BONDCOMPLY Trademark

Trademark Overview

On Monday, May 11, 2026, a trademark application was filed for BONDCOMPLY with the United States Patent and Trademark Office. The USPTO has given the BONDCOMPLY trademark a serial number of 99816589. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Monday, May 11, 2026. This trademark is owned by CivicSpec LLC. The BONDCOMPLY trademark is filed in the Computer & Software Services & Scientific Services category with the following description:

Software as a service (SAAS) services featuring software for managing post-issuance compliance for municipal bonds, including continuing disclosure, arbitrage rebate, covenants, and recordkeeping
bondcomply

General Information

Serial Number99816589
Word MarkBONDCOMPLY
Filing DateMonday, May 11, 2026
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateMonday, May 11, 2026
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements

Pseudo MarkBOND COMPLY
Goods and ServicesSoftware as a service (SAAS) services featuring software for managing post-issuance compliance for municipal bonds, including continuing disclosure, arbitrage rebate, covenants, and recordkeeping

Classification Information

International Class042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
US Class Codes100, 101
Class Status Code6 - Active
Class Status DateMonday, May 11, 2026
Primary Code042
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History

Party NameCivicSpec LLC
Party Type10 - Original Applicant
Legal Entity Type16 - Limited Liability Company
AddressSan Clemente, CA 92672
US

Trademark Events

Event DateEvent Description
Monday, May 11, 2026NEW APPLICATION ENTERED
Monday, May 11, 2026APPLICATION FILING RECEIPT MAILED

Related Keywords

bondcomply software continuing including disclosure arbitrage recordkeeping covenants rebate bonds compliance