipment, and providing information related thereto; repair and maintenance of machines for nanoimprint lithography (NIL) for semiconductor manufacturing, and providing information related thereto; repair and maintenance of equipment for manufacturing and processing microelectromechanical systems (MEMS), and providing information related thereto; repair and maintenance of equipment for cleaning microelectromechanical systems (MEMS), and providing information related thereto; repair and maintenance of cleaning devices for semiconductor manufacturing, and providing information related thereto; repair and maintenance of devices for mounting IC chips on circuit boards, and providing information related thereto; repair and maintenance of wafer foreign matter inspection devices for semiconductor manufacturing, and providing information related thereto; repair and maintenance of plasma etching machines, and providing information related thereto; repair and maintenance of semiconductor exposure devices, and providing information related thereto; repair and maintenance of semiconductor cutoff devices, and providing information related thereto; repair and maintenance of semiconductor polishing devices, and providing information related thereto; repair and maintenance of semiconductor plating devices, and providing information related thereto; repair and maintenance of semiconductor etching devices, and providing information related thereto; repair and maintenance of semiconductor thin-film formation devices, and providing information related thereto; repair and maintenance of semiconductor drying devices, and providing information related thereto; cleaning of machines and apparatuses for semiconductor manufacturing; cleaning of semiconductor manufacturing equipment; installation work of semiconductor testing equipment, and providing information related thereto; installation work of semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of electronic machines and apparatuses, and providing information related thereto; installation work, repair, and maintenance of computer hardware, and providing information related thereto; none of the aforementioned services being intended for 3D printers or for machines for moulding plastics, or parts thereof |
| International Class | 007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs. |
| US Class Codes | 013, 019, 021, 023, 024, 031, 034, 035 |
| Class Status Code | 6 - Active |
| Class Status Date | Friday, March 3, 2023 |
| Primary Code | 007 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 037 - Building construction; repair; installation services. |
| US Class Codes | 100, 103, 106 |
| Class Status Code | 6 - Active |
| Class Status Date | Friday, March 3, 2023 |
| Primary Code | 037 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | Bondtech Co., Ltd. |
| Party Type | 30 - Original Registrant |
| Legal Entity Type | 03 - Corporation |
| Address | JP |
| Party Name | Bondtech Co., Ltd. |
| Party Type | 20 - Owner at Publication |
| Legal Entity Type | 03 - Corporation |
| Address | JP |
| Party Name | Bondtech Co., Ltd. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | JP |
| Event Date | Event Description |
| Thursday, March 2, 2023 | SN ASSIGNED FOR SECT 66A APPL FROM IB |
| Friday, March 3, 2023 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Tuesday, March 7, 2023 | APPLICATION FILING RECEIPT MAILED |
| Monday, May 15, 2023 | ASSIGNED TO EXAMINER |
| Monday, May 22, 2023 | NON-FINAL ACTION WRITTEN |
| Tuesday, May 23, 2023 | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW |
| Wednesday, July 5, 2023 | REFUSAL PROCESSED BY MPU |
| Wednesday, July 5, 2023 | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB |
| Wednesday, July 26, 2023 | REFUSAL PROCESSED BY IB |
| Sunday, July 30, 2023 | LIMITATION OF GOODS RECEIVED FROM IB |
| Wednesday, October 25, 2023 | LIMITATION FROM THE IB - REQUEST EXAM REVIEW |
| Wednesday, October 25, 2023 | ATTORNEY REVIEW COMPLETED |
| Thursday, December 21, 2023 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Thursday, December 21, 2023 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Friday, December 22, 2023 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Tuesday, January 9, 2024 | NON-FINAL ACTION WRITTEN |
| Tuesday, January 9, 2024 | NON-FINAL ACTION E-MAILED |
| Tuesday, January 9, 2024 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| Monday, June 17, 2024 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Monday, June 17, 2024 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Monday, June 17, 2024 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Thursday, June 20, 2024 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Wednesday, July 3, 2024 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| Tuesday, July 23, 2024 | PUBLISHED FOR OPPOSITION |
| Tuesday, July 23, 2024 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| Wednesday, July 31, 2024 | NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB |
| Wednesday, July 31, 2024 | NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB |
| Saturday, August 17, 2024 | NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB |
| Tuesday, October 8, 2024 | REGISTERED-PRINCIPAL REGISTER |
| Tuesday, October 8, 2024 | NOTICE OF REGISTRATION CONFIRMATION EMAILED |
| Wednesday, January 8, 2025 | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB |
| Friday, March 14, 2025 | FINAL DISPOSITION PROCESSED |
| Friday, March 14, 2025 | FINAL DISPOSITION NOTICE SENT TO IB |
| Friday, April 4, 2025 | FINAL DECISION TRANSACTION PROCESSED BY IB |
| Thursday, December 18, 2025 | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED |
| Thursday, December 18, 2025 | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED |
| Thursday, December 18, 2025 | TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS |
| Thursday, December 18, 2025 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |