| Description of Mark | The mark consists of the stylized wording "BONDTECH" combined with an oval outline. |
| Goods and Services | Semiconductor manufacturing equipment, namely, semiconductor manufacturing machines, and semiconductor wafer processing equipment; machine couplings and transmission components and machine elements in the nature of shock prevention devices for semiconductor manufacturing equipment; semiconductor manufacturing machines and components thereof; semiconductor manufacturing machines and semiconductor exposure apparatuses for use in manufacture, and structural components thereof; positioning devices for semiconductor manufacturing equipment, namely, ball transfer units, and components thereof, namely, bearings, as parts of machines; hydraulic and pneumatic controls for semiconductor manufacturing equipment, and components thereof, namely, hydraulic valves being parts of machines, and oil-water separators for pneumatic controls being parts of machines; machines for manufacturing semiconductor equipment, semiconductor manufacturing machine components and appendages being parts of semiconductor manufacturing machines; semiconductor wafer processing machines and equipment, and structural components thereof; robots for manufacturing semiconductors, and structural components and appendages in the nature of structural parts thereof; semiconductor wafer processing equipment and structural components thereof; wafer manufacturing equipment for semiconductor manufacturing; semiconductor element manufacturing machines and exposure apparatuses for use in manufacture; semiconductor element manufacturing equipment, namely, machines therefor; integrated circuit manufacturing equipment, namely, machines therefor, and components thereof; stacked semiconductor chips manufacturing equipment, namely, machines for manufacturing stacked semiconductor chips; machines for nanoimprint lithography (NIL) for semiconductor manufacturing; equipment for manufacturing and processing microelectromechanical systems (MEMS), namely, electromechanical manufacturing and marking machines and components and appendages in the nature of parts thereof; equipment for cleaning microelectromechanical systems (MEMS), namely, dust removing installations for cleaning purposes, and components and appendages in the nature of parts thereof; cleaning devices for semiconductor manufacturing, namely, cleaning machines for semiconductor manufacturing machines; devices in the nature of machines for mounting IC chips on circuit boards; plasma etching machines; semiconductor exposure devices, namely, apparatus for use in manufacture; semiconductor cutting devices being parts of machines; semiconductor polishing devices being parts of machines; semiconductor plating devices being parts of machines; semiconductor etching devices being parts of machines; semiconductor thin-film formation devices being parts of machines; none of the aforementioned goods being 3D printers or machines for moulding plastics, or parts or fittings thereof |
| Goods and Services | Repair and maintenance of semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of positioning devices for semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of control devices for semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor product manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor processing machines and apparatuses, and providing information related thereto; repair and maintenance of robots for manufacturing semiconductors, and providing information related thereto; repair and maintenance of semiconductor wafer processing equipment, and providing information related thereto; repair and maintenance of wafer manufacturing equipment for semiconductor manufacturing, and providing information related thereto; repair and maintenance of semiconductor element manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of semiconductor element manufacturing equipment, and providing information related thereto; repair and maintenance of integrated circuit manufacturing equipment, and providing information related thereto; repair and maintenance of stacked semiconductor chips manufacturing equipment, and providing information related thereto; repair and maintenance of machines for nanoimprint lithography (NIL) for semiconductor manufacturing, and providing information related thereto; repair and maintenance of equipment for manufacturing and processing microelectromechanical systems (MEMS), and providing information related thereto; repair and maintenance of equipment for cleaning microelectromechanical systems (MEMS), and providing information related thereto; repair and maintenance of cleaning devices for semiconductor manufacturing, and providing information related thereto; repair and maintenance of devices for mounting IC chips on circuit boards, and providing information related thereto; repair and maintenance of wafer foreign matter inspection devices for semiconductor manufacturing, and providing information related thereto; repair and maintenance of plasma etching machines, and providing information related thereto; repair and maintenance of semiconductor exposure devices, and providing information related thereto; repair and maintenance of semiconductor cutoff devices, and providing information related thereto; repair and maintenance of semiconductor polishing devices, and providing information related thereto; repair and maintenance of semiconductor plating devices, and providing information related thereto; repair and maintenance of semiconductor etching devices, and providing information related thereto; repair and maintenance of semiconductor thin-film formation devices, and providing information related thereto; repair and maintenance of semiconductor drying devices, and providing information related thereto; cleaning of machines and apparatuses for semiconductor manufacturing; cleaning of semiconductor manufacturing equipment; installation work of semiconductor testing equipment, and providing information related thereto; installation work of semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of electronic machines and apparatuses, and providing information related thereto; installation work, repair, and maintenance of computer hardware, and providing information related thereto; none of the aforementioned services being intended for 3D printers or for machines for moulding plastics, or parts thereof |
| NOT AVAILABLE | "BOND TECH" for Semiconductor manufacturing equipment, namely, semiconductor manufacturing machines, and semiconductor wafer processing equipment; semiconductor manufacturing machines and components thereof; semiconductor manufacturing machines and structural components thereof; machines for manufacturing semiconductor equipment, semiconductor manufacturing machine components and appendages being parts of semiconductor manufacturing machines; semiconductor wafer processing machines and equipment, and structural components thereof; robots for manufacturing semiconductors, and structural components and appendages in the nature of structural parts thereof; semiconductor wafer processing equipment and structural components thereof; wafer manufacturing equipment for semiconductor manufacturing; semiconductor element manufacturing machines; semiconductor element manufacturing equipment, namely, machines therefor; integrated circuit manufacturing equipment, namely, machines therefor, and components thereof; stacked semiconductor chips manufacturing equipment, namely, machines for manufacturing stacked semiconductor chips; equipment for manufacturing and processing microelectromechanical systems (MEMS), namely, electromechanical manufacturing machines and components and appendages in the nature of parts thereof; semiconductor plating devices being parts of machines; semiconductor thin-film formation devices being parts of machines, in International Class 7, and Repair and maintenance of semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of semiconductor product manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor processing machines and apparatuses, and providing information related thereto; repair and maintenance of robots for manufacturing semiconductors, and providing information related thereto; repair and maintenance of semiconductor wafer processing equipment, and providing information related thereto; repair and maintenance of wafer manufacturing equipment for semiconductor manufacturing, and providing information related thereto; repair and maintenance of semiconductor element manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of semiconductor element manufacturing equipment, and providing information related thereto; repair and maintenance of integrated circuit manufacturing equipment, and providing information related thereto; repair and maintenance of stacked semiconductor chips manufacturing equipment, and providing information related thereto; repair and maintenance of equipment for manufacturing and processing microelectromechanical systems (MEMS), and providing information related thereto; repair and maintenance of devices for mounting IC chips on circuit boards, and providing information related thereto; repair and maintenance of semiconductor plating devices, and providing information related thereto; repair and maintenance of semiconductor thin-film formation devices, and providing information related thereto; repair and maintenance of electronic machines and apparatuses, and providing information related thereto in International Class 37 |
